BR8100197A - Conjunto de montagem para pastilha com circuito integrado e o processo para a sua fabricacao - Google Patents

Conjunto de montagem para pastilha com circuito integrado e o processo para a sua fabricacao

Info

Publication number: BR8100197A
Authority: BR; Brazil
Prior art keywords: insert; manufacturing; assembly set; circuit; insert circuit
Prior art date: 1980-01-18

Application number

BR8100197A

Other languages

English (en)

Inventor

B Olsson

J Keller

Original Assignee

Amp Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-01-18

Filing date

1981-01-14

Publication date

1981-08-04

1981-01-14 Application filed by Amp Inc filed Critical Amp Inc

1981-08-04 Publication of BR8100197A publication Critical patent/BR8100197A/pt

Classifications

- H10W70/461—
- H10W70/481—
- H10W72/0198—
- H10W72/073—
- H10W72/07336—
- H10W72/075—
- H10W72/354—
- H10W72/884—
- H10W74/00—
- H10W90/736—
- H10W90/756—

BR8100197A 1980-01-18 1981-01-14 Conjunto de montagem para pastilha com circuito integrado e o processo para a sua fabricacao BR8100197A (pt)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/113,159 US4339768A (en)	1980-01-18	1980-01-18	Transistors and manufacture thereof

Publications (1)

Publication Number	Publication Date
BR8100197A true BR8100197A (pt)	1981-08-04

Family

ID=22347887

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR8100197A BR8100197A (pt)	1980-01-18	1981-01-14	Conjunto de montagem para pastilha com circuito integrado e o processo para a sua fabricacao

Country Status (12)

Country	Link
US (1)	US4339768A (pt)
EP (1)	EP0034001B1 (pt)
JP (1)	JPS56108254A (pt)
AR (1)	AR222930A1 (pt)
AT (1)	ATE4757T1 (pt)
AU (1)	AU541489B2 (pt)
BR (1)	BR8100197A (pt)
CA (1)	CA1162392A (pt)
DE (1)	DE3160887D1 (pt)
ES (2)	ES498581A0 (pt)
HK (1)	HK81986A (pt)
MX (1)	MX149018A (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59135753A (ja) *	1983-01-25	1984-08-04	Toshiba Corp	半導体装置とその製造方法
IT1213139B (it) *	1984-02-17	1989-12-14	Ates Componenti Elettron	Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
FR2588122B1 (fr) *	1985-10-01	1988-06-24	Radiotechnique Compelec	Dispositif semi-conducteur de puissance pour montage en surface
JPS61260657A (ja) *	1985-05-15	1986-11-18	Mitsubishi Electric Corp	半導体装置
DE3621994A1 (de) *	1986-07-01	1988-01-14	Bbc Brown Boveri & Cie	Leistungshalbleitermodul
DE3717489A1 (de) *	1987-05-23	1988-12-01	Asea Brown Boveri	Leistungshalbleitermodul und verfahren zur herstellung des moduls
AU604904B2 (en) *	1987-06-05	1991-01-03	Nippondenso Co. Ltd.	A resin sealed semiconductor device and a method for making the same
US4846701A (en) *	1987-12-16	1989-07-11	Amp Incorporated	Quick disconnect smart connector
US5019892A (en) *	1988-02-18	1991-05-28	Amp Incorporated	Chip carrier with accumulator
US5059746A (en) *	1989-05-01	1991-10-22	Amp Incorporated	Housing assembly for electronic components
JP2527828B2 (ja) *	1990-02-27	1996-08-28	三菱電機株式会社	半導体パッケ―ジ
DE69123626T2 (de) *	1990-04-16	1997-04-17	Fujitsu Ltd	Chipträger zum Herstellen einer Mikrowellen-Halbleiteranordnung hoher Leistung durch Anordnen eines Halbleiterchips darauf
ATE154990T1 (de) *	1991-04-10	1997-07-15	Caddock Electronics Inc	Schichtwiderstand
JP3018554B2 (ja) *	1991-04-25	2000-03-13	株式会社日立製作所	半導体モジュ−ル及びその製造方法
US6020219A (en) *	1994-06-16	2000-02-01	Lucent Technologies Inc.	Method of packaging fragile devices with a gel medium confined by a rim member
JPH08139113A (ja) *	1994-11-09	1996-05-31	Mitsubishi Electric Corp	樹脂封止型半導体装置
JP3353526B2 (ja) *	1995-03-23	2002-12-03	株式会社デンソー	半導体パッケージ及びその製造方法
US5738269A (en) *	1996-04-19	1998-04-14	Motorola, Inc.	Method for forming a solder bump
DE19621000C2 (de)	1996-05-24	1999-01-28	Heraeus Sensor Nite Gmbh	Temperatur-Sensor mit einem Meßwiderstand
DE10221857A1 (de) *	2002-05-16	2003-11-27	Osram Opto Semiconductors Gmbh	Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
FR2902277B1 (fr) *	2006-06-13	2008-09-05	Valeo Electronique Sys Liaison	Support pour composant electrique et dispositif electrique comprenant le support et le composant
EP4639617A1 (en) *	2022-12-22	2025-10-29	Dynex Semiconductor Limited	Power semiconductor module

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3574815A (en) *	1966-07-13	1971-04-13	Motorola Inc	Method of fabricating a plastic encapsulated semiconductor assembly
US3532944A (en) *	1966-11-04	1970-10-06	Rca Corp	Semiconductor devices having soldered joints
US3606673A (en) *	1968-08-15	1971-09-21	Texas Instruments Inc	Plastic encapsulated semiconductor devices
US3706915A (en) *	1970-03-09	1972-12-19	Gen Electric	Semiconductor device with low impedance bond
US4125740A (en) *	1973-09-26	1978-11-14	Sgs-Ates Componenti Elettronici S.P.A.	Resin-encased microelectronic module
DE2714483A1 (de) *	1975-09-15	1978-10-12	Siemens Ag	Verfahren zur teilautomatisierten kontaktierung von halbleitersystemen
DE2608250C3 (de) *	1976-02-28	1985-06-05	Telefunken electronic GmbH, 7100 Heilbronn	Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
IN148328B (pt) *	1977-04-18	1981-01-17	Rca Corp
JPS53132975A (en) *	1977-04-26	1978-11-20	Toshiba Corp	Semiconductor device
US4158745A (en) *	1977-10-27	1979-06-19	Amp Incorporated	Lead frame having integral terminal tabs

1980
- 1980-01-18 US US06/113,159 patent/US4339768A/en not_active Expired - Lifetime
1981
- 1981-01-06 AU AU65994/81A patent/AU541489B2/en not_active Ceased
- 1981-01-06 AT AT81300037T patent/ATE4757T1/de not_active IP Right Cessation
- 1981-01-06 DE DE8181300037T patent/DE3160887D1/de not_active Expired
- 1981-01-06 EP EP81300037A patent/EP0034001B1/en not_active Expired
- 1981-01-14 AR AR283947A patent/AR222930A1/es active
- 1981-01-14 BR BR8100197A patent/BR8100197A/pt not_active IP Right Cessation
- 1981-01-15 MX MX185568A patent/MX149018A/es unknown
- 1981-01-16 CA CA000368647A patent/CA1162392A/en not_active Expired
- 1981-01-16 ES ES498581A patent/ES498581A0/es active Granted
- 1981-01-19 JP JP711981A patent/JPS56108254A/ja active Pending
- 1981-02-04 ES ES1981255953U patent/ES255953Y/es not_active Expired
1986
- 1986-10-30 HK HK819/86A patent/HK81986A/xx unknown

Also Published As

Publication number	Publication date
JPS56108254A (en)	1981-08-27
EP0034001A3 (en)	1981-08-26
ES8204224A1 (es)	1982-04-01
US4339768A (en)	1982-07-13
CA1162392A (en)	1984-02-21
HK81986A (en)	1986-11-07
MX149018A (es)	1983-08-08
DE3160887D1 (en)	1983-10-27
AU6599481A (en)	1981-07-23
EP0034001B1 (en)	1983-09-21
AU541489B2 (en)	1985-01-10
ES255953U (es)	1981-06-01
AR222930A1 (es)	1981-06-30
ATE4757T1 (de)	1983-10-15
EP0034001A2 (en)	1981-08-19
ES255953Y (es)	1981-12-01
ES498581A0 (es)	1982-04-01

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Legal Events

Date	Code	Title	Description
1996-03-19	MK	Patent expired	Effective date: 19960114