BRPI0819933A2 - método, e, dispositivo - Google Patents
método, e, dispositivoInfo
- Publication number
- BRPI0819933A2 BRPI0819933A2 BRPI0819933-7A BRPI0819933A BRPI0819933A2 BR PI0819933 A2 BRPI0819933 A2 BR PI0819933A2 BR PI0819933 A BRPI0819933 A BR PI0819933A BR PI0819933 A2 BRPI0819933 A2 BR PI0819933A2
- Authority
- BR
- Brazil
- Prior art keywords
- semiconductor structure
- contacts
- less
- type region
- algainp light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
Landscapes
- Led Devices (AREA)
Abstract
método, e, dispositivo é descrito um dispositivo emissor de luz algainp que é formado como um dispositivo de chip articulado fino. o dispositivo inclui uma estrutura semicondutora compreendendo uma camada de emissão de luz algainp (24) disposta entre uma região tipo n (22) e uma região tipo p (26). contatos n e p (34, 32) eletricamente conectados nas regiões tipo n e p são ambos formados no mesmo lado da estrutura semicondutora. a estrutura semi condutora é conectada no apoio ( 40) via os contatos. o substrato de crescimento é removido da estrutura semi condutora e o substrato transparente espesso é omitido, de maneira tal que a espessura total das camadas semicondutoras no dispositivo seja menor que 15 mim em algumas modalidades, menor que 1 o mim em algumas modalidades. o lado superior da estrutura semicondutora pode ser texturizado.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/956,984 US20090173956A1 (en) | 2007-12-14 | 2007-12-14 | Contact for a semiconductor light emitting device |
| US11/956984 | 2007-12-14 | ||
| PCT/IB2008/055315 WO2009077974A2 (en) | 2007-12-14 | 2008-12-15 | Contact for a semiconductor light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0819933A2 true BRPI0819933A2 (pt) | 2019-02-26 |
Family
ID=40404263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0819933-7A BRPI0819933A2 (pt) | 2007-12-14 | 2008-12-15 | método, e, dispositivo |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US20090173956A1 (pt) |
| EP (1) | EP2220695A2 (pt) |
| JP (1) | JP5496104B2 (pt) |
| KR (2) | KR101677770B1 (pt) |
| CN (1) | CN101897048B (pt) |
| BR (1) | BRPI0819933A2 (pt) |
| RU (1) | RU2491683C2 (pt) |
| TW (2) | TWI528577B (pt) |
| WO (1) | WO2009077974A2 (pt) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090173956A1 (en) * | 2007-12-14 | 2009-07-09 | Philips Lumileds Lighting Company, Llc | Contact for a semiconductor light emitting device |
| JP2010186808A (ja) * | 2009-02-10 | 2010-08-26 | Showa Denko Kk | 発光ダイオード及び発光ダイオードランプ |
| US7732231B1 (en) * | 2009-06-03 | 2010-06-08 | Philips Lumileds Lighting Company, Llc | Method of forming a dielectric layer on a semiconductor light emitting device |
| US20100327300A1 (en) * | 2009-06-25 | 2010-12-30 | Koninklijke Philips Electronics N.V. | Contact for a semiconductor light emitting device |
| DE102009051746A1 (de) * | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| JP2011165799A (ja) * | 2010-02-08 | 2011-08-25 | Showa Denko Kk | フリップチップ型発光ダイオード及びその製造方法、並びに発光ダイオードランプ |
| JP5693375B2 (ja) * | 2010-05-28 | 2015-04-01 | シチズンホールディングス株式会社 | 半導体発光素子 |
| KR101194844B1 (ko) * | 2010-11-15 | 2012-10-25 | 삼성전자주식회사 | 발광소자 및 그 제조방법 |
| DE102011012924A1 (de) | 2011-03-03 | 2012-09-06 | Osram Opto Semiconductors Gmbh | Träger für eine optoelektronische Struktur und optoelektronischer Halbleiterchip mit solch einem Träger |
| US10074778B2 (en) * | 2011-03-22 | 2018-09-11 | Seoul Viosys Co., Ltd. | Light emitting diode package and method for manufacturing the same |
| BR112013029686A2 (pt) * | 2011-05-24 | 2017-01-17 | Koninkl Philips Nv | estrutura de flip chip de diodo emissor de luz e método de formação de uma estrutura de flip chip de diodo emissor de luz |
| JP5887638B2 (ja) | 2011-05-30 | 2016-03-16 | 億光電子工業股▲ふん▼有限公司Everlight Electronics Co.,Ltd. | 発光ダイオード |
| KR101939333B1 (ko) * | 2011-10-07 | 2019-01-16 | 서울바이오시스 주식회사 | 발광 다이오드 패키지 |
| CN103022334B (zh) * | 2012-12-21 | 2016-01-13 | 映瑞光电科技(上海)有限公司 | 一种高压倒装led芯片及其制造方法 |
| JP6306308B2 (ja) * | 2013-09-19 | 2018-04-04 | 株式会社東芝 | 半導体発光装置 |
| US10361531B2 (en) * | 2014-02-25 | 2019-07-23 | Philips Photonics Gmbh | Light emitting semiconductor devices with getter layer |
| JP6462274B2 (ja) * | 2014-08-21 | 2019-01-30 | 株式会社東芝 | 半導体発光素子 |
| KR102376468B1 (ko) | 2014-12-23 | 2022-03-21 | 엘지이노텍 주식회사 | 적색 발광소자 및 조명장치 |
| US12364074B2 (en) | 2015-03-31 | 2025-07-15 | Creeled, Inc. | Light emitting diodes and methods |
| US12294042B2 (en) * | 2015-03-31 | 2025-05-06 | Creeled, Inc. | Light emitting diodes and methods with encapsulation |
| CN105489732B (zh) * | 2015-12-08 | 2017-12-22 | 天津三安光电有限公司 | 垂直发光二极管的制作方法 |
| CN114256392A (zh) * | 2015-12-24 | 2022-03-29 | 维耶尔公司 | 竖直固态器件 |
| US10615311B2 (en) | 2016-04-22 | 2020-04-07 | Lg Innotek Co., Ltd. | Light emitting device and display comprising same |
| US10847553B2 (en) * | 2017-01-13 | 2020-11-24 | Massachusetts Institute Of Technology | Method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display |
| JP2019071323A (ja) * | 2017-10-06 | 2019-05-09 | 鼎元光電科技股▲ふん▼有限公司 | 基板がない発光ダイオード及びその製造方法 |
| CN109671810A (zh) * | 2017-10-16 | 2019-04-23 | 鼎元光电科技股份有限公司 | 无衬底的发光二极管及其制造方法 |
| CN109638132A (zh) * | 2018-11-30 | 2019-04-16 | 广东德力光电有限公司 | 倒装红光led芯片结构及其制备方法 |
| CN110767781A (zh) * | 2019-11-18 | 2020-02-07 | 国网安徽省电力有限公司南陵县供电公司 | 一种高亮度发光二极管及其制造方法 |
| CN111540817A (zh) * | 2020-05-19 | 2020-08-14 | 錼创显示科技股份有限公司 | 微型发光二极管芯片 |
| TWI750664B (zh) | 2020-05-19 | 2021-12-21 | 錼創顯示科技股份有限公司 | 微型發光二極體晶片 |
| US12201874B2 (en) * | 2021-10-05 | 2025-01-21 | Karsten Manufacturing Corporation | Systems and methods for predicting ball flight data to create a consistently gapped golf club set |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315709A (ja) * | 1992-05-11 | 1993-11-26 | Omron Corp | 半導体発光素子及び当該半導体発光素子を用いた光学装置 |
| JPH07162034A (ja) * | 1993-12-08 | 1995-06-23 | Daido Steel Co Ltd | 発光ダイオードおよびその製造方法 |
| US5917202A (en) * | 1995-12-21 | 1999-06-29 | Hewlett-Packard Company | Highly reflective contacts for light emitting semiconductor devices |
| US6229160B1 (en) * | 1997-06-03 | 2001-05-08 | Lumileds Lighting, U.S., Llc | Light extraction from a semiconductor light-emitting device via chip shaping |
| US6784463B2 (en) * | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
| EP0905797B1 (de) * | 1997-09-29 | 2010-02-10 | OSRAM Opto Semiconductors GmbH | Halbleiterlichtquelle und Verfahren zu ihrer Herstellung |
| JP3181262B2 (ja) * | 1998-06-04 | 2001-07-03 | スタンレー電気株式会社 | 平面実装型led素子およびその製造方法 |
| US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| JP2001044502A (ja) * | 1999-07-28 | 2001-02-16 | Matsushita Electronics Industry Corp | 複合発光素子及びその製造方法 |
| JP2001168385A (ja) * | 1999-12-06 | 2001-06-22 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子及びiii族窒化物系化合物半導体発光素子 |
| US6514782B1 (en) * | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
| TWI289944B (en) * | 2000-05-26 | 2007-11-11 | Osram Opto Semiconductors Gmbh | Light-emitting-diode-element with a light-emitting-diode-chip |
| TW456058B (en) * | 2000-08-10 | 2001-09-21 | United Epitaxy Co Ltd | Light emitting diode and the manufacturing method thereof |
| JP2002238486A (ja) | 2001-02-21 | 2002-08-27 | Ndc Kk | 豆腐製造装置 |
| US6555405B2 (en) * | 2001-03-22 | 2003-04-29 | Uni Light Technology, Inc. | Method for forming a semiconductor device having a metal substrate |
| US6746948B2 (en) * | 2001-09-17 | 2004-06-08 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating semiconductor light-emitting device |
| US7179731B2 (en) * | 2002-01-22 | 2007-02-20 | Eric Harmon | Hypercontacting |
| JP2003243308A (ja) * | 2002-02-13 | 2003-08-29 | Hitachi Cable Ltd | 半導体装置の製造方法 |
| RU2212734C1 (ru) * | 2002-07-10 | 2003-09-20 | Закрытое Акционерное Общество "Светлана - Оптоэлектроника" | Полупроводниковый источник света |
| US20040227151A1 (en) * | 2003-03-31 | 2004-11-18 | Hitachi Cable, Ltd. | Light emitting diode |
| RU2231171C1 (ru) * | 2003-04-30 | 2004-06-20 | Закрытое акционерное общество "Инновационная фирма "ТЕТИС" | Светоизлучающий диод |
| RU2267188C2 (ru) * | 2003-06-23 | 2005-12-27 | Федорова Галина Владимировна | Светодиодное полупроводниковое устройство в корпусе для поверхностного монтажа |
| TWI223460B (en) | 2003-09-23 | 2004-11-01 | United Epitaxy Co Ltd | Light emitting diodes in series connection and method of making the same |
| CN100461561C (zh) * | 2004-01-07 | 2009-02-11 | 浜松光子学株式会社 | 半导体发光元件及其制造方法 |
| US7022550B2 (en) * | 2004-04-07 | 2006-04-04 | Gelcore Llc | Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes |
| US20050274970A1 (en) * | 2004-06-14 | 2005-12-15 | Lumileds Lighting U.S., Llc | Light emitting device with transparent substrate having backside vias |
| EP1761960A4 (en) * | 2004-06-24 | 2010-07-21 | Showa Denko Kk | REFLECTIVE POSITIVE ELECTRODE AND THIS USING LIGHT EMITTING SEMICONDUCTOR DEVICE FROM A GALLIUM NITRIDE COMPOUND |
| JP2006066449A (ja) | 2004-08-24 | 2006-03-09 | Toshiba Corp | 半導体発光素子 |
| US7274040B2 (en) * | 2004-10-06 | 2007-09-25 | Philips Lumileds Lighting Company, Llc | Contact and omnidirectional reflective mirror for flip chipped light emitting devices |
| TWI239668B (en) * | 2004-10-21 | 2005-09-11 | Formosa Epitaxy Inc | Structure of gallium-nitride based (GaN-based) light-emitting diode with high luminance |
| US7256483B2 (en) * | 2004-10-28 | 2007-08-14 | Philips Lumileds Lighting Company, Llc | Package-integrated thin film LED |
| CN1330011C (zh) * | 2004-12-17 | 2007-08-01 | 北京工业大学 | 低接触电阻、低光吸收、全角高反射的led电极 |
| US7244630B2 (en) * | 2005-04-05 | 2007-07-17 | Philips Lumileds Lighting Company, Llc | A1InGaP LED having reduced temperature dependence |
| US7736945B2 (en) * | 2005-06-09 | 2010-06-15 | Philips Lumileds Lighting Company, Llc | LED assembly having maximum metal support for laser lift-off of growth substrate |
| JP2007096162A (ja) * | 2005-09-30 | 2007-04-12 | Hitachi Cable Ltd | 半導体発光素子 |
| US20070181905A1 (en) * | 2006-02-07 | 2007-08-09 | Hui-Heng Wang | Light emitting diode having enhanced side emitting capability |
| JP2007250896A (ja) * | 2006-03-16 | 2007-09-27 | Sumitomo Electric Ind Ltd | 半導体光素子 |
| WO2008044608A1 (fr) | 2006-10-06 | 2008-04-17 | Sumitomo Chemical Company, Limited | Procédé destiné à produire un polymère polaire et composé d'organosilicium |
| US20090173956A1 (en) * | 2007-12-14 | 2009-07-09 | Philips Lumileds Lighting Company, Llc | Contact for a semiconductor light emitting device |
-
2007
- 2007-12-14 US US11/956,984 patent/US20090173956A1/en not_active Abandoned
-
2008
- 2008-12-15 RU RU2010129073/28A patent/RU2491683C2/ru active
- 2008-12-15 TW TW097148862A patent/TWI528577B/zh active
- 2008-12-15 EP EP08862297A patent/EP2220695A2/en not_active Withdrawn
- 2008-12-15 CN CN2008801209182A patent/CN101897048B/zh active Active
- 2008-12-15 KR KR1020107015519A patent/KR101677770B1/ko active Active
- 2008-12-15 WO PCT/IB2008/055315 patent/WO2009077974A2/en not_active Ceased
- 2008-12-15 JP JP2010537595A patent/JP5496104B2/ja active Active
- 2008-12-15 KR KR1020157033843A patent/KR20150139630A/ko not_active Ceased
- 2008-12-15 TW TW104143887A patent/TW201624755A/zh unknown
- 2008-12-15 BR BRPI0819933-7A patent/BRPI0819933A2/pt active Search and Examination
-
2012
- 2012-03-19 US US13/423,625 patent/US8679869B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201624755A (zh) | 2016-07-01 |
| WO2009077974A3 (en) | 2009-08-13 |
| WO2009077974A2 (en) | 2009-06-25 |
| CN101897048B (zh) | 2012-09-05 |
| CN101897048A (zh) | 2010-11-24 |
| KR20150139630A (ko) | 2015-12-11 |
| TWI528577B (zh) | 2016-04-01 |
| US8679869B2 (en) | 2014-03-25 |
| RU2491683C2 (ru) | 2013-08-27 |
| KR101677770B1 (ko) | 2016-11-18 |
| TW200939546A (en) | 2009-09-16 |
| US20090173956A1 (en) | 2009-07-09 |
| KR20100099286A (ko) | 2010-09-10 |
| JP5496104B2 (ja) | 2014-05-21 |
| EP2220695A2 (en) | 2010-08-25 |
| JP2011507261A (ja) | 2011-03-03 |
| RU2010129073A (ru) | 2012-01-20 |
| US20120187372A1 (en) | 2012-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B25D | Requested change of name of applicant approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY, LLC (US) ; KONI |
|
| B25G | Requested change of headquarter approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY, LLC (US) ; KONI |
|
| B25D | Requested change of name of applicant approved |
Owner name: KONINKLIJKE PHILIPS N.V. (NL) ; LUMILEDS LLC (US) |
|
| B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
| B25A | Requested transfer of rights approved |
Owner name: LUMILEDS LLC (US) ; LUMILEDS HOLDING B.V. (NL) |
|
| B25A | Requested transfer of rights approved |
Owner name: LUMILEDS HOLDING B.V. (NL) |
|
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B11D | Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time | ||
| B350 | Update of information on the portal [chapter 15.35 patent gazette] |