BRPI0806533A2 - Dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor - Google Patents

Dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor

Info

Publication number: BRPI0806533A2
Authority: BR; Brazil
Prior art keywords: fixing; semiconductor; semiconductor assembly; assembly; fixing device
Prior art date: 2007-01-26

Application number

BRPI0806533-0A2A

Other languages

English (en)

Inventor

Oleg S Fishman

Satyen N Prabhu

Original Assignee

Inductotherm Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-01-26

Filing date

2008-01-24

Publication date

2014-04-22

2008-01-24 Application filed by Inductotherm Corp filed Critical Inductotherm Corp

2014-04-22 Publication of BRPI0806533A2 publication Critical patent/BRPI0806533A2/pt

2018-10-09 Publication of BRPI0806533B1 publication Critical patent/BRPI0806533B1/pt

Classifications

- H10P72/76—
- H10W72/00—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44966—Clasp, clip, support-clamp, or required component thereof having gripping member shifted by operator
- Y10T24/44974—Threaded cylindrical rod and mating cavity

BRPI0806533-0A 2007-01-26 2008-01-24 dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor BRPI0806533B1 (pt)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US88667207P	2007-01-26	2007-01-26
US60/886672		2007-01-26
PCT/US2008/051879 WO2008091987A2 (en)	2007-01-26	2008-01-24	Compression clamping of semiconductor components

Publications (2)

Publication Number	Publication Date
BRPI0806533A2 true BRPI0806533A2 (pt)	2014-04-22
BRPI0806533B1 BRPI0806533B1 (pt)	2018-10-09

Family

ID=39645156

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI0806533-0A BRPI0806533B1 (pt)	2007-01-26	2008-01-24	dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor

Country Status (7)

Country	Link
US (2)	US8134835B2 (pt)
EP (1)	EP2109885B1 (pt)
JP (1)	JP2010517308A (pt)
KR (1)	KR101360012B1 (pt)
AU (1)	AU2008207931B2 (pt)
BR (1)	BRPI0806533B1 (pt)
WO (1)	WO2008091987A2 (pt)

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* Cited by examiner, † Cited by third party
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DE202012007280U1 (de) *	2012-07-30	2012-09-26	Abb Technology Ag	Leistungshalbleiterspannstapel
US20150327395A1 (en) *	2014-05-09	2015-11-12	General Electric Company	Apparatus for securing an electronic component
WO2016000775A1 (de) *	2014-07-03	2016-01-07	Siemens Aktiengesellschaft	Spannverband mit federeinrichtung
USD768097S1 (en) *	2015-10-20	2016-10-04	LWE, Inc.	Insulator for press pack clamp
CN108311914A (zh) *	2018-04-09	2018-07-24	郑州佳泰机电科技有限公司	一种铣床加工用的零件压紧装置
US11107962B2 (en) *	2018-12-18	2021-08-31	Soulnano Limited	UV LED array with power interconnect and heat sink
JP7099385B2 (ja) *	2019-03-28	2022-07-12	株式会社デンソー	加圧部材
US12397362B2 (en) *	2021-07-01	2025-08-26	Mks Inc.	GaN clamp with uniform pressure
CN118858709B (zh) *	2024-09-25	2025-01-17	福建毫米电子有限公司	一种功率电子元件测试系统及测试方法

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FR1600561A (pt) *	1968-01-26	1970-07-27
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US3688159A (en) *	1970-10-28	1972-08-29	Cutler Hammer Inc	Compression mounted scr clamp with heat sink means
CH528817A (de) *	1971-03-11	1972-09-30	Bbc Brown Boveri & Cie	Halter für mindestens ein scheibenförmiges Halbleiterelement
CH558084A (de) *	1971-07-20	1975-01-15	Bbc Brown Boveri & Cie	Halter mit mindestens einem scheibenfoermigen halbleiterelement.
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US6014315A (en) *	1998-09-08	2000-01-11	Chip Coolers, Inc.	Heat sink assembly with multiple pressure capability
US6324073B1 (en) *	1998-12-22	2001-11-27	S&C Electric Co.	Clamping arrangement for compression-mounted power electronic devices
US6677673B1 (en) *	2000-10-27	2004-01-13	Varian Medical Systems, Inc.	Clamping assembly for high-voltage solid state devices
US6760223B2 (en) *	2002-10-30	2004-07-06	Nptest, Inc.	Apparatus and method for contacting device with delicate light-transparent pane
KR100562503B1 (ko) *	2003-07-07	2006-03-21	삼성전자주식회사	반도체 척의 수평을 측정하기 위한 장치

2008
- 2008-01-24 WO PCT/US2008/051879 patent/WO2008091987A2/en not_active Ceased
- 2008-01-24 KR KR1020097016550A patent/KR101360012B1/ko active Active
- 2008-01-24 US US12/019,066 patent/US8134835B2/en active Active
- 2008-01-24 BR BRPI0806533-0A patent/BRPI0806533B1/pt active IP Right Grant
- 2008-01-24 EP EP08728181.2A patent/EP2109885B1/en active Active
- 2008-01-24 AU AU2008207931A patent/AU2008207931B2/en active Active
- 2008-01-24 JP JP2009547412A patent/JP2010517308A/ja active Pending
2012
- 2012-03-09 US US13/416,429 patent/US9530750B2/en active Active

Also Published As

Publication number	Publication date
EP2109885A2 (en)	2009-10-21
BRPI0806533B1 (pt)	2018-10-09
JP2010517308A (ja)	2010-05-20
US9530750B2 (en)	2016-12-27
US20120192392A1 (en)	2012-08-02
KR101360012B1 (ko)	2014-02-11
EP2109885A4 (en)	2013-09-04
KR20090113283A (ko)	2009-10-29
WO2008091987A2 (en)	2008-07-31
WO2008091987A3 (en)	2008-10-16
US20080211157A1 (en)	2008-09-04
AU2008207931B2 (en)	2014-05-22
US8134835B2 (en)	2012-03-13
EP2109885B1 (en)	2016-05-04
AU2008207931A1 (en)	2008-07-31

Publication	Publication Date	Title
BRPI0806533A2 (pt)	2014-04-22	Dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor
DE602007013318D1 (de)	2011-05-05	Halbleiterbauelement
DE602008000468D1 (de)	2010-02-11	Halbleiterbauelement
DE602008002784D1 (de)	2010-11-11	Halbleiterbauelement
EP2259326A4 (en)	2011-09-14	SEMICONDUCTOR COMPONENT
EP2280416A4 (en)	2012-10-31	SEMICONDUCTOR COMPONENT
ITMI20070398A1 (it)	2008-09-02	Dispositivo di comando per bicicletta e bicicletta che lo comprende
EP2061075A4 (en)	2012-06-13	SEMICONDUCTOR DEVICE
EP2251901A4 (en)	2012-08-29	SEMICONDUCTOR COMPONENT
BRPI0905905A2 (pt)	2015-06-30	Dispositivos e métodos para o posicionamento aperfeiçoado de pads
DE602007004058D1 (de)	2010-02-11	Positionsbestimmungsvorrichtung
EP2341531A4 (en)	2012-05-16	SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD
EP2264756A4 (en)	2011-04-06	SEMICONDUCTOR COMPONENT
EP2219224A4 (en)	2010-11-17	SEMICONDUCTOR COMPONENT
BRPI0906022A2 (pt)	2015-06-30	Dispositivo funcional, e, método para fabricar um dispositivo funcional
DE602007002105D1 (de)	2009-10-08	Halbleiterbauelement
DE602007013972D1 (de)	2011-06-01	Halbleiterbauelement
EP2320458A4 (en)	2013-09-11	SEMICONDUCTOR COMPONENT
ITMI20070397A1 (it)	2008-09-02	Dispositivo di comando per bicicletta e bicicletta che lo comprende
BRPI0916070A2 (pt)	2015-11-10	substrato para um dispositivo óptico-eletrônico
BRPI0820225A2 (pt)	2015-06-16	Dispositivo semicondutor e dispositivo de monitor
EP2320466A4 (en)	2013-12-11	SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD FOR A SEMICONDUCTOR COMPONENT
BRPI0922400A2 (pt)	2015-12-15	dispositivo para fixação de dispositivos ortodônticos.
DE602007013325D1 (de)	2011-05-05	Halbleitervorrichtung und Herstellungsverfahren dafür
EP2224489A4 (en)	2011-01-05	SEMICONDUCTOR COMPONENT

Legal Events

Date	Code	Title	Description
2018-05-15	B07A	Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
2018-09-18	B09A	Decision: intention to grant [chapter 9.1 patent gazette]
2018-10-09	B16A	Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]	Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 09/10/2018, OBSERVADAS AS CONDICOES LEGAIS.