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BR8907045A - Capacitores de desacoplamento de baixa indutancio - Google Patents

Capacitores de desacoplamento de baixa indutancio

Info

Publication number
BR8907045A
BR8907045A BR898907045A BR8907045A BR8907045A BR 8907045 A BR8907045 A BR 8907045A BR 898907045 A BR898907045 A BR 898907045A BR 8907045 A BR8907045 A BR 8907045A BR 8907045 A BR8907045 A BR 8907045A
Authority
BR
Brazil
Prior art keywords
inductory
disconnection
capacitors
low
low inductory
Prior art date
Application number
BR898907045A
Other languages
English (en)
Inventor
Jorge M Hernandez
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of BR8907045A publication Critical patent/BR8907045A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H10W44/601—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
BR898907045A 1988-08-01 1989-07-24 Capacitores de desacoplamento de baixa indutancio BR8907045A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/226,602 US4853826A (en) 1988-08-01 1988-08-01 Low inductance decoupling capacitor
PCT/US1989/003177 WO1990001782A1 (en) 1988-08-01 1989-07-24 Low inductance decoupling capacitor

Publications (1)

Publication Number Publication Date
BR8907045A true BR8907045A (pt) 1991-01-02

Family

ID=22849594

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898907045A BR8907045A (pt) 1988-08-01 1989-07-24 Capacitores de desacoplamento de baixa indutancio

Country Status (5)

Country Link
US (1) US4853826A (pt)
EP (1) EP0381745A4 (pt)
JP (1) JPH03500835A (pt)
BR (1) BR8907045A (pt)
WO (1) WO1990001782A1 (pt)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916576A (en) * 1989-02-27 1990-04-10 Fmtt, Inc. Matrix capacitor
US5272590A (en) * 1990-02-12 1993-12-21 Hernandez Jorge M Integrated circuit package having an internal cavity for incorporating decoupling capacitor
US5309324A (en) * 1991-11-26 1994-05-03 Herandez Jorge M Device for interconnecting integrated circuit packages to circuit boards
US5422782A (en) * 1992-11-24 1995-06-06 Circuit Components Inc. Multiple resonant frequency decoupling capacitor
US5880925A (en) 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
JP2991175B2 (ja) 1997-11-10 1999-12-20 株式会社村田製作所 積層コンデンサ
US6266229B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6266228B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6292350B1 (en) 1997-11-10 2001-09-18 Murata Manufacturing, Co., Ltd Multilayer capacitor
US6549395B1 (en) 1997-11-14 2003-04-15 Murata Manufacturing Co., Ltd Multilayer capacitor
WO2000055875A1 (en) * 1999-03-16 2000-09-21 Maxwell Energy Products Low inductance four terminal capacitor lead frame
JP3476127B2 (ja) 1999-05-10 2003-12-10 株式会社村田製作所 積層コンデンサ
JP3548821B2 (ja) 1999-05-10 2004-07-28 株式会社村田製作所 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路
US6327134B1 (en) 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP3489729B2 (ja) 1999-11-19 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
US6404649B1 (en) * 2000-03-03 2002-06-11 Advanced Micro Devices, Inc. Printed circuit board assembly with improved bypass decoupling for BGA packages
US6418007B1 (en) * 2000-08-28 2002-07-09 Motorola, Inc. Trimmable chip stub
US6936917B2 (en) * 2001-09-26 2005-08-30 Molex Incorporated Power delivery connector for integrated circuits utilizing integrated capacitors
US7312402B2 (en) * 2002-10-11 2007-12-25 International Business Machines Corporation Method and apparatus for providing improved loop inductance of decoupling capacitors
US6950300B2 (en) * 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
US9510448B2 (en) 2014-08-29 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Maximizing surface area of surface mount contact pads of circuit board also having via contact pads
US11621129B2 (en) 2019-04-25 2023-04-04 KYOCERA AVX Components Corporation Low inductance component
US12148575B2 (en) 2019-04-25 2024-11-19 KYOCERA AVX Components Corporation Integrated component including a capacitor and discrete varistor
JP6954413B1 (ja) * 2020-06-29 2021-10-27 ダイキン工業株式会社 インバータ装置
CN112164891B (zh) * 2020-08-31 2023-05-23 西安朗普达通信科技有限公司 一种对消式去耦芯片

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
US4734818A (en) * 1985-01-22 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages

Also Published As

Publication number Publication date
JPH03500835A (ja) 1991-02-21
EP0381745A4 (en) 1991-01-30
US4853826A (en) 1989-08-01
WO1990001782A1 (en) 1990-02-22
EP0381745A1 (en) 1990-08-16

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Legal Events

Date Code Title Description
KD Notifcation of receipt (letter patent)
FA4 Application deemed withdrawn (art. 21(1))
B15K Others concerning applications: alteration of classification

Ipc: H01G 4/228 (2006.01), H01G 4/40 (2006.0