|
ATE13561T1
(de)
*
|
1980-08-08 |
1985-06-15 |
Battelle Development Corp |
Zylindrische magnetron-zerstaeuberkathode.
|
|
US4422916A
(en)
*
|
1981-02-12 |
1983-12-27 |
Shatterproof Glass Corporation |
Magnetron cathode sputtering apparatus
|
|
US4444635A
(en)
*
|
1981-07-22 |
1984-04-24 |
Hitachi, Ltd. |
Film forming method
|
|
US4525264A
(en)
*
|
1981-12-07 |
1985-06-25 |
Ford Motor Company |
Cylindrical post magnetron sputtering system
|
|
US4394236A
(en)
*
|
1982-02-16 |
1983-07-19 |
Shatterproof Glass Corporation |
Magnetron cathode sputtering apparatus
|
|
GB2125441A
(en)
*
|
1982-07-13 |
1984-03-07 |
Christopher Elphick |
Tunnel magnetron for cathode sputtering
|
|
US4431505A
(en)
*
|
1982-08-16 |
1984-02-14 |
Vac-Tec Systems, Inc. |
High rate magnetron sputtering of high permeability materials
|
|
US4444643A
(en)
*
|
1982-09-03 |
1984-04-24 |
Gartek Systems, Inc. |
Planar magnetron sputtering device
|
|
EP0103461B1
(en)
*
|
1982-09-10 |
1988-11-17 |
Nippon Telegraph And Telephone Corporation |
Plasma deposition method and apparatus
|
|
US4437966A
(en)
*
|
1982-09-30 |
1984-03-20 |
Gte Products Corporation |
Sputtering cathode apparatus
|
|
US4414086A
(en)
*
|
1982-11-05 |
1983-11-08 |
Varian Associates, Inc. |
Magnetic targets for use in sputter coating apparatus
|
|
US4417968A
(en)
*
|
1983-03-21 |
1983-11-29 |
Shatterproof Glass Corporation |
Magnetron cathode sputtering apparatus
|
|
US4500408A
(en)
*
|
1983-07-19 |
1985-02-19 |
Varian Associates, Inc. |
Apparatus for and method of controlling sputter coating
|
|
US4445997A
(en)
*
|
1983-08-17 |
1984-05-01 |
Shatterproof Glass Corporation |
Rotatable sputtering apparatus
|
|
US4443318A
(en)
*
|
1983-08-17 |
1984-04-17 |
Shatterproof Glass Corporation |
Cathodic sputtering apparatus
|
|
US4466877A
(en)
*
|
1983-10-11 |
1984-08-21 |
Shatterproof Glass Corporation |
Magnetron cathode sputtering apparatus
|
|
US4519885A
(en)
*
|
1983-12-27 |
1985-05-28 |
Shatterproof Glass Corp. |
Method and apparatus for changing sputtering targets in a magnetron sputtering system
|
|
CH659484A5
(de)
*
|
1984-04-19 |
1987-01-30 |
Balzers Hochvakuum |
Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
|
|
US4724058A
(en)
*
|
1984-08-13 |
1988-02-09 |
Vac-Tec Systems, Inc. |
Method and apparatus for arc evaporating large area targets
|
|
FR2596920A1
(fr)
*
|
1986-04-03 |
1987-10-09 |
Saint Roch Sa Glaceries |
Cathode de pulverisation
|
|
ES2040233T3
(es)
*
|
1986-11-21 |
1993-10-16 |
Balzers Aktiengesellschaft |
Dispositivo para la transmision de corrientes electricas a partes rotativas de maquinas.
|
|
AT392291B
(de)
*
|
1987-09-01 |
1991-02-25 |
Miba Gleitlager Ag |
Stabfoermige sowie magnetron- bzw. sputterkathodenanordnung, sputterverfahren, und vorrichtung zur durchfuehrung des verfahrens
|
|
US4778561A
(en)
*
|
1987-10-30 |
1988-10-18 |
Veeco Instruments, Inc. |
Electron cyclotron resonance plasma source
|
|
US5354446A
(en)
*
|
1988-03-03 |
1994-10-11 |
Asahi Glass Company Ltd. |
Ceramic rotatable magnetron sputtering cathode target and process for its production
|
|
US4865708A
(en)
*
|
1988-11-14 |
1989-09-12 |
Vac-Tec Systems, Inc. |
Magnetron sputtering cathode
|
|
US4892633A
(en)
*
|
1988-11-14 |
1990-01-09 |
Vac-Tec Systems, Inc. |
Magnetron sputtering cathode
|
|
US4915805A
(en)
*
|
1988-11-21 |
1990-04-10 |
At&T Bell Laboratories |
Hollow cathode type magnetron apparatus construction
|
|
US5047131A
(en)
*
|
1989-11-08 |
1991-09-10 |
The Boc Group, Inc. |
Method for coating substrates with silicon based compounds
|
|
US5096562A
(en)
*
|
1989-11-08 |
1992-03-17 |
The Boc Group, Inc. |
Rotating cylindrical magnetron structure for large area coating
|
|
US5437778A
(en)
*
|
1990-07-10 |
1995-08-01 |
Telic Technologies Corporation |
Slotted cylindrical hollow cathode/magnetron sputtering device
|
|
US5073245A
(en)
*
|
1990-07-10 |
1991-12-17 |
Hedgcoth Virgle L |
Slotted cylindrical hollow cathode/magnetron sputtering device
|
|
US5200049A
(en)
*
|
1990-08-10 |
1993-04-06 |
Viratec Thin Films, Inc. |
Cantilever mount for rotating cylindrical magnetrons
|
|
JP3516949B2
(ja)
*
|
1990-08-10 |
2004-04-05 |
バイラテック・シン・フィルムズ・インコーポレイテッド |
回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング
|
|
US5100527A
(en)
*
|
1990-10-18 |
1992-03-31 |
Viratec Thin Films, Inc. |
Rotating magnetron incorporating a removable cathode
|
|
US5106474A
(en)
*
|
1990-11-21 |
1992-04-21 |
Viratec Thin Films, Inc. |
Anode structures for magnetron sputtering apparatus
|
|
US5108574A
(en)
*
|
1991-01-29 |
1992-04-28 |
The Boc Group, Inc. |
Cylindrical magnetron shield structure
|
|
AU664995B2
(en)
*
|
1991-04-19 |
1995-12-14 |
Surface Solutions, Incorporated |
Method and apparatus for linear magnetron sputtering
|
|
DE4117518C2
(de)
*
|
1991-05-29 |
2000-06-21 |
Leybold Ag |
Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target
|
|
DE4126236C2
(de)
*
|
1991-08-08 |
2000-01-05 |
Leybold Ag |
Rotierende Magnetron-Kathode und Verwendung einer rotierenden Magnetron-Kathode
|
|
US5344718A
(en)
*
|
1992-04-30 |
1994-09-06 |
Guardian Industries Corp. |
High performance, durable, low-E glass
|
|
US5262028A
(en)
*
|
1992-06-01 |
1993-11-16 |
Sierra Applied Sciences, Inc. |
Planar magnetron sputtering magnet assembly
|
|
US5922176A
(en)
*
|
1992-06-12 |
1999-07-13 |
Donnelly Corporation |
Spark eliminating sputtering target and method for using and making same
|
|
US5399253A
(en)
*
|
1992-12-23 |
1995-03-21 |
Balzers Aktiengesellschaft |
Plasma generating device
|
|
DE69431709T2
(de)
*
|
1993-01-15 |
2004-08-19 |
Von Ardenne Anlagentechnik Gmbh |
Zylindrische mikrowellenabschirmung
|
|
CA2123479C
(en)
*
|
1993-07-01 |
1999-07-06 |
Peter A. Sieck |
Anode structure for magnetron sputtering systems
|
|
US5376455A
(en)
*
|
1993-10-05 |
1994-12-27 |
Guardian Industries Corp. |
Heat-treatment convertible coated glass and method of converting same
|
|
US5405517A
(en)
*
|
1993-12-06 |
1995-04-11 |
Curtis M. Lampkin |
Magnetron sputtering method and apparatus for compound thin films
|
|
US5620577A
(en)
*
|
1993-12-30 |
1997-04-15 |
Viratec Thin Films, Inc. |
Spring-loaded mount for a rotatable sputtering cathode
|
|
US5567289A
(en)
*
|
1993-12-30 |
1996-10-22 |
Viratec Thin Films, Inc. |
Rotating floating magnetron dark-space shield and cone end
|
|
US5413688A
(en)
*
|
1994-02-08 |
1995-05-09 |
Viratec Thin Films, Inc. |
Shutter apparatus for a coating chamber viewport
|
|
US5616225A
(en)
*
|
1994-03-23 |
1997-04-01 |
The Boc Group, Inc. |
Use of multiple anodes in a magnetron for improving the uniformity of its plasma
|
|
US5571393A
(en)
*
|
1994-08-24 |
1996-11-05 |
Viratec Thin Films, Inc. |
Magnet housing for a sputtering cathode
|
|
US5514476A
(en)
*
|
1994-12-15 |
1996-05-07 |
Guardian Industries Corp. |
Low-E glass coating system and insulating glass units made therefrom
|
|
US5557462A
(en)
*
|
1995-01-17 |
1996-09-17 |
Guardian Industries Corp. |
Dual silver layer Low-E glass coating system and insulating glass units made therefrom
|
|
US5527439A
(en)
*
|
1995-01-23 |
1996-06-18 |
The Boc Group, Inc. |
Cylindrical magnetron shield structure
|
|
EP0822996B1
(en)
*
|
1995-04-25 |
2003-07-02 |
VON ARDENNE ANLAGENTECHNIK GmbH |
Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
|
|
DE19623359A1
(de)
*
|
1995-08-17 |
1997-02-20 |
Leybold Ag |
Vorrichtung zum Beschichten eines Substrats
|
|
MX9605168A
(es)
*
|
1995-11-02 |
1997-08-30 |
Guardian Industries |
Sistema de recubrimiento con vidrio de baja emisividad, durable, de alto funcionamiento, neutro, unidades de vidrio aislante elaboradas a partir del mismo, y metodos para la fabricacion de los mismos.
|
|
US5770321A
(en)
*
|
1995-11-02 |
1998-06-23 |
Guardian Industries Corp. |
Neutral, high visible, durable low-e glass coating system and insulating glass units made therefrom
|
|
DE19610253C2
(de)
*
|
1996-03-15 |
1999-01-14 |
Fraunhofer Ges Forschung |
Zerstäubungseinrichtung
|
|
US5733418A
(en)
*
|
1996-05-07 |
1998-03-31 |
Pld Advanced Automation Systems, Inc. |
Sputtering method and apparatus
|
|
DE19651378A1
(de)
*
|
1996-12-11 |
1998-06-18 |
Leybold Systems Gmbh |
Vorrichtung zum Aufstäuben von dünnen Schichten auf flache Substrate
|
|
US6264803B1
(en)
*
|
1997-02-07 |
2001-07-24 |
Steven V. Morgan |
Apparatus and method for sputtering
|
|
US5985115A
(en)
*
|
1997-04-11 |
1999-11-16 |
Novellus Systems, Inc. |
Internally cooled target assembly for magnetron sputtering
|
|
JPH1129863A
(ja)
|
1997-07-10 |
1999-02-02 |
Canon Inc |
堆積膜製造方法
|
|
US6074730A
(en)
*
|
1997-12-31 |
2000-06-13 |
The Boc Group, Inc. |
Broad-band antireflection coating having four sputtered layers
|
|
US6217716B1
(en)
|
1998-05-06 |
2001-04-17 |
Novellus Systems, Inc. |
Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
|
|
DE19830223C1
(de)
*
|
1998-07-07 |
1999-11-04 |
Techno Coat Oberflaechentechni |
Vorrichtung und Verfahren zum mehrlagigen PVD - Beschichten von Substraten
|
|
US6488824B1
(en)
|
1998-11-06 |
2002-12-03 |
Raycom Technologies, Inc. |
Sputtering apparatus and process for high rate coatings
|
|
JP2002529600A
(ja)
|
1998-11-06 |
2002-09-10 |
シヴァク |
高レート・コーティング用のスパッタリング装置および方法
|
|
US5980707A
(en)
*
|
1998-12-18 |
1999-11-09 |
Sierra Applied Sciences, Inc. |
Apparatus and method for a magnetron cathode with moving magnet assembly
|
|
US6964731B1
(en)
|
1998-12-21 |
2005-11-15 |
Cardinal Cg Company |
Soil-resistant coating for glass surfaces
|
|
US6436252B1
(en)
|
2000-04-07 |
2002-08-20 |
Surface Engineered Products Corp. |
Method and apparatus for magnetron sputtering
|
|
EP1321537A4
(en)
|
2000-09-08 |
2006-06-07 |
Asahi Glass Co Ltd |
CYLINDRICAL TARGET AND MANUFACTURING METHOD FOR CYLINDRICAL TARGET
|
|
JP4630443B2
(ja)
|
2000-10-23 |
2011-02-09 |
キヤノン株式会社 |
スパッタリングによる成膜方法
|
|
JP2002212720A
(ja)
|
2001-01-23 |
2002-07-31 |
Canon Inc |
スパッタリング方法およびスパッタリング装置
|
|
JP2002231984A
(ja)
|
2001-02-01 |
2002-08-16 |
Canon Inc |
透明導電膜の成膜方法、半導体層の欠陥領域補償方法、光起電力素子、及びその製造方法
|
|
US7294283B2
(en)
*
|
2001-04-20 |
2007-11-13 |
Applied Process Technologies, Inc. |
Penning discharge plasma source
|
|
WO2002086932A1
(en)
|
2001-04-20 |
2002-10-31 |
Applied Process Technologies |
Magnetic mirror plasma source
|
|
US7399385B2
(en)
*
|
2001-06-14 |
2008-07-15 |
Tru Vue, Inc. |
Alternating current rotatable sputter cathode
|
|
US6589657B2
(en)
|
2001-08-31 |
2003-07-08 |
Von Ardenne Anlagentechnik Gmbh |
Anti-reflection coatings and associated methods
|
|
DE10145201C1
(de)
*
|
2001-09-13 |
2002-11-21 |
Fraunhofer Ges Forschung |
Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
|
|
US20030173217A1
(en)
*
|
2002-03-14 |
2003-09-18 |
Sputtering Components, Inc. |
High-power ion sputtering magnetron
|
|
DE10213049A1
(de)
*
|
2002-03-22 |
2003-10-02 |
Dieter Wurczinger |
Drehbare Rohrkatode
|
|
US7247221B2
(en)
*
|
2002-05-17 |
2007-07-24 |
Applied Films Corporation |
System and apparatus for control of sputter deposition process
|
|
US20040074770A1
(en)
*
|
2002-07-02 |
2004-04-22 |
George Wityak |
Rotary target
|
|
DE10231203B4
(de)
|
2002-07-10 |
2009-09-10 |
Interpane Entwicklungs-Und Beratungsgesellschaft Mbh |
Targetträgeranordnung
|
|
US20060207740A1
(en)
*
|
2002-11-14 |
2006-09-21 |
Martin Weigert |
Processes for producing a sputtering target from a silicon-based alloy, a sputtering target
|
|
DE10253319B3
(de)
*
|
2002-11-14 |
2004-05-27 |
W. C. Heraeus Gmbh & Co. Kg |
Verfahren zum Herstellen eines Sputtertargets aus einer Si-Basislegierung, sowie die Verwendung des Sputtertargets
|
|
US20050276381A1
(en)
*
|
2003-07-02 |
2005-12-15 |
Academy Corporation |
Rotary target locking ring assembly
|
|
US20060157346A1
(en)
*
|
2003-07-04 |
2006-07-20 |
Dirk Cnockaert |
Rotating tubular sputter target assembly
|
|
US7932678B2
(en)
*
|
2003-09-12 |
2011-04-26 |
General Plasma, Inc. |
Magnetic mirror plasma source and method using same
|
|
TWI390062B
(zh)
|
2004-03-05 |
2013-03-21 |
Tosoh Corp |
圓柱形濺射標靶，陶瓷燒結體，以及製造燒結體的方法
|
|
US20050224343A1
(en)
*
|
2004-04-08 |
2005-10-13 |
Richard Newcomb |
Power coupling for high-power sputtering
|
|
DE502004010804D1
(de)
*
|
2004-05-05 |
2010-04-08 |
Applied Materials Gmbh & Co Kg |
Beschichtungsvorrichtung mit grossflächiger Anordnung von drehbaren Magnetronkathoden
|
|
DE102004027897A1
(de)
*
|
2004-06-09 |
2006-01-05 |
Leybold Optics Gmbh |
Vorrichtung und Verfahren zur Zerstäubung mit einem bewegbaren planaren Target
|
|
EP1774563A1
(en)
*
|
2004-07-01 |
2007-04-18 |
Cardinal CG Company |
Cylindrical target with oscillating magnet from magnetron sputtering
|
|
WO2006017349A1
(en)
|
2004-07-12 |
2006-02-16 |
Cardinal Cg Company |
Low-maintenance coatings
|
|
ATE354863T1
(de)
*
|
2004-08-10 |
2007-03-15 |
Applied Materials Gmbh & Co Kg |
Magnetronsputtereinrichtung, zylinderkathode und verfahren zur aufbringung von dünnen mehrkomponentenschichten auf einem substrat
|
|
EP1626432A1
(de)
*
|
2004-08-10 |
2006-02-15 |
Applied Films GmbH & Co. KG |
Magnetronsputtereinrichtung, Zylinderkathode und Verfahren zur Aufbringung von dünnen Schichten aus unterschiedlichen Materialien auf einem Substrat
|
|
US20060049043A1
(en)
*
|
2004-08-17 |
2006-03-09 |
Matuska Neal W |
Magnetron assembly
|
|
US20060065524A1
(en)
*
|
2004-09-30 |
2006-03-30 |
Richard Newcomb |
Non-bonded rotatable targets for sputtering
|
|
ATE392007T1
(de)
*
|
2004-10-18 |
2008-04-15 |
Bekaert Advanced Coatings |
Endblock für eine sputter-vorrichtung mit drehbarem target
|
|
PT1799876E
(pt)
*
|
2004-10-18 |
2009-03-30 |
Bekaert Advanced Coatings |
Bloco terminal liso para transportar um alvo de pulverização rotativo
|
|
US20060096855A1
(en)
*
|
2004-11-05 |
2006-05-11 |
Richard Newcomb |
Cathode arrangement for atomizing a rotatable target pipe
|
|
JP2008520525A
(ja)
*
|
2004-11-15 |
2008-06-19 |
日本板硝子株式会社 |
配列構造を有するコーティングの蒸着方法および設備
|
|
US7923114B2
(en)
|
2004-12-03 |
2011-04-12 |
Cardinal Cg Company |
Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films
|
|
US8092660B2
(en)
|
2004-12-03 |
2012-01-10 |
Cardinal Cg Company |
Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films
|
|
EP1698715A1
(de)
*
|
2005-03-03 |
2006-09-06 |
Applied Films GmbH & Co. KG |
Anlage zum Beschichten eines Substrats und Einschubelement
|
|
CN101137764B
(zh)
*
|
2005-03-11 |
2010-12-01 |
贝卡尔特先进涂层公司 |
单一的直角端块
|
|
US20060207871A1
(en)
*
|
2005-03-16 |
2006-09-21 |
Gennady Yumshtyk |
Sputtering devices and methods
|
|
EP1722005B1
(de)
*
|
2005-05-13 |
2007-07-04 |
Applied Materials GmbH & Co. KG |
Verfahren zum Betreiben einer Sputterkathode mit einem Target
|
|
US20060278524A1
(en)
*
|
2005-06-14 |
2006-12-14 |
Stowell Michael W |
System and method for modulating power signals to control sputtering
|
|
US20060278521A1
(en)
*
|
2005-06-14 |
2006-12-14 |
Stowell Michael W |
System and method for controlling ion density and energy using modulated power signals
|
|
US20060289304A1
(en)
*
|
2005-06-22 |
2006-12-28 |
Guardian Industries Corp. |
Sputtering target with slow-sputter layer under target material
|
|
EP1775353B1
(de)
*
|
2005-09-15 |
2008-10-08 |
Applied Materials GmbH & Co. KG |
Beschichtungsanlage und Verfahren zum Betrieb einer Beschichtungsanlage
|
|
US20070080056A1
(en)
*
|
2005-10-07 |
2007-04-12 |
German John R |
Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths
|
|
AT8697U1
(de)
*
|
2005-10-14 |
2006-11-15 |
Plansee Se |
Rohrtarget
|
|
US20070095281A1
(en)
*
|
2005-11-01 |
2007-05-03 |
Stowell Michael W |
System and method for power function ramping of microwave liner discharge sources
|
|
US7842355B2
(en)
*
|
2005-11-01 |
2010-11-30 |
Applied Materials, Inc. |
System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
|
|
KR20080080365A
(ko)
|
2005-12-13 |
2008-09-03 |
오씨 외를리콘 발처스 악티엔게젤샤프트 |
스퍼터 타겟의 개선된 이용도
|
|
US7989094B2
(en)
*
|
2006-04-19 |
2011-08-02 |
Cardinal Cg Company |
Opposed functional coatings having comparable single surface reflectances
|
|
JP5080573B2
(ja)
*
|
2006-06-19 |
2012-11-21 |
ソレラス・アドヴァンスト・コーティングス・ナムローゼ・フェンノートシャップ |
スパッタリング設備のエンドブロック用のインサート部品
|
|
US20080011599A1
(en)
|
2006-07-12 |
2008-01-17 |
Brabender Dennis M |
Sputtering apparatus including novel target mounting and/or control
|
|
US20080047831A1
(en)
*
|
2006-08-24 |
2008-02-28 |
Hendryk Richert |
Segmented/modular magnet bars for sputtering target
|
|
DE102007049735B4
(de)
*
|
2006-10-17 |
2012-03-29 |
Von Ardenne Anlagentechnik Gmbh |
Versorgungsendblock für ein Rohrmagnetron
|
|
US20080213071A1
(en)
*
|
2007-02-09 |
2008-09-04 |
Applied Materials, Inc. |
Transport device in an installation for the treatment of substrates
|
|
JP5467735B2
(ja)
|
2007-07-02 |
2014-04-09 |
東ソー株式会社 |
円筒形スパッタリングターゲット
|
|
JP2009024230A
(ja)
*
|
2007-07-20 |
2009-02-05 |
Kobe Steel Ltd |
スパッタリング装置
|
|
CA2664368A1
(en)
|
2007-09-14 |
2009-03-19 |
Cardinal Cg Company |
Low-maintenance coating technology
|
|
JP5387118B2
(ja)
|
2008-06-10 |
2014-01-15 |
東ソー株式会社 |
円筒形スパッタリングターゲット及びその製造方法
|
|
DE202008018196U1
(de)
|
2008-08-26 |
2012-02-02 |
Von Ardenne Anlagentechnik Gmbh |
Versorgungsendblock
|
|
DE102008039664A1
(de)
|
2008-08-26 |
2010-05-12 |
Von Ardenne Anlagentechnik Gmbh |
Versorgungsendblock
|
|
DE102009005512B4
(de)
|
2009-01-20 |
2017-01-26 |
Von Ardenne Gmbh |
Verfahren zum Betrieb einer Rohrmagnetronanordnung zum Sputtern
|
|
US8110738B2
(en)
*
|
2009-02-20 |
2012-02-07 |
Miasole |
Protective layer for large-scale production of thin-film solar cells
|
|
US8115095B2
(en)
*
|
2009-02-20 |
2012-02-14 |
Miasole |
Protective layer for large-scale production of thin-film solar cells
|
|
US8182662B2
(en)
*
|
2009-03-27 |
2012-05-22 |
Sputtering Components, Inc. |
Rotary cathode for magnetron sputtering apparatus
|
|
FR2944293B1
(fr)
|
2009-04-10 |
2012-05-18 |
Saint Gobain Coating Solutions |
Procede d'elaboration par projection thermique d'une cible
|
|
FR2944295B1
(fr)
|
2009-04-10 |
2014-08-15 |
Saint Gobain Coating Solutions |
Cible a base de molybdene et procede d'elaboration par projection thermique d'une cible
|
|
US7897020B2
(en)
*
|
2009-04-13 |
2011-03-01 |
Miasole |
Method for alkali doping of thin film photovoltaic materials
|
|
US8134069B2
(en)
*
|
2009-04-13 |
2012-03-13 |
Miasole |
Method and apparatus for controllable sodium delivery for thin film photovoltaic materials
|
|
US7785921B1
(en)
*
|
2009-04-13 |
2010-08-31 |
Miasole |
Barrier for doped molybdenum targets
|
|
DE102009033546B4
(de)
|
2009-07-16 |
2014-07-17 |
Von Ardenne Anlagentechnik Gmbh |
Versorgungsendblock für ein rotierendes Magnetron
|
|
US9284639B2
(en)
*
|
2009-07-30 |
2016-03-15 |
Apollo Precision Kunming Yuanhong Limited |
Method for alkali doping of thin film photovoltaic materials
|
|
US20110067998A1
(en)
*
|
2009-09-20 |
2011-03-24 |
Miasole |
Method of making an electrically conductive cadmium sulfide sputtering target for photovoltaic manufacturing
|
|
US8709548B1
(en)
|
2009-10-20 |
2014-04-29 |
Hanergy Holding Group Ltd. |
Method of making a CIG target by spray forming
|
|
US8709335B1
(en)
|
2009-10-20 |
2014-04-29 |
Hanergy Holding Group Ltd. |
Method of making a CIG target by cold spraying
|
|
US20110162696A1
(en)
*
|
2010-01-05 |
2011-07-07 |
Miasole |
Photovoltaic materials with controllable zinc and sodium content and method of making thereof
|
|
DE102010063685B4
(de)
*
|
2010-02-21 |
2012-07-12 |
Von Ardenne Anlagentechnik Gmbh |
Magnetronanordnung mit einem Hohltarget
|
|
US8398834B2
(en)
|
2010-04-02 |
2013-03-19 |
NuvoSun, Inc. |
Target utilization improvement for rotatable magnetrons
|
|
US7935558B1
(en)
|
2010-10-19 |
2011-05-03 |
Miasole |
Sodium salt containing CIG targets, methods of making and methods of use thereof
|
|
US8048707B1
(en)
|
2010-10-19 |
2011-11-01 |
Miasole |
Sulfur salt containing CIG targets, methods of making and methods of use thereof
|
|
US9169548B1
(en)
|
2010-10-19 |
2015-10-27 |
Apollo Precision Fujian Limited |
Photovoltaic cell with copper poor CIGS absorber layer and method of making thereof
|
|
JP5887819B2
(ja)
|
2010-12-06 |
2016-03-16 |
東ソー株式会社 |
酸化亜鉛焼結体、それから成るスパッタリングターゲットおよび酸化亜鉛薄膜
|
|
US20130032476A1
(en)
*
|
2011-08-04 |
2013-02-07 |
Sputtering Components, Inc. |
Rotary cathodes for magnetron sputtering system
|
|
US10043921B1
(en)
|
2011-12-21 |
2018-08-07 |
Beijing Apollo Ding Rong Solar Technology Co., Ltd. |
Photovoltaic cell with high efficiency cigs absorber layer with low minority carrier lifetime and method of making thereof
|
|
GB201200574D0
(en)
|
2012-01-13 |
2012-02-29 |
Gencoa Ltd |
In-vacuum rotational device
|
|
US9255323B2
(en)
|
2012-06-18 |
2016-02-09 |
Apollo Precision Fujian Limited |
Sputtering target including a feature to reduce chalcogen build up and arcing on a backing tube
|
|
US9508532B2
(en)
|
2013-03-13 |
2016-11-29 |
Bb Plasma Design Ab |
Magnetron plasma apparatus
|
|
US9368330B2
(en)
|
2014-05-02 |
2016-06-14 |
Bh5773 Ltd |
Sputtering targets and methods
|
|
CN107250427A
(zh)
*
|
2015-02-24 |
2017-10-13 |
株式会社爱发科 |
磁控管溅射装置用旋转式阴极单元
|
|
GB201505528D0
(en)
|
2015-03-31 |
2015-05-13 |
Gencoa Ltd |
Rotational device-III
|
|
EP3541762B1
(en)
|
2016-11-17 |
2022-03-02 |
Cardinal CG Company |
Static-dissipative coating technology
|
|
US11274364B2
(en)
|
2017-06-28 |
2022-03-15 |
Solayer Gmbh |
Sputter devices and methods
|