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BR8501075A - Processo para depositar uma pelicula de liga semicondutora amorfa sobre um substrato - Google Patents

Processo para depositar uma pelicula de liga semicondutora amorfa sobre um substrato

Info

Publication number
BR8501075A
BR8501075A BR8501075A BR8501075A BR8501075A BR 8501075 A BR8501075 A BR 8501075A BR 8501075 A BR8501075 A BR 8501075A BR 8501075 A BR8501075 A BR 8501075A BR 8501075 A BR8501075 A BR 8501075A
Authority
BR
Brazil
Prior art keywords
alloy
semi
placing
substrate
conductor
Prior art date
Application number
BR8501075A
Other languages
English (en)
Inventor
Standord R Ovshinsky
Lee Walter
David D Allred
Stephen J Hudgens
Original Assignee
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Conversion Devices Inc filed Critical Energy Conversion Devices Inc
Publication of BR8501075A publication Critical patent/BR8501075A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/3222—Antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32266—Means for controlling power transmitted to the plasma
    • H01J37/32275—Microwave reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • H10P14/24—
    • H10P14/2921—
    • H10P14/2923—
    • H10P14/3211—
    • H10P14/3238—
    • H10P14/3251—
    • H10P14/3411—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
BR8501075A 1984-04-30 1985-03-11 Processo para depositar uma pelicula de liga semicondutora amorfa sobre um substrato BR8501075A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/605,575 US4504518A (en) 1982-09-24 1984-04-30 Method of making amorphous semiconductor alloys and devices using microwave energy

Publications (1)

Publication Number Publication Date
BR8501075A true BR8501075A (pt) 1986-04-22

Family

ID=24424256

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8501075A BR8501075A (pt) 1984-04-30 1985-03-11 Processo para depositar uma pelicula de liga semicondutora amorfa sobre um substrato

Country Status (11)

Country Link
US (1) US4504518A (pt)
EP (1) EP0160365B1 (pt)
JP (1) JP2579900B2 (pt)
AU (1) AU568192B2 (pt)
BR (1) BR8501075A (pt)
CA (1) CA1248047A (pt)
DE (1) DE3570326D1 (pt)
ES (1) ES541155A0 (pt)
IN (1) IN162992B (pt)
MX (1) MX159170A (pt)
ZA (1) ZA851756B (pt)

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737379A (en) * 1982-09-24 1988-04-12 Energy Conversion Devices, Inc. Plasma deposited coatings, and low temperature plasma method of making same
DE3429899A1 (de) * 1983-08-16 1985-03-07 Canon K.K., Tokio/Tokyo Verfahren zur bildung eines abscheidungsfilms
DE3330910A1 (de) * 1983-08-27 1985-03-07 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen eines reaktionsgefaesses fuer kristallzuchtzwecke
US6784033B1 (en) 1984-02-15 2004-08-31 Semiconductor Energy Laboratory Co., Ltd. Method for the manufacture of an insulated gate field effect semiconductor device
JPH0670969B2 (ja) * 1984-09-13 1994-09-07 株式会社長野計器製作所 シリコン薄膜ピエゾ抵抗素子の製造法
US4759947A (en) * 1984-10-08 1988-07-26 Canon Kabushiki Kaisha Method for forming deposition film using Si compound and active species from carbon and halogen compound
US4566403A (en) * 1985-01-30 1986-01-28 Sovonics Solar Systems Apparatus for microwave glow discharge deposition
US6113701A (en) 1985-02-14 2000-09-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method, and system
US5178904A (en) * 1985-02-16 1993-01-12 Canon Kabushiki Kaisha Process for forming deposited film from a group II through group VI metal hydrocarbon compound
US4772486A (en) * 1985-02-18 1988-09-20 Canon Kabushiki Kaisha Process for forming a deposited film
US4726963A (en) * 1985-02-19 1988-02-23 Canon Kabushiki Kaisha Process for forming deposited film
US4818563A (en) * 1985-02-21 1989-04-04 Canon Kabushiki Kaisha Process for forming deposited film
US5244698A (en) * 1985-02-21 1993-09-14 Canon Kabushiki Kaisha Process for forming deposited film
US4853251A (en) * 1985-02-22 1989-08-01 Canon Kabushiki Kaisha Process for forming deposited film including carbon as a constituent element
US4801468A (en) * 1985-02-25 1989-01-31 Canon Kabushiki Kaisha Process for forming deposited film
JP2537175B2 (ja) * 1985-03-27 1996-09-25 キヤノン株式会社 機能性堆積膜の製造装置
US4582773A (en) * 1985-05-02 1986-04-15 Energy Conversion Devices, Inc. Electrophotographic photoreceptor and method for the fabrication thereof
JPS61263170A (ja) * 1985-05-15 1986-11-21 Sharp Corp 光起電力装置
JP2635021B2 (ja) * 1985-09-26 1997-07-30 宣夫 御子柴 堆積膜形成法及びこれに用いる装置
US4812325A (en) * 1985-10-23 1989-03-14 Canon Kabushiki Kaisha Method for forming a deposited film
CA1315614C (en) * 1985-10-23 1993-04-06 Shunichi Ishihara Method for forming deposited film
KR910003169B1 (ko) * 1985-11-12 1991-05-20 가부시끼가이샤 한도다이 에네르기 겐뀨소 반도체 장치 제조 방법 및 장치
JPS62136871A (ja) * 1985-12-11 1987-06-19 Canon Inc 光センサ−、その製造方法及びその製造装置
JPS62136885A (ja) * 1985-12-11 1987-06-19 Canon Inc 光起電力素子、その製造方法及びその製造装置
JPH0645886B2 (ja) * 1985-12-16 1994-06-15 キヤノン株式会社 堆積膜形成法
JPH0647727B2 (ja) * 1985-12-24 1994-06-22 キヤノン株式会社 堆積膜形成法
JPH0651906B2 (ja) * 1985-12-25 1994-07-06 キヤノン株式会社 堆積膜形成法
JPH0647730B2 (ja) * 1985-12-25 1994-06-22 キヤノン株式会社 堆積膜形成法
US5391232A (en) * 1985-12-26 1995-02-21 Canon Kabushiki Kaisha Device for forming a deposited film
JPH0651909B2 (ja) * 1985-12-28 1994-07-06 キヤノン株式会社 薄膜多層構造の形成方法
JP2566914B2 (ja) * 1985-12-28 1996-12-25 キヤノン株式会社 薄膜半導体素子及びその形成法
US5322568A (en) * 1985-12-28 1994-06-21 Canon Kabushiki Kaisha Apparatus for forming deposited film
JPH084070B2 (ja) * 1985-12-28 1996-01-17 キヤノン株式会社 薄膜半導体素子及びその形成法
JPH084071B2 (ja) * 1985-12-28 1996-01-17 キヤノン株式会社 堆積膜形成法
JPH0651908B2 (ja) * 1985-12-28 1994-07-06 キヤノン株式会社 薄膜多層構造の形成方法
GB2185758B (en) * 1985-12-28 1990-09-05 Canon Kk Method for forming deposited film
JPH084072B2 (ja) * 1986-01-14 1996-01-17 キヤノン株式会社 堆積膜形成法
US4801474A (en) * 1986-01-14 1989-01-31 Canon Kabushiki Kaisha Method for forming thin film multi-layer structure member
US4868014A (en) * 1986-01-14 1989-09-19 Canon Kabushiki Kaisha Method for forming thin film multi-layer structure member
US5366554A (en) * 1986-01-14 1994-11-22 Canon Kabushiki Kaisha Device for forming a deposited film
US4690830A (en) * 1986-02-18 1987-09-01 Solarex Corporation Activation by dehydrogenation or dehalogenation of deposition feedstock and dopant materials useful in the fabrication of hydrogenated amorphous silicon alloys for photovoltaic devices and other semiconductor devices
US4910153A (en) * 1986-02-18 1990-03-20 Solarex Corporation Deposition feedstock and dopant materials useful in the fabrication of hydrogenated amorphous silicon alloys for photovoltaic devices and other semiconductor devices
US4800173A (en) * 1986-02-20 1989-01-24 Canon Kabushiki Kaisha Process for preparing Si or Ge epitaxial film using fluorine oxidant
US4877650A (en) * 1986-03-31 1989-10-31 Canon Kabushiki Kaisha Method for forming deposited film
JPS62228471A (ja) * 1986-03-31 1987-10-07 Canon Inc 堆積膜形成法
JP2598002B2 (ja) * 1986-12-13 1997-04-09 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による機能性堆積膜の形成方法
JP2598003B2 (ja) * 1986-12-12 1997-04-09 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による機能性堆積膜の形成方法
US4893584A (en) * 1988-03-29 1990-01-16 Energy Conversion Devices, Inc. Large area microwave plasma apparatus
EP0406690B1 (en) * 1989-06-28 1997-03-12 Canon Kabushiki Kaisha Process for continuously forming a large area functional deposited film by microwave PCVD method and an apparatus suitable for practicing the same
US5023056A (en) * 1989-12-27 1991-06-11 The United States Of America As Represented By The Secretary Of The Navy Plasma generator utilizing dielectric member for carrying microwave energy
JP2714247B2 (ja) * 1990-10-29 1998-02-16 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による大面積の機能性堆積膜を連続的に形成する方法及び装置
JP2824808B2 (ja) * 1990-11-16 1998-11-18 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による大面積の機能性堆積膜を連続的に形成する装置
US5629054A (en) * 1990-11-20 1997-05-13 Canon Kabushiki Kaisha Method for continuously forming a functional deposit film of large area by micro-wave plasma CVD method
JP2810532B2 (ja) * 1990-11-29 1998-10-15 キヤノン株式会社 堆積膜形成方法及び堆積膜形成装置
JP3101330B2 (ja) * 1991-01-23 2000-10-23 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による大面積の機能性堆積膜を連続的に形成する方法及び装置
JP3076414B2 (ja) * 1991-07-26 2000-08-14 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による堆積膜形成装置
US5231048A (en) * 1991-12-23 1993-07-27 United Solar Systems Corporation Microwave energized deposition process wherein the deposition is carried out at a pressure less than the pressure of the minimum point on the deposition system's paschen curve
US5204138A (en) 1991-12-24 1993-04-20 International Business Machines Corporation Plasma enhanced CVD process for fluorinated silicon nitride films
AU4768793A (en) * 1992-06-29 1994-01-24 United Solar Systems Corporation Microwave energized deposition process with substrate temperature control
US5476798A (en) * 1992-06-29 1995-12-19 United Solar Systems Corporation Plasma deposition process with substrate temperature control
US5334423A (en) * 1993-01-28 1994-08-02 United Solar Systems Corp. Microwave energized process for the preparation of high quality semiconductor material
JP3102721B2 (ja) * 1993-03-23 2000-10-23 キヤノン株式会社 電子写真感光体の製造方法
JP3563789B2 (ja) 1993-12-22 2004-09-08 キヤノン株式会社 電子写真感光体の製造方法及び該製造方法に用いられる治具
US5665640A (en) * 1994-06-03 1997-09-09 Sony Corporation Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor
US5975912A (en) * 1994-06-03 1999-11-02 Materials Research Corporation Low temperature plasma-enhanced formation of integrated circuits
AU1745695A (en) * 1994-06-03 1996-01-04 Materials Research Corporation A method of nitridization of titanium thin films
US5628829A (en) * 1994-06-03 1997-05-13 Materials Research Corporation Method and apparatus for low temperature deposition of CVD and PECVD films
US5972790A (en) * 1995-06-09 1999-10-26 Tokyo Electron Limited Method for forming salicides
US5980999A (en) * 1995-08-24 1999-11-09 Nagoya University Method of manufacturing thin film and method for performing precise working by radical control and apparatus for carrying out such methods
US6273955B1 (en) 1995-08-28 2001-08-14 Canon Kabushiki Kaisha Film forming apparatus
US6096389A (en) * 1995-09-14 2000-08-01 Canon Kabushiki Kaisha Method and apparatus for forming a deposited film using a microwave CVD process
US5935705A (en) * 1997-10-15 1999-08-10 National Science Council Of Republic Of China Crystalline Six Cy Nz with a direct optical band gap of 3.8 eV
US6156472A (en) * 1997-11-06 2000-12-05 Canon Kabushiki Kaisha Method of manufacturing electrophotographic photosensitive member
FR2772473B1 (fr) * 1997-12-11 2000-04-28 Yvon Sampeur Procede pour realiser une jauge de contrainte et jauge de contrainte obtenue par la mise en oeuvre du procede
JP3890153B2 (ja) * 1997-12-26 2007-03-07 キヤノン株式会社 電子写真感光体の製造方法及び製造装置
US6406554B1 (en) 1997-12-26 2002-06-18 Canon Kabushiki Kaisha Method and apparatus for producing electrophotographic photosensitive member
US6321759B1 (en) 1997-12-26 2001-11-27 Canon Kabushiki Kaisha Method for cleaning a substrate
JP3658257B2 (ja) 1998-12-24 2005-06-08 キヤノン株式会社 洗浄方法及び洗浄装置及び電子写真感光体及び電子写真感光体の製造方法
US6667240B2 (en) 2000-03-09 2003-12-23 Canon Kabushiki Kaisha Method and apparatus for forming deposited film
US6592985B2 (en) * 2000-09-20 2003-07-15 Camco International (Uk) Limited Polycrystalline diamond partially depleted of catalyzing material
US6649138B2 (en) * 2000-10-13 2003-11-18 Quantum Dot Corporation Surface-modified semiconductive and metallic nanoparticles having enhanced dispersibility in aqueous media
US7547647B2 (en) * 2004-07-06 2009-06-16 Hewlett-Packard Development Company, L.P. Method of making a structure
GB2429143B (en) * 2005-07-11 2008-02-13 Re18 Ltd Vessel and source of radio frequency electromagnetic radiation, heating apparatus and method of heating a feedstock
RU2367599C2 (ru) * 2006-11-10 2009-09-20 Российская академия сельскохозяйственных наук Государственное научное учреждение Всероссийский научно-исследовательский институт электрификации сельского хозяйства (ГНУ ВИЭСХ РООССЕЛЬХОЗАКАДЕМИИ) Способ получения поликристаллического кремния высокой чистоты и устройство для его осуществления (варианты)
US20100012190A1 (en) * 2008-07-16 2010-01-21 Hajime Goto Nanowire photovoltaic cells and manufacture method thereof
US8252112B2 (en) * 2008-09-12 2012-08-28 Ovshinsky Innovation, Llc High speed thin film deposition via pre-selected intermediate
TWI606490B (zh) 2010-07-02 2017-11-21 半導體能源研究所股份有限公司 半導體膜的製造方法，半導體裝置的製造方法，和光電轉換裝置的製造方法
US8101245B1 (en) 2010-08-12 2012-01-24 Ovshinsky Innovation, Llc Plasma deposition of amorphous semiconductors at microwave frequencies
US8048782B1 (en) 2010-08-12 2011-11-01 Ovshinsky Innovation Llc Plasma deposition of amorphous semiconductors at microwave frequencies
US8222125B2 (en) * 2010-08-12 2012-07-17 Ovshinsky Innovation, Llc Plasma deposition of amorphous semiconductors at microwave frequencies
US8273641B2 (en) * 2010-08-12 2012-09-25 Ovshinsky Innovation Llc Plasma deposition of amorphous semiconductors at microwave frequencies
FR3129527B1 (fr) * 2021-11-23 2023-10-20 Commissariat Energie Atomique Dispositif optoélectronique comportant une couche semiconductrice à base de GeSn présentant une portion monocristalline à structure de bandes directe et une zone barrière sous-jacente.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226898A (en) * 1978-03-16 1980-10-07 Energy Conversion Devices, Inc. Amorphous semiconductors equivalent to crystalline semiconductors produced by a glow discharge process
JPS54158190A (en) * 1978-06-05 1979-12-13 Yamazaki Shunpei Semiconductor device and method of fabricating same
GB2033355B (en) * 1978-09-07 1982-05-06 Standard Telephones Cables Ltd Semiconductor processing
US4363828A (en) * 1979-12-12 1982-12-14 International Business Machines Corp. Method for depositing silicon films and related materials by a glow discharge in a disiland or higher order silane gas
GB2106314A (en) * 1981-09-18 1983-04-07 Philips Electronic Associated Infra-red radiation imaging devices
US4517223A (en) * 1982-09-24 1985-05-14 Sovonics Solar Systems Method of making amorphous semiconductor alloys and devices using microwave energy

Also Published As

Publication number Publication date
EP0160365A1 (en) 1985-11-06
CA1248047A (en) 1989-01-03
JPS60231322A (ja) 1985-11-16
AU568192B2 (en) 1987-12-17
MX159170A (es) 1989-04-26
EP0160365B1 (en) 1989-05-17
AU3961485A (en) 1985-11-07
ES8602974A1 (es) 1985-12-01
ZA851756B (en) 1985-11-27
DE3570326D1 (en) 1989-06-22
JP2579900B2 (ja) 1997-02-12
ES541155A0 (es) 1985-12-01
IN162992B (pt) 1988-07-30
US4504518A (en) 1985-03-12

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