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BR9003622A - Dispositivo e processo para o avanco de estruturas suporte em forma de faixas,portadoras de uma pluralidade de esferas semi-condutores - Google Patents

Dispositivo e processo para o avanco de estruturas suporte em forma de faixas,portadoras de uma pluralidade de esferas semi-condutores

Info

Publication number
BR9003622A
BR9003622A BR909003622A BR9003622A BR9003622A BR 9003622 A BR9003622 A BR 9003622A BR 909003622 A BR909003622 A BR 909003622A BR 9003622 A BR9003622 A BR 9003622A BR 9003622 A BR9003622 A BR 9003622A
Authority
BR
Brazil
Prior art keywords
bands
semi
bearing
conductive spheres
structures support
Prior art date
Application number
BR909003622A
Other languages
English (en)
Inventor
Masahiro Ishizuka
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of BR9003622A publication Critical patent/BR9003622A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G25/00—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement
    • B65G25/02—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement the carrier or impeller having different forward and return paths of movement, e.g. walking beam conveyors
    • H10W95/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Specific Conveyance Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)
BR909003622A 1989-07-28 1990-07-26 Dispositivo e processo para o avanco de estruturas suporte em forma de faixas,portadoras de uma pluralidade de esferas semi-condutores BR9003622A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1194002A JP2635175B2 (ja) 1989-07-28 1989-07-28 半導体フレーム搬送装置及び搬送方法

Publications (1)

Publication Number Publication Date
BR9003622A true BR9003622A (pt) 1991-08-27

Family

ID=16317337

Family Applications (1)

Application Number Title Priority Date Filing Date
BR909003622A BR9003622A (pt) 1989-07-28 1990-07-26 Dispositivo e processo para o avanco de estruturas suporte em forma de faixas,portadoras de uma pluralidade de esferas semi-condutores

Country Status (5)

Country Link
US (1) US5082165A (pt)
JP (1) JP2635175B2 (pt)
KR (1) KR940000739B1 (pt)
BR (1) BR9003622A (pt)
FR (1) FR2650259B1 (pt)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264002A (en) * 1990-04-23 1993-11-23 Mitsubishi Danki Kabushiki Kaisha Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
US5322207A (en) * 1993-05-03 1994-06-21 Micron Semiconductor Inc. Method and apparatus for wire bonding semiconductor dice to a leadframe
US5350106A (en) 1993-05-07 1994-09-27 Micron Semiconductor, Inc. Semiconductor wire bonding method
US5813590A (en) 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
US5673845A (en) * 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
US5890644A (en) 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
JP3488035B2 (ja) * 1997-01-04 2004-01-19 株式会社新川 ボンディング装置
JP3264851B2 (ja) * 1997-01-24 2002-03-11 株式会社新川 ボンディング装置
KR100245794B1 (ko) * 1997-09-22 2000-03-02 윤종용 리드 프레임 이송장치 및 이를 구비한 와이어 본딩 장치
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6577019B1 (en) * 2000-01-21 2003-06-10 Micron Technology, Inc. Alignment and orientation features for a semiconductor package
JP4371347B2 (ja) * 2001-04-09 2009-11-25 株式会社ニフコ 安全機能付ロック装置及び乗物用収納装置
MXPA02007208A (es) * 2001-07-30 2003-02-06 Esec Trading Sa Dispositivo para el transporte y dotacion de substratos con chips semiconductores.
KR20040046949A (ko) * 2002-11-28 2004-06-05 엘지전자 주식회사 세탁기의 실밥채집 어셈블리
US6814277B2 (en) * 2002-12-16 2004-11-09 Lockheed Martin Lead frame substrate clamp and method
FR2886280B1 (fr) * 2005-05-30 2007-07-13 Vit Sa Convoyeur a pas de pelerin adapte a supporter des variations thermiques
FR2886279B1 (fr) * 2005-05-30 2007-07-13 Vit Sa Convoyeur a pas de pelerin a conduction thermique reduite
TWI385812B (zh) 2007-06-06 2013-02-11 茂迪股份有限公司 一種支撐裝置、基板傳送設備與其方法
EP2040290A1 (en) * 2007-09-21 2009-03-25 Motech Industries Inc. Supporting device, substrate transportation equipment and related method thereof
GB2473600B (en) * 2009-08-25 2013-09-25 Pillarhouse Int Ltd Quick-loading soldering apparatus
CN104310057B (zh) * 2014-09-19 2017-01-11 东莞市精铁机械有限公司 抓线装置
JP5878219B1 (ja) * 2014-10-09 2016-03-08 千住金属工業株式会社 はんだ付け装置
KR20160048301A (ko) * 2014-10-23 2016-05-04 삼성전자주식회사 본딩 장치 및 그를 포함하는 기판 제조 설비
CN105584842B (zh) * 2016-01-26 2017-10-10 浙江田中精机股份有限公司 凸轮旋转上料装置
CN108328316A (zh) * 2018-03-31 2018-07-27 广州明森科技股份有限公司 一种物料搬运装置
CN109607176A (zh) * 2019-01-15 2019-04-12 徐州重型机械有限公司 工件搬运装置
KR102634034B1 (ko) * 2019-04-05 2024-02-08 주식회사 디엠에스 기판처리장치
CN110654851B (zh) * 2019-08-26 2021-03-23 上海朋熙半导体有限公司 一种晶体二极管的步进夹运装置
CN111137678A (zh) * 2020-01-15 2020-05-12 江苏北人机器人系统股份有限公司 新能源汽车电池盒运输线
CN115043184B (zh) * 2022-06-23 2023-09-12 广东立迪智能科技有限公司 一种单侧电路板露出的背光模组包胶夹持移动设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698620A (en) * 1970-03-25 1972-10-17 Motorola Inc Apparatus for connecting lead portions of a lead frame to respective pads on a chip
DE3240860A1 (de) * 1982-11-05 1984-05-10 Hans 4320 Hattingen Schoen Zangenvorschubeinrichtung fuer bearbeitungsmaschinen, insbesondere stanzpressen oder dergleichen
JPS5991733U (ja) * 1982-12-09 1984-06-21 三洋電機株式会社 リ−ドフレ−ム送り装置
JPS6067308A (ja) * 1983-09-16 1985-04-17 Shinkawa Ltd リ−ドフレ−ムの移送装置
JPS6063935A (ja) * 1983-09-17 1985-04-12 Mitsubishi Electric Corp リ−ドフレ−ム送り装置
US4674670A (en) * 1984-08-13 1987-06-23 Hitachi, Ltd. Manufacturing apparatus
US4763827A (en) * 1984-08-13 1988-08-16 Hitachi, Ltd. Manufacturing method
JPS62122224A (ja) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp フレ−ムフイ−ダ−
JPS6317714A (ja) * 1986-07-07 1988-01-25 Hitachi Electronics Eng Co Ltd Ｉｃハンドラ用のｉｃ搬送装置
JPH069426B2 (ja) * 1986-08-25 1994-02-02 三菱電機株式会社 保護継電器の点検装置
JPS6357329A (ja) * 1986-08-27 1988-03-12 Mazda Motor Corp 車両の上部車体構造
JPS6356121A (ja) * 1986-08-27 1988-03-10 株式会社日立製作所 比率差動リレ−装置

Also Published As

Publication number Publication date
KR940000739B1 (ko) 1994-01-28
JP2635175B2 (ja) 1997-07-30
JPH0360132A (ja) 1991-03-15
FR2650259A1 (fr) 1991-02-01
KR910002685A (ko) 1991-02-26
FR2650259B1 (fr) 1993-10-08
US5082165A (en) 1992-01-21

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Legal Events

Date Code Title Description
FB19 Grant procedure suspended (art. 19)
FF Decision: intention to grant
KD Notifcation of receipt (letter patent)
FG Letter patent granted
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 26/07/2005