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BR8406046A - Processo para preparar uma placa de circuito impresso de duas e/ou multiplas camadas contendo interligacoes condutivas - Google Patents

Processo para preparar uma placa de circuito impresso de duas e/ou multiplas camadas contendo interligacoes condutivas

Info

Publication number
BR8406046A
BR8406046A BR8406046A BR8406046A BR8406046A BR 8406046 A BR8406046 A BR 8406046A BR 8406046 A BR8406046 A BR 8406046A BR 8406046 A BR8406046 A BR 8406046A BR 8406046 A BR8406046 A BR 8406046A
Authority
BR
Brazil
Prior art keywords
prepare
circuit board
printed circuit
multiple layer
containing conductive
Prior art date
Application number
BR8406046A
Other languages
English (en)
Inventor
James William O'neil
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8406046A publication Critical patent/BR8406046A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
BR8406046A 1983-12-01 1984-11-28 Processo para preparar uma placa de circuito impresso de duas e/ou multiplas camadas contendo interligacoes condutivas BR8406046A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/556,877 US4469777A (en) 1983-12-01 1983-12-01 Single exposure process for preparing printed circuits

Publications (1)

Publication Number Publication Date
BR8406046A true BR8406046A (pt) 1985-09-03

Family

ID=24223191

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8406046A BR8406046A (pt) 1983-12-01 1984-11-28 Processo para preparar uma placa de circuito impresso de duas e/ou multiplas camadas contendo interligacoes condutivas

Country Status (7)

Country Link
US (1) US4469777A (pt)
EP (1) EP0144063B1 (pt)
JP (1) JPS60136292A (pt)
AU (1) AU551316B2 (pt)
BR (1) BR8406046A (pt)
CA (1) CA1219378A (pt)
DE (1) DE3482990D1 (pt)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775611A (en) * 1983-11-10 1988-10-04 Sullivan Donald F Additive printed circuit boards with flat surface and indented primary wiring conductors
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
US4567062A (en) * 1984-10-26 1986-01-28 E. I. Du Pont De Nemours And Company Process for photoformed plastic multistrate using two layer film
US4631111A (en) * 1984-11-27 1986-12-23 E. I. Du Pont De Nemours And Company Dichromic process for preparation of conductive circuit
US4572764A (en) * 1984-12-13 1986-02-25 E. I. Du Pont De Nemours And Company Preparation of photoformed plastic multistrate by via formation first
US4615763A (en) * 1985-01-02 1986-10-07 International Business Machines Corporation Roughening surface of a substrate
US5302494A (en) * 1985-06-10 1994-04-12 The Foxboro Company Multilayer circuit board having microporous layers and process for making same
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US4666818A (en) * 1985-06-10 1987-05-19 The Foxboro Company Method of patterning resist for printed wiring board
US5254435A (en) * 1985-06-10 1993-10-19 The Foxboro Company Method of patterning resist
US5246817A (en) * 1985-08-02 1993-09-21 Shipley Company, Inc. Method for manufacture of multilayer circuit board
US5334488A (en) * 1985-08-02 1994-08-02 Shipley Company Inc. Method for manufacture of multilayer circuit board
US4902610A (en) * 1985-08-02 1990-02-20 Shipley Company Inc. Method for manufacture of multilayer circuit board
US4716093A (en) * 1986-03-17 1987-12-29 E. I. Du Pont De Nemours And Company Solvent developable photoresist composition and process of use
JPS6364394A (ja) * 1986-09-05 1988-03-22 株式会社日立製作所 プリント配線板の製造方法
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4707394A (en) * 1986-09-19 1987-11-17 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
DE3785550T2 (de) * 1986-12-02 1993-11-04 Du Pont Photosensible zusammensetzung mit verbesserter haftung, gegenstaende und verfahren.
US4937172A (en) * 1986-12-02 1990-06-26 E. I. Du Pont De Nemours And Company Photopolymerizable composition having superior adhesion, articles and processes
US5011569A (en) * 1987-02-04 1991-04-30 Andus Corporation Thin film artwork compounds
US4911785A (en) * 1987-02-04 1990-03-27 Andus Corporation The method of forming a thin film artwork compounds
US4897338A (en) * 1987-08-03 1990-01-30 Allied-Signal Inc. Method for the manufacture of multilayer printed circuit boards
JPH01120092A (ja) * 1987-11-02 1989-05-12 Fujitsu Ltd 薄膜絶縁層の形成方法
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
JPH0740496B2 (ja) * 1989-03-01 1995-05-01 シャープ株式会社 電極上への導電性粒子の配置方法
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
DE69021549T2 (de) * 1989-10-13 1996-04-18 Foxboro Co Anwendungsorientiertes automatisiertes bandbonding.
US5260168A (en) * 1989-10-13 1993-11-09 The Foxboro Company Application specific tape automated bonding
JPH04113790U (ja) * 1991-03-22 1992-10-06 三菱重工業株式会社 無菌水供給装置
US5368884A (en) * 1991-11-06 1994-11-29 Nippon Paint Co., Ltd. Method of forming solder mask
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
JP3121213B2 (ja) * 1994-07-27 2000-12-25 株式会社日立製作所 感光性樹脂組成物
US6906423B1 (en) 2001-06-05 2005-06-14 Kabushiki Kaisha Toshiba Mask used for exposing a porous substrate
EP1265468B1 (en) * 2001-06-05 2011-12-28 Kabushiki Kaisha Toshiba Method for manufacturing a composite member
JP2003255562A (ja) * 2002-03-04 2003-09-10 Sharp Corp パターン形成方法及びその方法を用いた表示装置
GB0508189D0 (en) * 2005-04-22 2005-06-01 Eastman Kodak Co Method of forming flexible electronic circuits
JP5469830B2 (ja) * 2008-08-08 2014-04-16 太陽ホールディングス株式会社 パターンの形成方法、及び該方法に用いる感光性組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3350498A (en) * 1965-01-04 1967-10-31 Intellux Inc Multilayer circuit and method of making the same
US3436468A (en) * 1965-05-28 1969-04-01 Texas Instruments Inc Plastic bodies having regions of altered chemical structure and method of making same
US3965277A (en) * 1972-05-09 1976-06-22 Massachusetts Institute Of Technology Photoformed plated interconnection of embedded integrated circuit chips
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
EP0003801B1 (en) * 1978-02-17 1982-06-09 E.I. Du Pont De Nemours And Company Use of photosensitive stratum to create through-hole connections in circuit boards
US4413051A (en) * 1981-05-04 1983-11-01 Dynamics Research Corporation Method for providing high resolution, highly defined, thick film patterns

Also Published As

Publication number Publication date
JPS60136292A (ja) 1985-07-19
DE3482990D1 (de) 1990-09-20
EP0144063A2 (en) 1985-06-12
US4469777A (en) 1984-09-04
JPH038120B2 (pt) 1991-02-05
AU3606784A (en) 1985-06-06
EP0144063B1 (en) 1990-08-16
CA1219378A (en) 1987-03-17
AU551316B2 (en) 1986-04-24
EP0144063A3 (en) 1987-05-20

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