[go: up one dir, main page]

BRPI0920880A2 - método de adesão, estrutura de adesão, método de fabricação de módulo óptico e módulo óptico. - Google Patents

método de adesão, estrutura de adesão, método de fabricação de módulo óptico e módulo óptico.

Info

Publication number
BRPI0920880A2
BRPI0920880A2 BRPI0920880A BRPI0920880A BRPI0920880A2 BR PI0920880 A2 BRPI0920880 A2 BR PI0920880A2 BR PI0920880 A BRPI0920880 A BR PI0920880A BR PI0920880 A BRPI0920880 A BR PI0920880A BR PI0920880 A2 BRPI0920880 A2 BR PI0920880A2
Authority
BR
Brazil
Prior art keywords
optical module
adhesion
manufacturing
module manufacturing
adhesion structure
Prior art date
Application number
BRPI0920880A
Other languages
English (en)
Inventor
Kazunari Komai
Makoto Kasuya
Motoharu Okuno
Takamasa Kameda
Tsuyoshi Miyata
Yuki Ushiro
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of BRPI0920880A2 publication Critical patent/BRPI0920880A2/pt
Publication of BRPI0920880B1 publication Critical patent/BRPI0920880B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/71—Resistive to light or to UV
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00—Optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Light Receiving Elements (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
BRPI0920880-1A 2008-10-16 2009-10-14 Método de fabricação de um módulo óptico e módulo óptico BRPI0920880B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-267736 2008-10-16
JP2008267736A JP2010095633A (ja) 2008-10-16 2008-10-16 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
PCT/JP2009/067757 WO2010044408A1 (ja) 2008-10-16 2009-10-14 接着方法、接着構造、光学モジュールの製造方法および光学モジュール

Publications (2)

Publication Number Publication Date
BRPI0920880A2 true BRPI0920880A2 (pt) 2015-12-22
BRPI0920880B1 BRPI0920880B1 (pt) 2019-04-24

Family

ID=42106571

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0920880-1A BRPI0920880B1 (pt) 2008-10-16 2009-10-14 Método de fabricação de um módulo óptico e módulo óptico

Country Status (7)

Country Link
US (1) US8575636B2 (pt)
EP (1) EP2360218B1 (pt)
JP (1) JP2010095633A (pt)
KR (1) KR101276504B1 (pt)
CN (1) CN102186937B (pt)
BR (1) BRPI0920880B1 (pt)
WO (1) WO2010044408A1 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171436A (ja) * 2010-02-17 2011-09-01 Tdk Corp 電子部品内蔵モジュール及び電子部品内蔵モジュールの製造方法
JP5246249B2 (ja) * 2010-12-07 2013-07-24 オムロン株式会社 接着方法、接着構造、光学モジュールの製造方法および光学モジュール
JP2012227436A (ja) * 2011-04-21 2012-11-15 Denso Corp 半導体装置の製造方法及び半導体装置
TWM428490U (en) * 2011-09-27 2012-05-01 Lingsen Precision Ind Ltd Optical module packaging unit
US8944659B2 (en) * 2012-02-21 2015-02-03 Apple Inc. Methods for assembling electronic devices using embedded light guide structures
JP6285788B2 (ja) * 2013-04-16 2018-02-28 積水化学工業株式会社 光硬化性導電材料、接続構造体の製造方法及び接続構造体
DE102013104503A1 (de) * 2013-05-02 2014-11-06 Vorwerk & Co. Interholding Gmbh Verfahren zum Verkleben eines ersten Klebepartners mit einem zweiten Klebepartner sowie Klebepartner oder Messerlager
CN104210218B (zh) * 2013-05-31 2016-08-24 盟立自动化股份有限公司 基板粘合方法
US9753190B2 (en) * 2013-08-28 2017-09-05 Corning Incorporated Adhesive with embedded waveguides for curing
US20160096353A1 (en) * 2014-10-07 2016-04-07 The Boeing Company Structure including a light-curable adhesive and associated method for assembling and curing same
DE102015102012B4 (de) * 2015-02-12 2024-12-05 tooz technologies GmbH Optikelement, Anzeigevorrichtung sowie Verfahren zur Herstellung eines solchen Optikelements
JP6243368B2 (ja) 2015-02-27 2017-12-06 ファナック株式会社 エネルギー線硬化型接着剤により部品を接着する接着方法
DE102015008312A1 (de) * 2015-06-30 2017-01-05 Airbus Defence and Space GmbH Verfahren und Vorrichtung zum Reparieren von Bauteilen
JP6641588B2 (ja) * 2015-09-18 2020-02-05 セメダイン株式会社 接着方法
TWI739895B (zh) * 2017-08-25 2021-09-21 揚明光學股份有限公司 投影片及投影裝置
CN112781010A (zh) * 2019-11-05 2021-05-11 余姚煜昌电器有限公司 透光单元、工作灯以及应用
CN113109962A (zh) * 2021-04-19 2021-07-13 业成科技（成都）有限公司 一种显示模组及其制备方法、电子设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3231964B2 (ja) 1994-12-28 2001-11-26 シャープ株式会社 機能膜付き基板の製造方法
JPH1036777A (ja) * 1996-07-18 1998-02-10 Material Sci Kk 紫外線硬化樹脂による接着方法
JPH10143931A (ja) * 1996-11-12 1998-05-29 Toray Ind Inc 情報記録媒体およびその製造方法
JPH1153778A (ja) * 1997-08-07 1999-02-26 Matsushita Electric Ind Co Ltd 光ディスク装置の製造方法およびその製造装置
JPH11241055A (ja) 1998-02-24 1999-09-07 Nippon Kayaku Co Ltd 接着剤組成物、接着体、接着方法及び光ディスクの製造方法
JP3675635B2 (ja) * 1998-03-30 2005-07-27 松下電器産業株式会社 光ディスクの製造方法およびその製造装置
JP2000336321A (ja) * 1999-05-26 2000-12-05 Dainippon Ink & Chem Inc 貼り合わせ方法及び光ディスクの製造方法
JP2003033924A (ja) 2001-05-14 2003-02-04 Sekisui Chem Co Ltd 硬化体、貼り合わせ体の製造装置
JP2005135899A (ja) * 2003-10-06 2005-05-26 Omron Corp 面光源装置及び表示装置
JP4796273B2 (ja) 2003-12-25 2011-10-19 三菱樹脂株式会社 粘着フィルム・シートの製造方法
JP2006210297A (ja) * 2005-01-31 2006-08-10 Tdk Corp Ｅｌパネルの製造方法
JP2007060112A (ja) * 2005-08-23 2007-03-08 Fujinon Corp 固体撮像素子の取付構造
US20070091293A1 (en) * 2005-10-19 2007-04-26 Omron Corporation Photoelectric sensor, optical module and method of producing same
JP2007142371A (ja) * 2005-10-19 2007-06-07 Omron Corp 光学モジュール、光電センサおよび光学モジュールの製造方法
JP4013077B2 (ja) * 2005-11-21 2007-11-28 松下電工株式会社 発光装置およびその製造方法
JP2007287801A (ja) * 2006-04-13 2007-11-01 Sony Corp 電気・光混載三次元半導体モジュール及びハイブリット回路装置並びに携帯型電話機
US7518229B2 (en) * 2006-08-03 2009-04-14 International Business Machines Corporation Versatile Si-based packaging with integrated passive components for mmWave applications
JP2008151843A (ja) * 2006-12-14 2008-07-03 Omron Corp 光伝送用光学部品及びその製造方法
WO2008111504A1 (ja) * 2007-03-12 2008-09-18 Nichia Corporation 高出力発光装置及びそれに用いるパッケージ
JP5252337B2 (ja) * 2007-07-25 2013-07-31 Ｎｌｔテクノロジー株式会社 表示デバイス装置、液晶表示装置及びその製造方法並びに製造装置
JP2009044087A (ja) * 2007-08-10 2009-02-26 Sanyo Electric Co Ltd 発光装置
JP2009075365A (ja) * 2007-09-20 2009-04-09 Omron Corp 光配線、及び光伝送モジュール
US8049237B2 (en) * 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
JP4404141B2 (ja) * 2008-01-07 2010-01-27 オムロン株式会社 光伝送モジュールの基板を補強する補強部品を備えた光伝送モジュールおよび該光伝送モジュールを備えた電子機器
JP4404144B2 (ja) * 2008-01-15 2010-01-27 オムロン株式会社 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法

Also Published As

Publication number Publication date
JP2010095633A (ja) 2010-04-30
WO2010044408A1 (ja) 2010-04-22
CN102186937B (zh) 2015-11-25
BRPI0920880B1 (pt) 2019-04-24
US20110193125A1 (en) 2011-08-11
KR101276504B1 (ko) 2013-06-18
CN102186937A (zh) 2011-09-14
KR20110056322A (ko) 2011-05-26
EP2360218B1 (en) 2018-12-12
EP2360218A4 (en) 2012-07-04
US8575636B2 (en) 2013-11-05
EP2360218A1 (en) 2011-08-24

Similar Documents

Publication Publication Date Title
BRPI0920880A2 (pt) método de adesão, estrutura de adesão, método de fabricação de módulo óptico e módulo óptico.
BRPI0919506A2 (pt) inflador, método de fabricação do mesmo e módulo incluindo um inflador
BRPI0911767A2 (pt) Processo, e, composto.
BRPI0903890A2 (pt) Módulo de câmera.
BRPI0814466A2 (pt) Método.
BRPI0902894A2 (pt) Módulo de câmera.
BRPI0814467A2 (pt) Método, e, biocombustível
BRPI0919699A2 (pt) conjunto de almofada, e, método de fabricação de um conjunto de almofada.
BRPI0915433A2 (pt) método, e, dispositivo.
EP2286902A4 (en) DISCONNECTING MEMBRANE, PRODUCTION METHOD THEREFOR AND DISCONNECTING MEMBRANE MODULE USING THE DISCONNECTED MEMBRANE
BRPI0913465A2 (pt) método do conjunto do módulo fotovoltaico monolítico
NO2021006I1 (no) Quofenix, delafloksacin
BRPI0917120A2 (pt) método, e, meio legível por computador.
BRPI0913227A2 (pt) método, e objeto
NL1034256A1 (nl) Spectroscopiesysteem.
BRPI0818315A (pt) estrutura de torre e método de montagem.
NL2003118A1 (nl) Alignment system, lithographic system and method.
BRPI0909650A2 (pt) substrato transparente, utilização do substrato, módulo solar e processo de obtenção do substrato.
BRPI0910844A2 (pt) conjunto de lâmpada.
BRPI0913112A2 (pt) fluxímetro, e, método.
BRPI1015915A2 (pt) dispositivo para fabricação de vidro laminado e método de fabricação de vidro laminado.
BRPI0914221A2 (pt) processo, e, composto
FI20085735L (fi) Menetelmä linssimoduulin valmistamiseksi ja menetelmällä valmistettu linssi
BRPI0922070A2 (pt) turbina.
BRPI0914584A2 (pt) Método, e, composição herbicida.

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 14/10/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 14/10/2009, OBSERVADAS AS CONDICOES LEGAIS