BR8706895A - Processo de fabricacao de um dispositivo semicondutor - Google Patents
Processo de fabricacao de um dispositivo semicondutorInfo
- Publication number
- BR8706895A BR8706895A BR8706895A BR8706895A BR8706895A BR 8706895 A BR8706895 A BR 8706895A BR 8706895 A BR8706895 A BR 8706895A BR 8706895 A BR8706895 A BR 8706895A BR 8706895 A BR8706895 A BR 8706895A
- Authority
- BR
- Brazil
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H10W74/121—
-
- H10W72/019—
-
- H10W74/131—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5522—
-
- H10W72/59—
-
- H10W72/90—
-
- H10W72/983—
-
- H10W74/00—
-
- H10W90/756—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94426886A | 1986-12-19 | 1986-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR8706895A true BR8706895A (pt) | 1988-07-26 |
Family
ID=25481096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR8706895A BR8706895A (pt) | 1986-12-19 | 1987-12-17 | Processo de fabricacao de um dispositivo semicondutor |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0275588B1 (pt) |
| JP (1) | JP2818779B2 (pt) |
| KR (1) | KR960016238B1 (pt) |
| CN (1) | CN1014380B (pt) |
| BR (1) | BR8706895A (pt) |
| DE (1) | DE3788119T2 (pt) |
| ES (1) | ES2046984T3 (pt) |
| HK (1) | HK163795A (pt) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0212950A (ja) * | 1988-06-30 | 1990-01-17 | Toshiba Corp | 半導体装置 |
| NL8902018A (nl) * | 1989-08-07 | 1991-03-01 | Philips Nv | Halfgeleiderinrichting. |
| JP3563877B2 (ja) * | 1996-06-21 | 2004-09-08 | 三菱電機株式会社 | 半導体装置 |
| TW448524B (en) | 1997-01-17 | 2001-08-01 | Seiko Epson Corp | Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment |
| JP3223246B2 (ja) * | 1997-07-25 | 2001-10-29 | 東レ・ダウコーニング・シリコーン株式会社 | 半導体装置 |
| JP2001284499A (ja) * | 2000-03-09 | 2001-10-12 | Lucent Technol Inc | 半導体デバイスとその製造方法 |
| GB0018028D0 (en) * | 2000-07-24 | 2000-09-13 | Koninkl Philips Electronics Nv | Semiconductor devices and their manufacture |
| KR20060079219A (ko) * | 2003-09-16 | 2006-07-05 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 전자 디바이스, 이의 제조 방법 및 반제품 |
| CN100370580C (zh) * | 2004-03-29 | 2008-02-20 | 雅马哈株式会社 | 半导体晶片及其制造方法 |
| WO2007052597A1 (ja) * | 2005-11-02 | 2007-05-10 | Matsushita Electric Industrial Co., Ltd. | 電子部品パッケージ |
| CN102593190B (zh) * | 2012-02-13 | 2015-11-25 | 贵州雅光电子科技股份有限公司 | 一种二极管 |
| CN113517205A (zh) * | 2020-04-27 | 2021-10-19 | 台湾积体电路制造股份有限公司 | 半导体器件及其形成方法 |
| US11699663B2 (en) | 2020-04-27 | 2023-07-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Passivation scheme design for wafer singulation |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3978578A (en) * | 1974-08-29 | 1976-09-07 | Fairchild Camera And Instrument Corporation | Method for packaging semiconductor devices |
| JPS51147962A (en) * | 1975-06-02 | 1976-12-18 | Fairchild Camera Instr Co | Method of mounting semiconductor devices |
| JPS5748252A (en) * | 1980-09-08 | 1982-03-19 | Nec Corp | Semiconductor device and manufacture thereof |
| JPS5848443A (ja) * | 1981-09-17 | 1983-03-22 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPS59191353A (ja) * | 1983-04-15 | 1984-10-30 | Hitachi Ltd | 多層配線構造を有する電子装置 |
| DE3327960A1 (de) * | 1983-08-03 | 1985-02-14 | Telefunken electronic GmbH, 7100 Heilbronn | Halbleiteranordnung in einem isolierstoffgehaeuse |
-
1987
- 1987-12-14 EP EP87202505A patent/EP0275588B1/en not_active Expired - Lifetime
- 1987-12-14 ES ES87202505T patent/ES2046984T3/es not_active Expired - Lifetime
- 1987-12-14 DE DE87202505T patent/DE3788119T2/de not_active Expired - Fee Related
- 1987-12-16 CN CN87108334A patent/CN1014380B/zh not_active Expired
- 1987-12-17 BR BR8706895A patent/BR8706895A/pt not_active IP Right Cessation
- 1987-12-18 JP JP62321185A patent/JP2818779B2/ja not_active Expired - Fee Related
- 1987-12-19 KR KR87014557A patent/KR960016238B1/ko not_active Expired - Fee Related
-
1995
- 1995-10-19 HK HK163795A patent/HK163795A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0275588B1 (en) | 1993-11-10 |
| DE3788119D1 (de) | 1993-12-16 |
| JP2818779B2 (ja) | 1998-10-30 |
| HK163795A (en) | 1995-10-27 |
| KR960016238B1 (en) | 1996-12-07 |
| ES2046984T3 (es) | 1994-02-16 |
| JPS63226046A (ja) | 1988-09-20 |
| EP0275588A1 (en) | 1988-07-27 |
| CN1014380B (zh) | 1991-10-16 |
| CN87108334A (zh) | 1988-07-13 |
| DE3788119T2 (de) | 1994-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TC | Change of name | ||
| B21A | Patent or certificate of addition expired [chapter 21.1 patent gazette] |
Free format text: PATENTE EXTINTA EM 17/12/2002 |