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USD692896S1 - Module - Google Patents

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Publication number
USD692896S1
USD692896S1 US29/406,462 US201129406462F USD692896S US D692896 S1 USD692896 S1 US D692896S1 US 201129406462 F US201129406462 F US 201129406462F US D692896 S USD692896 S US D692896S
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US
United States
Prior art keywords
module
view
ornamental design
mirror image
partial perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/406,462
Inventor
Rolf Nilsson
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ConnectBlue AB
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ConnectBlue AB
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Publication date
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Priority to US29/406,462 priority Critical patent/USD692896S1/en
Assigned to CONNECTBLUE AB reassignment CONNECTBLUE AB ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ROLF NILSSON
Application granted granted Critical
Publication of USD692896S1 publication Critical patent/USD692896S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a top view of my new design for a module;
FIG. 2 is a partial perspective view thereof.
FIG. 3 is a right side view thereof, the left side view being a mirror image thereof; and,
FIG. 4 is a front view thereof, the rear view being a mirror image thereof.

Claims (1)

    CLAIM
  1. I claim the ornamental design for a module, as shown and described.
US29/406,462 2011-11-15 2011-11-15 Module Active USD692896S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/406,462 USD692896S1 (en) 2011-11-15 2011-11-15 Module

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US29/406,462 USD692896S1 (en) 2011-11-15 2011-11-15 Module

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USD692896S1 true USD692896S1 (en) 2013-11-05

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US29/406,462 Active USD692896S1 (en) 2011-11-15 2011-11-15 Module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device

Citations (213)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2706742A (en) * 1950-10-14 1955-04-19 Sprague Electric Co Resin sealed elastomeric housing for electrical components
US3185947A (en) * 1959-11-16 1965-05-25 Arf Products Inductive module for electronic devices
US3357099A (en) * 1962-10-29 1967-12-12 North American Aviation Inc Providing plated through-hole connections with the plating resist extending to the hole edges
US3398232A (en) * 1965-10-19 1968-08-20 Amp Inc Circuit board with interconnected signal conductors and interconnected shielding conductors
US3747210A (en) * 1971-09-13 1973-07-24 Int Standard Electric Corp Method of producing terminal pins of a printed circuit board
US3760091A (en) * 1971-11-16 1973-09-18 Ibm Multilayer circuit board
US3887783A (en) * 1972-11-09 1975-06-03 Honeywell Bull Sa Devices for welding of integrated-circuit wafers
US3964087A (en) * 1975-05-15 1976-06-15 Interdyne Company Resistor network for integrated circuit
US4029531A (en) * 1976-03-29 1977-06-14 Rca Corporation Method of forming grooves in the [011] crystalline direction
US4074340A (en) * 1976-10-18 1978-02-14 Vitramon, Incorporated Trimmable monolithic capacitors
USD254687S (en) * 1979-01-25 1980-04-08 Mcdonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
US4223321A (en) * 1979-04-30 1980-09-16 The Mead Corporation Planar-faced electrode for ink jet printer and method of manufacture
US4288840A (en) * 1978-09-26 1981-09-08 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US4312026A (en) * 1979-04-11 1982-01-19 Tdk Electronics Co., Ltd. Chip ceramic capacitor
US4313157A (en) * 1978-09-26 1982-01-26 Draloric Electronic Gmbh Capacitive network
USD267094S (en) * 1979-04-12 1982-11-30 Sharp Corporation Magnetic card for microwave oven
US4400762A (en) * 1980-08-25 1983-08-23 Allen-Bradley Company Edge termination for an electrical circuit device
US4419714A (en) * 1982-04-02 1983-12-06 International Business Machines Corporation Low inductance ceramic capacitor and method for its making
US4430690A (en) * 1982-10-07 1984-02-07 International Business Machines Corporation Low inductance MLC capacitor with metal impregnation and solder bar contact
US4437141A (en) * 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
US4522449A (en) * 1979-08-07 1985-06-11 Hayward C Michael Matrix board
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4616655A (en) * 1984-01-20 1986-10-14 Cordis Corporation Implantable pulse generator having a single printed circuit board and a chip carrier
US4627533A (en) * 1984-10-29 1986-12-09 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
US4630171A (en) * 1983-11-22 1986-12-16 Eurofarad-Efd Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members
US4661884A (en) * 1986-03-10 1987-04-28 American Technical Ceramics Corp. Miniature, multiple layer, side mounting high frequency blocking capacitor
US4750246A (en) * 1984-10-29 1988-06-14 Hughes Aircraft Company Method of making compensated crystal oscillator
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
US4790894A (en) * 1987-02-19 1988-12-13 Hitachi Condenser Co., Ltd. Process for producing printed wiring board
USD299139S (en) * 1985-12-04 1988-12-27 Interlego Interface panel
US4821007A (en) * 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4852227A (en) * 1988-11-25 1989-08-01 Sprague Electric Company Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US4947286A (en) * 1988-08-11 1990-08-07 Murata Manufacturing Co., Ltd. Multilayer capacitor device
US4956694A (en) * 1988-11-04 1990-09-11 Dense-Pac Microsystems, Inc. Integrated circuit chip stacking
US4963843A (en) * 1988-10-31 1990-10-16 Motorola, Inc. Stripline filter with combline resonators
US4978639A (en) * 1989-01-10 1990-12-18 Avantek, Inc. Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
US5092035A (en) * 1990-09-10 1992-03-03 Codex Corporation Method of making printed circuit board assembly
US5126286A (en) * 1990-10-05 1992-06-30 Micron Technology, Inc. Method of manufacturing edge connected semiconductor die
US5138115A (en) * 1990-10-12 1992-08-11 Atmel Corporation Carrierles surface mounted integrated circuit die
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
US5206495A (en) * 1989-10-24 1993-04-27 Angewandte Digital Elektronik Gmbh Chip card
US5224021A (en) * 1989-10-20 1993-06-29 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
US5225969A (en) * 1989-12-15 1993-07-06 Tdk Corporation Multilayer hybrid circuit
US5239198A (en) * 1989-09-06 1993-08-24 Motorola, Inc. Overmolded semiconductor device having solder ball and edge lead connective structure
US5247423A (en) * 1992-05-26 1993-09-21 Motorola, Inc. Stacking three dimensional leadless multi-chip module and method for making the same
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure
US5293067A (en) * 1991-05-23 1994-03-08 Motorola, Inc. Integrated circuit chip carrier
US5309326A (en) * 1991-12-06 1994-05-03 Rohm Co., Ltd. Circuit module having stacked circuit boards
US5313096A (en) * 1992-03-16 1994-05-17 Dense-Pac Microsystems, Inc. IC chip package having chip attached to and wire bonded within an overlying substrate
USD350125S (en) * 1992-04-24 1994-08-30 Sento Krei Data containing rocket card
US5367430A (en) * 1992-10-21 1994-11-22 Presidio Components, Inc. Monolithic multiple capacitor
US5376778A (en) * 1992-02-26 1994-12-27 Angewandte Digital Electronik Gmbh Contact-free chip card for remote transmission
US5383095A (en) * 1993-10-29 1995-01-17 The Whitaker Corporation Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge
US5386087A (en) * 1992-02-17 1995-01-31 E. I. Du Pont De Nemours And Company Printed circuit board having U-shaped solder mask layer separating respective contacts
US5428885A (en) * 1989-01-14 1995-07-04 Tdk Corporation Method of making a multilayer hybrid circuit
US5434745A (en) * 1994-07-26 1995-07-18 White Microelectronics Div. Of Bowmar Instrument Corp. Stacked silicon die carrier assembly
US5471368A (en) * 1993-11-16 1995-11-28 International Business Machines Corporation Module having vertical peripheral edge connection
US5488765A (en) * 1992-07-27 1996-02-06 Murata Manufacturing Co., Ltd. Method of measuring characteristics of a multilayer electronic component
US5493769A (en) * 1993-08-05 1996-02-27 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component and measuring characteristics of same
US5502885A (en) * 1992-02-25 1996-04-02 Rohm Co., Ltd. Method of manfacturing a chip-type composite electronic part
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US5600101A (en) * 1994-07-21 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer electronic component and method of manufacturing the same
US5599413A (en) * 1992-11-25 1997-02-04 Matsushita Electric Industrial Co., Ltd. Method of producing a ceramic electronic device
US5621619A (en) * 1990-10-25 1997-04-15 Cts Corporation All ceramic surface mount sip and dip networks having spacers and solder barriers
US5635669A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
US5661420A (en) * 1995-03-08 1997-08-26 Etymotic Research, Inc. Mounting configuration for monolithic integrated circuit
US5714239A (en) * 1993-03-15 1998-02-03 Murata Manufacturing Co., Ltd. Composite component
US5729437A (en) * 1994-06-22 1998-03-17 Seiko Epson Corporation Electronic part including a thin body of molding resin
US5731709A (en) * 1996-01-26 1998-03-24 Motorola, Inc. Method for testing a ball grid array semiconductor device and a device for such testing
US5740010A (en) * 1992-10-21 1998-04-14 Devoe; Daniel F. Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
US5773812A (en) * 1994-02-08 1998-06-30 Angewandte Digital Elektronik Gmbh Chip card capable of both contact and contactless operation including a contact block
US5811799A (en) * 1997-07-31 1998-09-22 Wu; Liang-Chung Image sensor package having a wall with a sealed cover
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
US5841217A (en) * 1996-03-14 1998-11-24 Citizen Watch Co., Ltd. Surface mounting crystal unit
US5847930A (en) * 1995-10-13 1998-12-08 Hei, Inc. Edge terminals for electronic circuit modules
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5877561A (en) * 1995-07-28 1999-03-02 Lg Semicon Co., Ltd. Plate and column type semiconductor package having heat sink
US5917709A (en) * 1997-06-16 1999-06-29 Eastman Kodak Company Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
US5966052A (en) * 1997-04-09 1999-10-12 Murata Manufacturing Co., Ltd. Voltage-controlled oscillator with input and output on opposite corners of substrate
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US5979048A (en) * 1995-06-21 1999-11-09 Polyplastics, Co., Inc. Method of manufacturing connectors
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
US6046409A (en) * 1997-02-26 2000-04-04 Ngk Spark Plug Co., Ltd. Multilayer microelectronic circuit
US6058004A (en) * 1997-09-08 2000-05-02 Delaware Capital Formation, Inc. Unitized discrete electronic component arrays
US6057597A (en) * 1997-12-15 2000-05-02 Micron Technology, Inc. Semiconductor package with pre-fabricated cover
US6084780A (en) * 1996-02-06 2000-07-04 Kabushiki Kaisha Toshiba Printed circuit board with high electronic component density
USD429704S (en) * 1999-03-10 2000-08-22 Keonil Kang Printed circuit board for wireless telephones
US6115262A (en) * 1998-06-08 2000-09-05 Ford Motor Company Enhanced mounting pads for printed circuit boards
US6144090A (en) * 1997-02-13 2000-11-07 Fujitsu Limited Ball grid array package having electrodes on peripheral side surfaces of a package board
US6147876A (en) * 1993-09-14 2000-11-14 Kabushiki Kaisha Toshiba Multi-chip module having printed wiring board comprising circuit pattern for IC chip
US6181560B1 (en) * 1995-07-28 2001-01-30 Hyundai Electronics Industries Co., Ltd. Semiconductor package substrate and semiconductor package
US6218628B1 (en) * 1994-05-18 2001-04-17 Dyconex Patente Ag Foil circuit boards and semifinished products and method for the manufacture thereof
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6278178B1 (en) * 1998-02-10 2001-08-21 Hyundai Electronics Industries Co., Ltd. Integrated device package and fabrication methods thereof
US6287949B1 (en) * 1994-06-20 2001-09-11 Fujitsu Limited Multi-chip semiconductor chip module
US6288345B1 (en) * 2000-03-22 2001-09-11 Raytheon Company Compact z-axis DC and control signals routing substrate
US20010055191A1 (en) * 1997-11-10 2001-12-27 Murata Manufacturing Co., Ltd. Multilayer capacitor
USD453734S1 (en) * 2000-06-30 2002-02-19 Molex Incorporated Board to board receptacle connector
US20020029904A1 (en) * 1998-03-04 2002-03-14 Peter Matuschik Printed circuit board with smd components
USD455125S1 (en) * 2000-06-30 2002-04-02 Molex Incorporated Board to board plug connector
US6378757B1 (en) * 2001-01-31 2002-04-30 Agilent Technologies, Inc. Method for edge mounting flex media to a rigid PC board
US6383835B1 (en) * 1995-09-01 2002-05-07 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
US6388264B1 (en) * 1997-03-28 2002-05-14 Benedict G Pace Optocoupler package being hermetically sealed
US6407906B1 (en) * 1999-12-06 2002-06-18 Tdk Corporation Multiterminal-multilayer ceramic capacitor
US6407904B1 (en) * 1999-05-10 2002-06-18 Murata Manufacturing Co., Ltd. Multi-layer capacitor
US20020116668A1 (en) * 2001-02-20 2002-08-22 Matrix Semiconductor, Inc. Memory card with enhanced testability and methods of making and using the same
US20020123213A1 (en) * 2000-02-24 2002-09-05 Williams Vernon M. Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
US6452112B1 (en) * 1998-10-19 2002-09-17 Alps Electric Co., Ltd. Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same
US6456168B1 (en) * 2000-12-29 2002-09-24 Cts Corporation Temperature compensated crystal oscillator assembled on crystal base
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US20020171997A1 (en) * 2000-01-28 2002-11-21 Tdk Corporation Multilayer electronic device and method for producing same
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6496355B1 (en) * 2001-10-04 2002-12-17 Avx Corporation Interdigitated capacitor with ball grid array (BGA) terminations
US6528870B2 (en) * 2000-01-28 2003-03-04 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of stacked wiring boards
US6534726B1 (en) * 1999-10-25 2003-03-18 Murata Manufacturing Co., Ltd. Module substrate and method of producing the same
US20030071341A1 (en) * 2001-10-16 2003-04-17 Jeung Boon Suan Apparatus and method for leadless packaging of semiconductor devices
US6566611B2 (en) * 2001-09-26 2003-05-20 Intel Corporation Anti-tombstoning structures and methods of manufacture
USD474773S1 (en) * 2001-07-10 2003-05-20 Sony Corporation Information recording element
US6576999B2 (en) * 2000-07-06 2003-06-10 Murata Manufacturing Co., Ltd. Mounting structure for an electronic component having an external terminal electrode
US6583981B2 (en) * 2000-11-29 2003-06-24 Murata Manufacturing Co., Ltd. Ceramic condenser module
US20030117784A1 (en) * 2001-12-05 2003-06-26 Kenji Fukunabe Circuit board device and mounting method therefor
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6601296B1 (en) * 1999-07-06 2003-08-05 Visteon Global Technologies, Inc. Multi-shot injection molding process for making electrical connectors and three-dimensional circuits
US6601295B2 (en) * 1999-03-03 2003-08-05 Mamoru Maekawa Method of producing chip-type electronic devices
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
US6624505B2 (en) * 1998-02-06 2003-09-23 Shellcase, Ltd. Packaged integrated circuits and methods of producing thereof
US6639311B2 (en) * 2001-10-05 2003-10-28 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
US20030232462A1 (en) * 2002-06-18 2003-12-18 Poo Chia Yong Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
US6670700B1 (en) * 1999-08-19 2003-12-30 Seiko Epson Corporation Interconnect substrate and semiconductor device electronic instrument
US6700794B2 (en) * 2001-07-26 2004-03-02 Harris Corporation Decoupling capacitor closely coupled with integrated circuit
US6714420B2 (en) * 2000-05-30 2004-03-30 Alps Electric Co., Ltd. Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
US6724083B2 (en) * 2001-07-16 2004-04-20 Ars Electronics Co., Ltd. Method of producing semiconductor packages by cutting via holes into half when separating substrate
US6727116B2 (en) * 2002-06-18 2004-04-27 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
US6751101B2 (en) * 2000-11-02 2004-06-15 Murata Manufacturing Co., Ltd. Electronic component and method of producing the same
US6759940B2 (en) * 2002-01-10 2004-07-06 Lamina Ceramics, Inc. Temperature compensating device with integral sheet thermistors
US6760227B2 (en) * 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
USD493152S1 (en) * 2002-11-27 2004-07-20 International Business Machines Corporation Server blade chassis midplane printed circuit board with cover
US20040157410A1 (en) * 2003-01-16 2004-08-12 Seiko Epson Corporation Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module
US6795294B2 (en) * 2003-01-31 2004-09-21 Murata Manufacturing Co., Ltd. Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit
US20040207049A1 (en) * 2003-02-27 2004-10-21 Infineon Technologies Ag Electronic component and semiconductor wafer, and method for producing the same
US20040218344A1 (en) * 2002-04-15 2004-11-04 Ritter Andrew P. Plated terminations
US6822321B2 (en) * 2002-09-30 2004-11-23 Cree Microwave, Inc. Packaged RF power transistor having RF bypassing/output matching network
USD499379S1 (en) * 2003-08-08 2004-12-07 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US6828656B2 (en) * 2001-02-08 2004-12-07 Micron Technology, Inc. High performance silicon contact for flip chip and a system using same
USD501448S1 (en) * 2003-08-19 2005-02-01 Japan Aviation Electronics Industry, Limited Electrical connector
US6855572B2 (en) * 2002-08-28 2005-02-15 Micron Technology, Inc. Castellation wafer level packaging of integrated circuit chips
US6862190B2 (en) * 2001-01-17 2005-03-01 Honeywell International, Inc. Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
US6906907B2 (en) * 2003-04-15 2005-06-14 Kemet Electronics Corporation Monolithic multi-layer capacitor with improved lead-out structure
USD508235S1 (en) * 2003-12-05 2005-08-09 Nichia Corporation Light emitting diode
US6929974B2 (en) * 2002-10-18 2005-08-16 Motorola, Inc. Feedthrough design and method for a hermetically sealed microdevice
US6933209B2 (en) * 2003-12-24 2005-08-23 Super Talent Electronics Inc. Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges
US6934145B2 (en) * 2000-07-06 2005-08-23 Phycomp Holding B.V. Ceramic multilayer capacitor array
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
US6949819B2 (en) * 2001-12-27 2005-09-27 Alps Electric Co., Ltd. Jumper chip component and mounting structure therefor
US6956252B2 (en) * 2002-04-24 2005-10-18 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US6960366B2 (en) * 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US6987315B2 (en) * 2002-11-25 2006-01-17 Samsung Electro-Mechanics Co., Ltd. Ceramic multilayer substrate
US6998926B2 (en) * 2002-12-17 2006-02-14 Seiko Epson Corporation Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator
US7024947B2 (en) * 2002-03-07 2006-04-11 Alps Electric Co., Ltd. Detection device including circuit component
US7041527B2 (en) * 1997-07-29 2006-05-09 Harvatek Corp. Charge coupled device package
US7045386B2 (en) * 1999-02-03 2006-05-16 Rohm Co., Ltd. Semiconductor device and semiconductor chip for use therein
US7050288B2 (en) * 2004-03-11 2006-05-23 Tdk Corporation Laminated ceramic capacitor
USD521952S1 (en) * 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
US7068490B2 (en) * 2004-04-16 2006-06-27 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7067172B2 (en) * 2002-04-15 2006-06-27 Avx Corporation Component formation via plating technology
US7098081B2 (en) * 2001-09-27 2006-08-29 Hamamatsu Photonics K.K. Semiconductor device and method of manufacturing the device
US7123108B2 (en) * 2004-08-26 2006-10-17 Nihon Dempa Kogyo Co., Ltd. Surface mount crystal oscillator
US7151310B2 (en) * 2001-09-25 2006-12-19 Tdk Corporation Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
US7152291B2 (en) * 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7168161B2 (en) * 2003-08-25 2007-01-30 Renesas Technology Corp. Manufacturing method of solid-state image sensing device
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US7189083B2 (en) * 2002-04-01 2007-03-13 Interplex Nas, Inc, Method of retaining a solder mass on an article
US7212395B2 (en) * 2004-12-28 2007-05-01 Intel Corporation Capacitor design for controlling equivalent series resistance
USD544447S1 (en) * 2006-09-26 2007-06-12 Cheng Uei Precision Industry Co., Ltd. Board to board connector
US7232318B2 (en) * 2005-11-22 2007-06-19 Lih Duo International Co., Ltd. IC embedding seat
US7247509B2 (en) * 2003-09-03 2007-07-24 Matsushita Electric Industrial Co., Ltd. Method for manufacturing solid-state imaging devices
US20070205017A1 (en) * 2005-01-31 2007-09-06 Sanyo Electric Co., Ltd. Circuit device and method of manufacturing the same
US7273765B2 (en) * 2003-04-28 2007-09-25 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method for producing the same
US7335951B2 (en) * 2003-10-06 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7411776B2 (en) * 2006-07-12 2008-08-12 Tdk Corporation Multilayer capacitor array
US20080211113A1 (en) * 2002-06-14 2008-09-04 Micron Technology, Inc. Wafer level packaging
US7429501B1 (en) * 2003-08-25 2008-09-30 Xilinx, Inc. Lid and method of employing a lid on an integrated circuit
US7433172B2 (en) * 2005-03-10 2008-10-07 Tdk Corporation Multilayer capacitor
USD582858S1 (en) * 2007-05-31 2008-12-16 Omron Corporation Socket
US7466535B2 (en) * 2005-11-22 2008-12-16 Murata Manufacturing Co., Ltd. Multilayer capacitor
USD582852S1 (en) * 2007-05-31 2008-12-16 Omron Corporation Plug
US7502216B2 (en) * 2007-08-06 2009-03-10 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US7506438B1 (en) * 2000-11-14 2009-03-24 Freescale Semiconductor, Inc. Low profile integrated module interconnects and method of fabrication
US7508647B2 (en) * 2005-11-22 2009-03-24 Murata Manufacturing Co., Ltd. Multilayer capacitor
US7554189B1 (en) * 2008-03-03 2009-06-30 Universal Scientific Industrial Co., Ltd. Wireless communication module
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7599166B2 (en) * 2005-11-17 2009-10-06 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US7612443B1 (en) * 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
US7616427B2 (en) * 2006-05-22 2009-11-10 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor
USD605613S1 (en) * 2008-05-15 2009-12-08 Adc Gmbh Printed circuit board for electrical connector
USD616373S1 (en) * 2007-07-24 2010-05-25 Omron Corporation Connector for flexible printed circuit board
US20100146780A1 (en) * 2003-05-06 2010-06-17 Yong Poo Chia Method for packaging circuits and packaged circuits
US7750441B2 (en) * 2006-06-29 2010-07-06 Intel Corporation Conductive interconnects along the edge of a microelectronic device
US7791173B2 (en) * 2007-01-23 2010-09-07 Samsung Electronics Co., Ltd. Chip having side pad, method of fabricating the same and package using the same
US7829977B2 (en) * 2007-11-15 2010-11-09 Advanced Semiconductor Engineering, Inc. Low temperature co-fired ceramics substrate and semiconductor package
US7843115B2 (en) * 2003-11-25 2010-11-30 Eta Sa Manufacture Horlogère Suisse Electronic component having a resonator element arranged in an hermetically closed housing and method for manufacturing such an electronic component
US7888185B2 (en) * 2006-08-17 2011-02-15 Micron Technology, Inc. Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
US7932786B2 (en) * 2005-11-30 2011-04-26 Nihon Dempa Kogyo Co., Ltd. Surface mount type crystal oscillator
USD643040S1 (en) * 2010-10-26 2011-08-09 Hon Hai Precision Ind. Co., Ltd. Electrical card
US8113888B2 (en) * 2008-05-15 2012-02-14 Adc Gmbh Circuit board for electrical connector and electrical connector
US8138617B2 (en) * 2001-10-08 2012-03-20 Round Rock Research, Llc Apparatus and method for packaging circuits
US8159813B2 (en) * 2008-04-01 2012-04-17 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network

Patent Citations (236)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2706742A (en) * 1950-10-14 1955-04-19 Sprague Electric Co Resin sealed elastomeric housing for electrical components
US3185947A (en) * 1959-11-16 1965-05-25 Arf Products Inductive module for electronic devices
US3357099A (en) * 1962-10-29 1967-12-12 North American Aviation Inc Providing plated through-hole connections with the plating resist extending to the hole edges
US3398232A (en) * 1965-10-19 1968-08-20 Amp Inc Circuit board with interconnected signal conductors and interconnected shielding conductors
US3747210A (en) * 1971-09-13 1973-07-24 Int Standard Electric Corp Method of producing terminal pins of a printed circuit board
US3760091A (en) * 1971-11-16 1973-09-18 Ibm Multilayer circuit board
US3887783A (en) * 1972-11-09 1975-06-03 Honeywell Bull Sa Devices for welding of integrated-circuit wafers
US3964087A (en) * 1975-05-15 1976-06-15 Interdyne Company Resistor network for integrated circuit
US4029531A (en) * 1976-03-29 1977-06-14 Rca Corporation Method of forming grooves in the [011] crystalline direction
US4074340A (en) * 1976-10-18 1978-02-14 Vitramon, Incorporated Trimmable monolithic capacitors
US4288840A (en) * 1978-09-26 1981-09-08 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US4313157A (en) * 1978-09-26 1982-01-26 Draloric Electronic Gmbh Capacitive network
USD254687S (en) * 1979-01-25 1980-04-08 Mcdonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
US4312026A (en) * 1979-04-11 1982-01-19 Tdk Electronics Co., Ltd. Chip ceramic capacitor
USD267094S (en) * 1979-04-12 1982-11-30 Sharp Corporation Magnetic card for microwave oven
US4223321A (en) * 1979-04-30 1980-09-16 The Mead Corporation Planar-faced electrode for ink jet printer and method of manufacture
US4522449A (en) * 1979-08-07 1985-06-11 Hayward C Michael Matrix board
US4400762A (en) * 1980-08-25 1983-08-23 Allen-Bradley Company Edge termination for an electrical circuit device
US4437141A (en) * 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
US4419714A (en) * 1982-04-02 1983-12-06 International Business Machines Corporation Low inductance ceramic capacitor and method for its making
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4430690A (en) * 1982-10-07 1984-02-07 International Business Machines Corporation Low inductance MLC capacitor with metal impregnation and solder bar contact
US4630171A (en) * 1983-11-22 1986-12-16 Eurofarad-Efd Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members
US4616655A (en) * 1984-01-20 1986-10-14 Cordis Corporation Implantable pulse generator having a single printed circuit board and a chip carrier
US4627533A (en) * 1984-10-29 1986-12-09 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
US4750246A (en) * 1984-10-29 1988-06-14 Hughes Aircraft Company Method of making compensated crystal oscillator
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
USD299139S (en) * 1985-12-04 1988-12-27 Interlego Interface panel
US4661884A (en) * 1986-03-10 1987-04-28 American Technical Ceramics Corp. Miniature, multiple layer, side mounting high frequency blocking capacitor
US4821007A (en) * 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
US4790894A (en) * 1987-02-19 1988-12-13 Hitachi Condenser Co., Ltd. Process for producing printed wiring board
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US4947286A (en) * 1988-08-11 1990-08-07 Murata Manufacturing Co., Ltd. Multilayer capacitor device
US4963843A (en) * 1988-10-31 1990-10-16 Motorola, Inc. Stripline filter with combline resonators
US4956694A (en) * 1988-11-04 1990-09-11 Dense-Pac Microsystems, Inc. Integrated circuit chip stacking
US4852227A (en) * 1988-11-25 1989-08-01 Sprague Electric Company Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge
US4978639A (en) * 1989-01-10 1990-12-18 Avantek, Inc. Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
US5428885A (en) * 1989-01-14 1995-07-04 Tdk Corporation Method of making a multilayer hybrid circuit
US5239198A (en) * 1989-09-06 1993-08-24 Motorola, Inc. Overmolded semiconductor device having solder ball and edge lead connective structure
US5224021A (en) * 1989-10-20 1993-06-29 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
US5206495A (en) * 1989-10-24 1993-04-27 Angewandte Digital Elektronik Gmbh Chip card
US5225969A (en) * 1989-12-15 1993-07-06 Tdk Corporation Multilayer hybrid circuit
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
US5092035A (en) * 1990-09-10 1992-03-03 Codex Corporation Method of making printed circuit board assembly
US5126286A (en) * 1990-10-05 1992-06-30 Micron Technology, Inc. Method of manufacturing edge connected semiconductor die
US5138115A (en) * 1990-10-12 1992-08-11 Atmel Corporation Carrierles surface mounted integrated circuit die
US5621619A (en) * 1990-10-25 1997-04-15 Cts Corporation All ceramic surface mount sip and dip networks having spacers and solder barriers
US5293067A (en) * 1991-05-23 1994-03-08 Motorola, Inc. Integrated circuit chip carrier
US5309326A (en) * 1991-12-06 1994-05-03 Rohm Co., Ltd. Circuit module having stacked circuit boards
US5386087A (en) * 1992-02-17 1995-01-31 E. I. Du Pont De Nemours And Company Printed circuit board having U-shaped solder mask layer separating respective contacts
US5502885A (en) * 1992-02-25 1996-04-02 Rohm Co., Ltd. Method of manfacturing a chip-type composite electronic part
US5376778A (en) * 1992-02-26 1994-12-27 Angewandte Digital Electronik Gmbh Contact-free chip card for remote transmission
US5313096A (en) * 1992-03-16 1994-05-17 Dense-Pac Microsystems, Inc. IC chip package having chip attached to and wire bonded within an overlying substrate
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure
USD350125S (en) * 1992-04-24 1994-08-30 Sento Krei Data containing rocket card
US5247423A (en) * 1992-05-26 1993-09-21 Motorola, Inc. Stacking three dimensional leadless multi-chip module and method for making the same
US5635669A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
US5488765A (en) * 1992-07-27 1996-02-06 Murata Manufacturing Co., Ltd. Method of measuring characteristics of a multilayer electronic component
US5644107A (en) * 1992-07-27 1997-07-01 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
US5625935A (en) * 1992-07-27 1997-05-06 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
US5635670A (en) * 1992-07-27 1997-06-03 Murata Manufacturing Co., Ltd. Multilayer electronic component
US5604328A (en) * 1992-07-27 1997-02-18 Murata Manufacturing Co., Ltd. Multilayer electronic component
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5740010A (en) * 1992-10-21 1998-04-14 Devoe; Daniel F. Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors
US5367430A (en) * 1992-10-21 1994-11-22 Presidio Components, Inc. Monolithic multiple capacitor
US5599413A (en) * 1992-11-25 1997-02-04 Matsushita Electric Industrial Co., Ltd. Method of producing a ceramic electronic device
US5714239A (en) * 1993-03-15 1998-02-03 Murata Manufacturing Co., Ltd. Composite component
US5493769A (en) * 1993-08-05 1996-02-27 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component and measuring characteristics of same
US6147876A (en) * 1993-09-14 2000-11-14 Kabushiki Kaisha Toshiba Multi-chip module having printed wiring board comprising circuit pattern for IC chip
US6418030B1 (en) * 1993-09-14 2002-07-09 Kabushiki Kaisha Toshiba Multi-chip module
US5383095A (en) * 1993-10-29 1995-01-17 The Whitaker Corporation Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge
US5471368A (en) * 1993-11-16 1995-11-28 International Business Machines Corporation Module having vertical peripheral edge connection
US5570505A (en) * 1993-11-16 1996-11-05 International Business Machines Corporation Method of manufacturing a circuit module
US5773812A (en) * 1994-02-08 1998-06-30 Angewandte Digital Elektronik Gmbh Chip card capable of both contact and contactless operation including a contact block
US5752182A (en) * 1994-05-09 1998-05-12 Matsushita Electric Industrial Co., Ltd. Hybrid IC
US6218628B1 (en) * 1994-05-18 2001-04-17 Dyconex Patente Ag Foil circuit boards and semifinished products and method for the manufacture thereof
US6287949B1 (en) * 1994-06-20 2001-09-11 Fujitsu Limited Multi-chip semiconductor chip module
US5729437A (en) * 1994-06-22 1998-03-17 Seiko Epson Corporation Electronic part including a thin body of molding resin
US5600101A (en) * 1994-07-21 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer electronic component and method of manufacturing the same
US5434745A (en) * 1994-07-26 1995-07-18 White Microelectronics Div. Of Bowmar Instrument Corp. Stacked silicon die carrier assembly
US5661420A (en) * 1995-03-08 1997-08-26 Etymotic Research, Inc. Mounting configuration for monolithic integrated circuit
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
US5979048A (en) * 1995-06-21 1999-11-09 Polyplastics, Co., Inc. Method of manufacturing connectors
US5877561A (en) * 1995-07-28 1999-03-02 Lg Semicon Co., Ltd. Plate and column type semiconductor package having heat sink
US6181560B1 (en) * 1995-07-28 2001-01-30 Hyundai Electronics Industries Co., Ltd. Semiconductor package substrate and semiconductor package
US6383835B1 (en) * 1995-09-01 2002-05-07 Canon Kabushiki Kaisha IC package having a conductive material at least partially filling a recess
US5847930A (en) * 1995-10-13 1998-12-08 Hei, Inc. Edge terminals for electronic circuit modules
US5731709A (en) * 1996-01-26 1998-03-24 Motorola, Inc. Method for testing a ball grid array semiconductor device and a device for such testing
US6084780A (en) * 1996-02-06 2000-07-04 Kabushiki Kaisha Toshiba Printed circuit board with high electronic component density
US5841217A (en) * 1996-03-14 1998-11-24 Citizen Watch Co., Ltd. Surface mounting crystal unit
US5949294A (en) * 1996-09-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Reference frequency source oscillator formed from first and second containers
US6144090A (en) * 1997-02-13 2000-11-07 Fujitsu Limited Ball grid array package having electrodes on peripheral side surfaces of a package board
US6046409A (en) * 1997-02-26 2000-04-04 Ngk Spark Plug Co., Ltd. Multilayer microelectronic circuit
US6388264B1 (en) * 1997-03-28 2002-05-14 Benedict G Pace Optocoupler package being hermetically sealed
US5966052A (en) * 1997-04-09 1999-10-12 Murata Manufacturing Co., Ltd. Voltage-controlled oscillator with input and output on opposite corners of substrate
US5917709A (en) * 1997-06-16 1999-06-29 Eastman Kodak Company Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
US5991162A (en) * 1997-06-27 1999-11-23 Nec Corporation High-frequency integrated circuit device and manufacture method thereof
US7041527B2 (en) * 1997-07-29 2006-05-09 Harvatek Corp. Charge coupled device package
US5811799A (en) * 1997-07-31 1998-09-22 Wu; Liang-Chung Image sensor package having a wall with a sealed cover
US6058004A (en) * 1997-09-08 2000-05-02 Delaware Capital Formation, Inc. Unitized discrete electronic component arrays
US20010055191A1 (en) * 1997-11-10 2001-12-27 Murata Manufacturing Co., Ltd. Multilayer capacitor
US6057597A (en) * 1997-12-15 2000-05-02 Micron Technology, Inc. Semiconductor package with pre-fabricated cover
US6624505B2 (en) * 1998-02-06 2003-09-23 Shellcase, Ltd. Packaged integrated circuits and methods of producing thereof
US6803251B2 (en) * 1998-02-10 2004-10-12 Hyundai Electronics Industries Co., Ltd. Integrated device package and fabrication methods thereof
US6278178B1 (en) * 1998-02-10 2001-08-21 Hyundai Electronics Industries Co., Ltd. Integrated device package and fabrication methods thereof
US6665930B2 (en) * 1998-03-04 2003-12-23 Koninklijke Philips Electronics N.V. Printed circuit board with SMD components
US20020029904A1 (en) * 1998-03-04 2002-03-14 Peter Matuschik Printed circuit board with smd components
US6115262A (en) * 1998-06-08 2000-09-05 Ford Motor Company Enhanced mounting pads for printed circuit boards
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6452112B1 (en) * 1998-10-19 2002-09-17 Alps Electric Co., Ltd. Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same
US7045386B2 (en) * 1999-02-03 2006-05-16 Rohm Co., Ltd. Semiconductor device and semiconductor chip for use therein
US7126226B2 (en) * 1999-02-03 2006-10-24 Rohm Co., Ltd. Semiconductor device and semiconductor chip for use therein
US6601295B2 (en) * 1999-03-03 2003-08-05 Mamoru Maekawa Method of producing chip-type electronic devices
USD429704S (en) * 1999-03-10 2000-08-22 Keonil Kang Printed circuit board for wireless telephones
US6407904B1 (en) * 1999-05-10 2002-06-18 Murata Manufacturing Co., Ltd. Multi-layer capacitor
US6601296B1 (en) * 1999-07-06 2003-08-05 Visteon Global Technologies, Inc. Multi-shot injection molding process for making electrical connectors and three-dimensional circuits
US6670700B1 (en) * 1999-08-19 2003-12-30 Seiko Epson Corporation Interconnect substrate and semiconductor device electronic instrument
US6534726B1 (en) * 1999-10-25 2003-03-18 Murata Manufacturing Co., Ltd. Module substrate and method of producing the same
US6407906B1 (en) * 1999-12-06 2002-06-18 Tdk Corporation Multiterminal-multilayer ceramic capacitor
US6657848B2 (en) * 2000-01-28 2003-12-02 Tdk Corporation Multilayer electronic device and method for producing same
US20020171997A1 (en) * 2000-01-28 2002-11-21 Tdk Corporation Multilayer electronic device and method for producing same
US6528870B2 (en) * 2000-01-28 2003-03-04 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of stacked wiring boards
US20020123213A1 (en) * 2000-02-24 2002-09-05 Williams Vernon M. Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
US6288345B1 (en) * 2000-03-22 2001-09-11 Raytheon Company Compact z-axis DC and control signals routing substrate
US6714420B2 (en) * 2000-05-30 2004-03-30 Alps Electric Co., Ltd. Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment
USD455125S1 (en) * 2000-06-30 2002-04-02 Molex Incorporated Board to board plug connector
USD453734S1 (en) * 2000-06-30 2002-02-19 Molex Incorporated Board to board receptacle connector
US6934145B2 (en) * 2000-07-06 2005-08-23 Phycomp Holding B.V. Ceramic multilayer capacitor array
US6576999B2 (en) * 2000-07-06 2003-06-10 Murata Manufacturing Co., Ltd. Mounting structure for an electronic component having an external terminal electrode
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6751101B2 (en) * 2000-11-02 2004-06-15 Murata Manufacturing Co., Ltd. Electronic component and method of producing the same
US6760227B2 (en) * 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
US7506438B1 (en) * 2000-11-14 2009-03-24 Freescale Semiconductor, Inc. Low profile integrated module interconnects and method of fabrication
US6583981B2 (en) * 2000-11-29 2003-06-24 Murata Manufacturing Co., Ltd. Ceramic condenser module
US6456168B1 (en) * 2000-12-29 2002-09-24 Cts Corporation Temperature compensated crystal oscillator assembled on crystal base
US6862190B2 (en) * 2001-01-17 2005-03-01 Honeywell International, Inc. Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
US6378757B1 (en) * 2001-01-31 2002-04-30 Agilent Technologies, Inc. Method for edge mounting flex media to a rigid PC board
US6828656B2 (en) * 2001-02-08 2004-12-07 Micron Technology, Inc. High performance silicon contact for flip chip and a system using same
US20020116668A1 (en) * 2001-02-20 2002-08-22 Matrix Semiconductor, Inc. Memory card with enhanced testability and methods of making and using the same
US6462408B1 (en) * 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) * 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
USD474773S1 (en) * 2001-07-10 2003-05-20 Sony Corporation Information recording element
US6724083B2 (en) * 2001-07-16 2004-04-20 Ars Electronics Co., Ltd. Method of producing semiconductor packages by cutting via holes into half when separating substrate
US6700794B2 (en) * 2001-07-26 2004-03-02 Harris Corporation Decoupling capacitor closely coupled with integrated circuit
US7304377B2 (en) * 2001-09-25 2007-12-04 Tdk Corporation Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
US7151310B2 (en) * 2001-09-25 2006-12-19 Tdk Corporation Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
US6566611B2 (en) * 2001-09-26 2003-05-20 Intel Corporation Anti-tombstoning structures and methods of manufacture
US7098081B2 (en) * 2001-09-27 2006-08-29 Hamamatsu Photonics K.K. Semiconductor device and method of manufacturing the device
US6496355B1 (en) * 2001-10-04 2002-12-17 Avx Corporation Interdigitated capacitor with ball grid array (BGA) terminations
US6639311B2 (en) * 2001-10-05 2003-10-28 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
US8138617B2 (en) * 2001-10-08 2012-03-20 Round Rock Research, Llc Apparatus and method for packaging circuits
US20030071341A1 (en) * 2001-10-16 2003-04-17 Jeung Boon Suan Apparatus and method for leadless packaging of semiconductor devices
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
US20030117784A1 (en) * 2001-12-05 2003-06-26 Kenji Fukunabe Circuit board device and mounting method therefor
US6949819B2 (en) * 2001-12-27 2005-09-27 Alps Electric Co., Ltd. Jumper chip component and mounting structure therefor
US7098531B2 (en) * 2001-12-27 2006-08-29 Alps Electric Co., Ltd. Jumper chip component and mounting structure therefor
US6759940B2 (en) * 2002-01-10 2004-07-06 Lamina Ceramics, Inc. Temperature compensating device with integral sheet thermistors
US7024947B2 (en) * 2002-03-07 2006-04-11 Alps Electric Co., Ltd. Detection device including circuit component
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US7189083B2 (en) * 2002-04-01 2007-03-13 Interplex Nas, Inc, Method of retaining a solder mass on an article
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US6960366B2 (en) * 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US7067172B2 (en) * 2002-04-15 2006-06-27 Avx Corporation Component formation via plating technology
US7152291B2 (en) * 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US20040218344A1 (en) * 2002-04-15 2004-11-04 Ritter Andrew P. Plated terminations
US6956252B2 (en) * 2002-04-24 2005-10-18 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US20080211113A1 (en) * 2002-06-14 2008-09-04 Micron Technology, Inc. Wafer level packaging
US7820484B2 (en) * 2002-06-14 2010-10-26 Micron Technology, Inc Wafer level packaging
US8106488B2 (en) * 2002-06-14 2012-01-31 Micron Technology, Inc. Wafer level packaging
US7285850B2 (en) * 2002-06-18 2007-10-23 Micron Technology, Inc. Support elements for semiconductor devices with peripherally located bond pads
US7226809B2 (en) * 2002-06-18 2007-06-05 Micron Technology, Inc. Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
US6818977B2 (en) * 2002-06-18 2004-11-16 Micron Technology, Inc. Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages
US6727116B2 (en) * 2002-06-18 2004-04-27 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
US20030232462A1 (en) * 2002-06-18 2003-12-18 Poo Chia Yong Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
US20050130345A1 (en) * 2002-08-28 2005-06-16 Micron Technology, Inc. Castellation wafer level packaging of integrated circuit chips
US6855572B2 (en) * 2002-08-28 2005-02-15 Micron Technology, Inc. Castellation wafer level packaging of integrated circuit chips
US6822321B2 (en) * 2002-09-30 2004-11-23 Cree Microwave, Inc. Packaged RF power transistor having RF bypassing/output matching network
US6929974B2 (en) * 2002-10-18 2005-08-16 Motorola, Inc. Feedthrough design and method for a hermetically sealed microdevice
US6987315B2 (en) * 2002-11-25 2006-01-17 Samsung Electro-Mechanics Co., Ltd. Ceramic multilayer substrate
USD493152S1 (en) * 2002-11-27 2004-07-20 International Business Machines Corporation Server blade chassis midplane printed circuit board with cover
US6998926B2 (en) * 2002-12-17 2006-02-14 Seiko Epson Corporation Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillator
US20040157410A1 (en) * 2003-01-16 2004-08-12 Seiko Epson Corporation Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module
US6795294B2 (en) * 2003-01-31 2004-09-21 Murata Manufacturing Co., Ltd. Laminated capacitor, printed circuit board, decoupling circuit, and high-frequency circuit
US20040207049A1 (en) * 2003-02-27 2004-10-21 Infineon Technologies Ag Electronic component and semiconductor wafer, and method for producing the same
US7420262B2 (en) * 2003-02-27 2008-09-02 Infineon Technologies Ag Electronic component and semiconductor wafer, and method for producing the same
US6906907B2 (en) * 2003-04-15 2005-06-14 Kemet Electronics Corporation Monolithic multi-layer capacitor with improved lead-out structure
US7273765B2 (en) * 2003-04-28 2007-09-25 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method for producing the same
US20100146780A1 (en) * 2003-05-06 2010-06-17 Yong Poo Chia Method for packaging circuits and packaged circuits
US8065792B2 (en) * 2003-05-06 2011-11-29 Micron Technology, Inc. Method for packaging circuits
USD499379S1 (en) * 2003-08-08 2004-12-07 Hon Hai Precision Ind. Co., Ltd. Electrical connector
USD501448S1 (en) * 2003-08-19 2005-02-01 Japan Aviation Electronics Industry, Limited Electrical connector
US7168161B2 (en) * 2003-08-25 2007-01-30 Renesas Technology Corp. Manufacturing method of solid-state image sensing device
US7429501B1 (en) * 2003-08-25 2008-09-30 Xilinx, Inc. Lid and method of employing a lid on an integrated circuit
US7247509B2 (en) * 2003-09-03 2007-07-24 Matsushita Electric Industrial Co., Ltd. Method for manufacturing solid-state imaging devices
US8021965B1 (en) * 2003-09-04 2011-09-20 University Of Norte Dame Du Lac Inter-chip communication
US7612443B1 (en) * 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
US7335951B2 (en) * 2003-10-06 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7843115B2 (en) * 2003-11-25 2010-11-30 Eta Sa Manufacture Horlogère Suisse Electronic component having a resonator element arranged in an hermetically closed housing and method for manufacturing such an electronic component
USD508235S1 (en) * 2003-12-05 2005-08-09 Nichia Corporation Light emitting diode
US6933209B2 (en) * 2003-12-24 2005-08-23 Super Talent Electronics Inc. Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD521952S1 (en) * 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
US7050288B2 (en) * 2004-03-11 2006-05-23 Tdk Corporation Laminated ceramic capacitor
US7291235B2 (en) * 2004-04-16 2007-11-06 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7068490B2 (en) * 2004-04-16 2006-06-27 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7123108B2 (en) * 2004-08-26 2006-10-17 Nihon Dempa Kogyo Co., Ltd. Surface mount crystal oscillator
USD536309S1 (en) * 2004-12-08 2007-02-06 Nichia Corporation Light emitting diode board
US7212395B2 (en) * 2004-12-28 2007-05-01 Intel Corporation Capacitor design for controlling equivalent series resistance
US20070205017A1 (en) * 2005-01-31 2007-09-06 Sanyo Electric Co., Ltd. Circuit device and method of manufacturing the same
US7433172B2 (en) * 2005-03-10 2008-10-07 Tdk Corporation Multilayer capacitor
US7599166B2 (en) * 2005-11-17 2009-10-06 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US7466535B2 (en) * 2005-11-22 2008-12-16 Murata Manufacturing Co., Ltd. Multilayer capacitor
US7508647B2 (en) * 2005-11-22 2009-03-24 Murata Manufacturing Co., Ltd. Multilayer capacitor
US7232318B2 (en) * 2005-11-22 2007-06-19 Lih Duo International Co., Ltd. IC embedding seat
US7932786B2 (en) * 2005-11-30 2011-04-26 Nihon Dempa Kogyo Co., Ltd. Surface mount type crystal oscillator
US7616427B2 (en) * 2006-05-22 2009-11-10 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor
US7750441B2 (en) * 2006-06-29 2010-07-06 Intel Corporation Conductive interconnects along the edge of a microelectronic device
US7411776B2 (en) * 2006-07-12 2008-08-12 Tdk Corporation Multilayer capacitor array
US7888185B2 (en) * 2006-08-17 2011-02-15 Micron Technology, Inc. Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
USD544447S1 (en) * 2006-09-26 2007-06-12 Cheng Uei Precision Industry Co., Ltd. Board to board connector
US7791173B2 (en) * 2007-01-23 2010-09-07 Samsung Electronics Co., Ltd. Chip having side pad, method of fabricating the same and package using the same
USD582852S1 (en) * 2007-05-31 2008-12-16 Omron Corporation Plug
USD582858S1 (en) * 2007-05-31 2008-12-16 Omron Corporation Socket
USD616373S1 (en) * 2007-07-24 2010-05-25 Omron Corporation Connector for flexible printed circuit board
US7502216B2 (en) * 2007-08-06 2009-03-10 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US7829977B2 (en) * 2007-11-15 2010-11-09 Advanced Semiconductor Engineering, Inc. Low temperature co-fired ceramics substrate and semiconductor package
US7554189B1 (en) * 2008-03-03 2009-06-30 Universal Scientific Industrial Co., Ltd. Wireless communication module
US8159813B2 (en) * 2008-04-01 2012-04-17 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network
US8113888B2 (en) * 2008-05-15 2012-02-14 Adc Gmbh Circuit board for electrical connector and electrical connector
USD605613S1 (en) * 2008-05-15 2009-12-08 Adc Gmbh Printed circuit board for electrical connector
USD643040S1 (en) * 2010-10-26 2011-08-09 Hon Hai Precision Ind. Co., Ltd. Electrical card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device

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