BRPI1007227A2 - método para o teste de placas de circuito - Google Patents

método para o teste de placas de circuito

Info

Publication number: BRPI1007227A2
Authority: BR; Brazil
Prior art keywords: circuit boards; testing circuit; testing; boards; circuit
Prior art date: 2009-01-14

Application number

BRPI1007227A

Other languages

English (en)

Inventor

Faulhaber Martin

Romanov Victor

Volpert Gilbert

Original Assignee

Dtg International Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-01-14

Filing date

2010-01-13

Publication date

2016-02-16

2010-01-13 Application filed by Dtg International Gmbh filed Critical Dtg International Gmbh

2016-02-16 Publication of BRPI1007227A2 publication Critical patent/BRPI1007227A2/pt

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
General Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Tests Of Electronic Circuits (AREA)

BRPI1007227A 2009-01-14 2010-01-13 método para o teste de placas de circuito BRPI1007227A2 (pt)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE102009004555A DE102009004555A1 (de)	2009-01-14	2009-01-14	Verfahren zum Prüfen von Leiterplatten
PCT/EP2010/050361 WO2010081834A1 (de)	2009-01-14	2010-01-13	Verfahren zum prüfen von leiterplatten

Publications (1)

Publication Number	Publication Date
BRPI1007227A2 true BRPI1007227A2 (pt)	2016-02-16

Family

ID=42109863

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI1007227A BRPI1007227A2 (pt)	2009-01-14	2010-01-13	método para o teste de placas de circuito

Country Status (9)

Country	Link
US (1)	US20110273203A1 (pt)
EP (1)	EP2376930A1 (pt)
JP (1)	JP2012515339A (pt)
KR (1)	KR101337911B1 (pt)
CN (1)	CN102282475A (pt)
BR (1)	BRPI1007227A2 (pt)
DE (1)	DE102009004555A1 (pt)
TW (1)	TW201037328A (pt)
WO (1)	WO2010081834A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102011056371B4 (de)	2011-12-13	2014-01-09	abele rößler technologies GmbH	Vorrichtung zur Überprüfung von Leiterstrukturen
CN103267908A (zh) *	2013-04-22	2013-08-28	高德（无锡）电子有限公司	一种双排版印刷线路板的测试工艺
CN103344905B (zh) *	2013-06-18	2016-02-10	大族激光科技产业集团股份有限公司	运动针床测试机及测试方法
US9274166B2 (en)	2013-08-26	2016-03-01	Fujitsu Limited	Pin verification device and method
CN114660435A (zh) *	2013-10-12	2022-06-24	深圳市爱德特科技有限公司	一种基于fpga的测试装置
CN105161037B (zh) *	2015-08-20	2017-12-22	京东方科技集团股份有限公司	位置校准方法、测试电路板、样本面板和位置校准装置
CN105425094B (zh) *	2015-11-24	2018-04-27	深圳怡化电脑股份有限公司	一种pcba短路点检测方法及装置
CN106872878A (zh) *	2017-02-21	2017-06-20	济南浪潮高新科技投资发展有限公司	一种pcb中自动检测电气连接的方法及系统
CN109917270A (zh) *	2019-01-31	2019-06-21	国核自仪系统工程有限公司	仪控系统的板卡的测试数据的分析装置、方法及仪控系统
US11818842B1 (en) *	2020-03-06	2023-11-14	Amazon Technologies, Inc.	Configurable circuit board for abstracting third-party controls
CN111707921B (zh) *	2020-07-23	2024-08-27	苏州朗之睿电子科技有限公司	一种测试精准的半导体器件用测试座
CN113325295B (zh) *	2021-05-13	2022-07-19	江苏普诺威电子股份有限公司	平面埋容基板微短路的可靠性测试方法
CN113539349B (zh) *	2021-07-23	2024-05-28	曙光信息产业股份有限公司	一种测试基板、llcr测量方法及测试基板测试方法
CN117076991B (zh) *	2023-10-16	2024-01-02	云境商务智能研究院南京有限公司	治污设备用电异常监测方法、装置及计算机设备

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3564408A (en)	1968-08-12	1971-02-16	Bendix Corp	Test device for an electrical circuit card
DE3013215A1 (de)	1980-04-03	1981-10-15	Luther & Maelzer Gmbh, 3050 Wunstorf	Adapter fuer ein selbstprogrammierbares leiterplattenpruefgeraet
DE3249770C2 (en)	1982-11-05	1987-11-12	Martin Maelzer	Device for testing electrical circuit boards
DE3340180C1 (de)	1983-11-07	1985-05-15	MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH	Kontaktfeldanordnung fuer ein rechnergesteuertes Leiterplattenpruefgeraet
JPS63124969A (ja)	1986-11-14	1988-05-28	Kyoei Sangyo Kk	プリント配線板検査機用オフグリツドアダプタ
GB8700754D0 (en) *	1987-01-14	1987-02-18	Int Computers Ltd	Test apparatus for printed circuit boards
DE8806064U1 (de)	1988-05-06	1989-09-07	atg electronic GmbH, 6980 Wertheim	Testgerät
JPH0299200A (ja)	1988-10-06	1990-04-11	Fujita Corp	汚泥の嫌気性消化法
DE4012839B4 (de)	1989-04-26	2004-02-26	Atg Test Systems Gmbh & Co.Kg	Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen
US5408189A (en)	1990-05-25	1995-04-18	Everett Charles Technologies, Inc.	Test fixture alignment system for printed circuit boards
JPH0438480A (ja)	1990-06-03	1992-02-07	Kyoei Sangyo Kk	プリント配線板検査機用アダプタ上下タイプ
JPH0454468A (ja) *	1990-06-25	1992-02-21	Hitachi Electron Eng Co Ltd	セラミック配線基板の導通／絶縁検査装置
EP0468153B1 (de)	1990-07-25	1995-10-11	atg test systems GmbH	Kontaktierungsvorrichtung für Prüfzwecke
US5204615A (en) *	1991-10-24	1993-04-20	Interconnect Devices, Inc.	Module attachment for printed circuit board test fixtures
JP2720688B2 (ja)	1992-01-31	1998-03-04	ジェイエスアール株式会社	回路基板の検査方法
DE4406538A1 (de)	1994-02-28	1995-08-31	Mania Gmbh	Leiterplatten-Prüfeinrichtung mit Prüfadapter und Verfahren zum Einstellen desselben
WO1995032432A1 (de)	1994-05-20	1995-11-30	Luther & Maelzer Gmbh	System und verfahren zum prüfen der korrekten position einer kontaktinseln und leiterbahnen aufweisenden leiterplatte in einer prüfvorrichtung
IT1282827B1 (it) *	1995-09-22	1998-03-31	New System Srl	Macchina per il controllo contrapposto dei circuiti stampati
NZ315085A (en)	1995-12-22	2007-12-21	New System Srl	Testing printed circuit boards, two coplanar boards containing test needles movable with respect to each other
US5818248A (en) *	1996-07-29	1998-10-06	Delaware Capital Formation, Inc	Loaded board test fixture with integral translator fixture for testing closely spaced test sites
DE29616272U1 (de)	1996-09-18	1998-01-29	atg test systems GmbH, 97877 Wertheim	Adapter zum Prüfen von elektrischen Leiterplatten
DE19718637A1 (de)	1997-05-02	1998-11-05	Atg Test Systems Gmbh	Vorrichtung und Verfahren zum Prüfen von Leiterplatten
DE19700505A1 (de)	1997-01-09	1998-07-16	Atg Test Systems Gmbh	Verfahren zum Prüfen von Leiterplatten
IT1290345B1 (it)	1997-02-18	1998-10-22	Circuit Line Spa	Metodo e dispositivo per la correzione dell'errore di allineamento fra aghi di test e punti di test nella fase di test elettrico di
IT1291643B1 (it)	1997-04-22	1999-01-19	Circuit Line Spa	Metodo di regolazione automatica per l'eliminazione dell'errore di centraggio in fase di test elettrico di circuiti stampati
GB9722998D0 (en)	1997-11-01	1998-01-07	Matrix Test Limited	A contacting device
JPH11160380A (ja) *	1997-11-27	1999-06-18	Fujitsu Ltd	回路基板の試験用ヘッドおよび回路基板の試験方法
DE19847146A1 (de)	1998-10-13	2000-05-04	Test Plus Electronic Gmbh	Testadapter
US6191600B1 (en)	1999-01-22	2001-02-20	Delaware Capital Formation, Inc.	Scan test apparatus for continuity testing of bare printed circuit boards
JP2001074814A (ja) *	1999-09-07	2001-03-23	Sony Corp	回路基板検査装置
DE19943388B4 (de)	1999-09-10	2010-04-08	Atg Luther & Maelzer Gmbh	Vorrichtung zum Prüfen von Leiterplatten
DE19957286A1 (de) *	1999-11-29	2001-07-05	Atg Test Systems Gmbh	Verfahren und Vorrichtung zum Testen von Leiterplatten
DE60139584D1 (de) *	2000-06-16	2009-09-24	Nhk Spring Co Ltd	Mikrokontaktprüfnadel und elektrischer Messfühler
DE10043728C2 (de) *	2000-09-05	2003-12-04	Atg Test Systems Gmbh	Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
DE10049301A1 (de)	2000-10-04	2002-05-02	Atg Test Systems Gmbh	Modul für eine Prüfvorrichtung zum Testen von Leiterplatten
US6788078B2 (en)	2001-11-16	2004-09-07	Delaware Capital Formation, Inc.	Apparatus for scan testing printed circuit boards
GB2383263B (en)	2001-11-17	2005-11-16	Medi Plinth Healthcare Group L	Bed
DE10160119A1 (de) *	2001-12-07	2003-10-02	Atg Test Systems Gmbh	Prüfsonde für einen Fingertester
US20030197514A1 (en) *	2002-04-22	2003-10-23	Howard Hsu	System and method for testing a printed circuit board by employing a ceramic substrate with micro-probes formed on the ceramic substrate
JP2007304008A (ja) *	2006-05-12	2007-11-22	Nidec-Read Corp	基板検査用接触子、基板検査用治具及び基板検査装置
DE102006059429A1 (de) *	2006-12-15	2008-06-26	Atg Luther & Maelzer Gmbh	Modul für eine Prüfvorrichtung zum Testen von Leiterplatten

2009
- 2009-01-14 DE DE102009004555A patent/DE102009004555A1/de not_active Withdrawn
2010
- 2010-01-13 JP JP2011545728A patent/JP2012515339A/ja not_active Ceased
- 2010-01-13 KR KR1020117018558A patent/KR101337911B1/ko not_active Expired - Fee Related
- 2010-01-13 EP EP10700178A patent/EP2376930A1/de not_active Withdrawn
- 2010-01-13 CN CN2010800046433A patent/CN102282475A/zh active Pending
- 2010-01-13 US US13/143,697 patent/US20110273203A1/en not_active Abandoned
- 2010-01-13 WO PCT/EP2010/050361 patent/WO2010081834A1/de not_active Ceased
- 2010-01-13 BR BRPI1007227A patent/BRPI1007227A2/pt not_active IP Right Cessation
- 2010-01-14 TW TW099100968A patent/TW201037328A/zh unknown

Also Published As

Publication number	Publication date
CN102282475A (zh)	2011-12-14
JP2012515339A (ja)	2012-07-05
KR20110112836A (ko)	2011-10-13
DE102009004555A1 (de)	2010-09-30
WO2010081834A1 (de)	2010-07-22
KR101337911B1 (ko)	2013-12-09
EP2376930A1 (de)	2011-10-19
TW201037328A (en)	2010-10-16
US20110273203A1 (en)	2011-11-10

Publication	Publication Date	Title
BRPI1007227A2 (pt)	2016-02-16	método para o teste de placas de circuito
IL259567A (en)	2018-07-31	System and method for inspecting a substrate
DK3514519T3 (da)	2022-05-16	Testkassetter
FI20080182A0 (fi)	2008-03-04	Mittausmenetelmä ja -laite
IL215874A (en)	2016-09-29	Inspection method for lithography
BRPI1011378A2 (pt)	2017-10-24	método para autenticar acesso a um circuito integrado protegido por um dispositivo de teste
AT506816B1 (de)	2009-12-15	Vlf-prüfgenerator
GB0811307D0 (en)	2008-07-30	Test apparatus
EP2320719A4 (en)	2013-09-25	SEALING STRUCTURE FOR ELECTRONIC EQUIPMENT
BRPI0921173A2 (pt)	2016-02-23	metodo e dispositivo para medicao de distancia
BRPI1015922A2 (pt)	2016-04-26	sistemas e métodos para testar analitos
AT10812U2 (de)	2009-10-15	Prüfstandsanordnung
AT10813U2 (de)	2009-10-15	Prüfstandsanordnung
DK2244628T3 (da)	2019-09-09	Patientdata-sensorapparat
BR112012020847A2 (pt)	2019-09-24	instrumento e método para detectar descarga elétricas parciais
EP2242989A4 (en)	2013-09-18	DEVICE FOR ENHANCED EXPLOSION METHOD
GB0804764D0 (en)	2008-04-16	Test apparatus
BRPI1006174A2 (pt)	2016-02-23	metodo de teste e dispositivo de teste
BRPI1014042A2 (pt)	2016-04-12	unidade de contato para um aparelho de teste, para testar placas de circuito impresso
DK2252890T3 (da)	2014-10-13	Fremgangsmåde og anordning til påvisning af kulhydrater
FI20096141A0 (fi)	2009-11-05	Lämpötilan mittausmenetelmä
FI20085525L (fi)	2009-12-01	Menetelmä ja laitteisto mittauksia varten
BR112012020848A2 (pt)	2018-07-17	instrumento e método para detectar descargas elétricas parciais
FI20085283A7 (fi)	2009-10-04	Menetelmä kaasujen mittaamiseksi
BR112013011545A2 (pt)	2017-10-24	método para medir posição de componente

Legal Events

Date	Code	Title	Description
2016-06-07	B08F	Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]	Free format text: REFERENTE AS 5A E 6A ANUIDADES.
2016-09-27	B08K	Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]	Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2370 DE 07-06-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.