[go: up one dir, main page]

BR8404858A - Processo para catalisar ou conduzir uma reacao de um ou mais produtos quimicos sobre uma superficie,sistema de catalisador,superficie de deposicao de metal sem eletricidade,composicao e placa de circuito impresso - Google Patents

Processo para catalisar ou conduzir uma reacao de um ou mais produtos quimicos sobre uma superficie,sistema de catalisador,superficie de deposicao de metal sem eletricidade,composicao e placa de circuito impresso

Info

Publication number
BR8404858A
BR8404858A BR8404858A BR8404858A BR8404858A BR 8404858 A BR8404858 A BR 8404858A BR 8404858 A BR8404858 A BR 8404858A BR 8404858 A BR8404858 A BR 8404858A BR 8404858 A BR8404858 A BR 8404858A
Authority
BR
Brazil
Prior art keywords
catalyize
conduct
chemicals
electricity
reaction
Prior art date
Application number
BR8404858A
Other languages
English (en)
Inventor
James Watson Neely
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of BR8404858A publication Critical patent/BR8404858A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR8404858A 1983-09-28 1984-09-27 Processo para catalisar ou conduzir uma reacao de um ou mais produtos quimicos sobre uma superficie,sistema de catalisador,superficie de deposicao de metal sem eletricidade,composicao e placa de circuito impresso BR8404858A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53692583A 1983-09-28 1983-09-28
GB08424618A GB2164954A (en) 1983-09-28 1984-09-28 Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein

Publications (1)

Publication Number Publication Date
BR8404858A true BR8404858A (pt) 1985-08-13

Family

ID=26288277

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8404858A BR8404858A (pt) 1983-09-28 1984-09-27 Processo para catalisar ou conduzir uma reacao de um ou mais produtos quimicos sobre uma superficie,sistema de catalisador,superficie de deposicao de metal sem eletricidade,composicao e placa de circuito impresso

Country Status (12)

Country Link
EP (1) EP0141528B1 (pt)
JP (1) JPS60175549A (pt)
KR (1) KR910009982B1 (pt)
AU (1) AU572564B2 (pt)
BR (1) BR8404858A (pt)
CA (1) CA1233158A (pt)
DE (1) DE3481067D1 (pt)
GB (1) GB2164954A (pt)
IL (1) IL73170A (pt)
PH (1) PH23907A (pt)
SG (1) SG79090G (pt)
ZA (1) ZA847657B (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634468A (en) * 1984-05-07 1987-01-06 Shipley Company Inc. Catalytic metal of reduced particle size
US4652311A (en) * 1984-05-07 1987-03-24 Shipley Company Inc. Catalytic metal of reduced particle size
US4701351A (en) * 1986-06-16 1987-10-20 International Business Machines Corporation Seeding process for electroless metal deposition
IT1232841B (it) * 1989-02-03 1992-03-05 Kemifar Spa Composizione attivante per la metallizzazione di substrati isolanti e procedimento di metalizzazione di tali substrati impiegante la stessa
JPH06279602A (ja) * 1993-03-26 1994-10-04 Idemitsu Petrochem Co Ltd 無電解めっき可能なポリオレフィン樹脂成形体
BE1007610A3 (nl) * 1993-10-11 1995-08-22 Philips Electronics Nv Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat.
JP3022226B2 (ja) * 1994-12-08 2000-03-15 大伸化学株式会社 無電解めっき法における触媒化方法
JP5117656B2 (ja) * 2001-09-28 2013-01-16 セーレン株式会社 無電解メッキの前処理方法及びそれを用いてなる導電性材料
EP1464394B1 (en) * 2003-03-31 2007-09-05 Council of Scientific and Industrial Research Supported nanopalladium catalyst for C-C coupling reactions of haloarenes
JP5095909B2 (ja) * 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 触媒組成物および析出方法
JP2005206905A (ja) * 2004-01-23 2005-08-04 Ebara Corp 基板処理方法及び装置、並びに処理液
EP1676937B1 (en) * 2004-11-26 2016-06-01 Rohm and Haas Electronic Materials, L.L.C. UV curable catalyst compositions
EP2610366A3 (en) * 2011-12-31 2014-07-30 Rohm and Haas Electronic Materials LLC Plating catalyst and method
EP2610365B1 (en) * 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Electroless plating method
JP7573322B1 (ja) * 2023-10-30 2024-10-25 奥野製薬工業株式会社 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1543792A (fr) * 1966-12-29 1900-01-01 Ibm Métallisation de matières plastiques
BE755520A (fr) * 1969-09-01 1971-02-01 Dynamit Nobel Ag Procede de metallisation de matieres synthetiques
DE2111136A1 (de) * 1971-03-09 1972-09-28 Kalle Ag Verfahren zur Herstellung von metallisierten Formkoerpern aus makromolekularem Material
GB1403198A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
US3900320A (en) * 1971-09-30 1975-08-19 Bell & Howell Co Activation method for electroless plating
NL7413977A (nl) * 1974-10-25 1976-04-27 Philips Nv Aanbrengen van een geleiderlaagpatroon met op een geringe onderlinge afstand gelegen delen, in het bijzonder bij de vervaardiging van half- geleiderinrichtingen.
DE2531769C3 (de) * 1975-07-16 1978-07-06 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Verwendung von hochstabilen Metalloxid-Dispersionen zur Erzeugung haftfester Metalloxid-Überzüge auf einem festen chemisch ineiten porösen Katalysatorträger
GB1573241A (en) * 1977-03-08 1980-08-20 Western Electric Co Method of depositing a metal on a surface
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
JPS5586533A (en) * 1978-12-26 1980-06-30 Toa Nenryo Kogyo Kk Manufacturing method of granular catalyst coated with polymer
US4259409A (en) * 1980-03-06 1981-03-31 Ses, Incorporated Electroless plating process for glass or ceramic bodies and product
DK427780A (da) * 1980-10-10 1982-04-11 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf

Also Published As

Publication number Publication date
JPH0585219B2 (pt) 1993-12-06
IL73170A (en) 1988-07-31
EP0141528A3 (en) 1987-06-03
IL73170A0 (en) 1985-01-31
KR850002846A (ko) 1985-05-20
DE3481067D1 (de) 1990-02-22
ZA847657B (en) 1985-11-27
EP0141528A2 (en) 1985-05-15
GB2164954A (en) 1986-04-03
GB8424618D0 (en) 1984-11-07
PH23907A (en) 1989-12-18
CA1233158A (en) 1988-02-23
AU572564B2 (en) 1988-05-12
JPS60175549A (ja) 1985-09-09
SG79090G (en) 1990-11-23
KR910009982B1 (ko) 1991-12-09
EP0141528B1 (en) 1990-01-17
AU3354284A (en) 1985-04-04

Similar Documents

Publication Publication Date Title
BR8404858A (pt) Processo para catalisar ou conduzir uma reacao de um ou mais produtos quimicos sobre uma superficie,sistema de catalisador,superficie de deposicao de metal sem eletricidade,composicao e placa de circuito impresso
BR8402712A (pt) Composicao fotopolimerizavel,folha ou rolo de uma composicao fotopolimerizavel,substrato revestido,processo para preparacao de uma chapa de circuito impresso e processo para usinagem quimica
BR8604672A (pt) Compostos,emprego,processo para a fotopolimerizacao de compostos e sistemas fotopolimerizaveis
BR8203558A (pt) Processo para manufatura de folha corrugada sem asbestos folha corrugada sem-asbestos e composicao apropriada para manufatura de folha corrugada sem asbestos
BR9001896A (pt) Composicao de revestimento-base,de base aquosa,sistema de revestimento em multi-camada,de base aquosa,e processo para revestir substratos de metal ou de plastico
BR8406046A (pt) Processo para preparar uma placa de circuito impresso de duas e/ou multiplas camadas contendo interligacoes condutivas
BR8202218A (pt) Solucao aquosa acida para o tratamento de substratos receptivos de metal processo para o tratamento de um substrato receptivo de metal e substrato receptivo
BR8700220A (pt) Folha de aco para pintura e processo para produzir a mesma
ES2023714B3 (es) Instalacion para dosificar y mezclar por lo menos dos componentes de reaccion.
BR8504448A (pt) Processo para embalar folhas de fumo
BR8606166A (pt) Processo para a remocao de agua de uma corrente acida contendo um ou mais compostos acidos e agua,e processo para remocao de agua de uma corrente gasosa compreendendo cloreto metilico e agua
BR8601916A (pt) Processo para a producao de tinta a prova de incrustacoes marinhas
BR8404652A (pt) Processo para inibira corrosao de uma superficie de metal em um sistema aquoso
BR8605980A (pt) Composicao lubrificante,processo para formacao de uma folha de metal e processo de formacao de uma estrutura de componentes de aluminio configurados
BR8505166A (pt) Processo e disposicao de circuito para o controle funcional de instalacoes de alarme de ultra-som
BR8606130A (pt) Sistema para evacuacao de instalacoes de perfuracao maritima
BR8602074A (pt) Processo para a preparacao de composicoes de poliisocianato que apresentam grupos ureia e/ou biureto,composicoes e aplicacao
BR8405423A (pt) Composicao organopolissilo-xanica,composicao de revestimento sem solvente,processo que permite tornar folhas de materiais flexiveis nao aderentes a superficies as quais elas aderem normalmente e materiais
BR8401324A (pt) Processo para a verificacao do teor de uma barra de combustivel
BR8604362A (pt) Processo para a fabricacao de uma folha soluvel em agua para a aplicacao de aditivos de lavanderia
BR9102206A (pt) Processo para a preparacao de polimeros de monoxido de carbono com um ou mais compostos olefinicamente insaturados
BR8507269A (pt) Aparelho para montagem de placa de circuito impresso e placa de circuito impresso protegida em relacao ao ambiente
BR8403535A (pt) Solucao acida aguosa isenta de peroxido para tratamento de substratos de metal receptivos e processo para tratamento de um substrato de metal receptivo
BR8601141A (pt) Tira de aco sem estanho e processo para a producao de uma tira de aco sem estanho
SE455822B (sv) Forfarande for att meta kemikaliehalten i blekvetska inom cellulosamassaindustrin samt apparatur for genomforande av forfarandet

Legal Events

Date Code Title Description
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 27/09/99