BR8005816A - Semicondutor de potencia - Google Patents

Semicondutor de potencia

Info

Publication number: BR8005816A
Authority: BR; Brazil
Prior art keywords: semiconductor; power
Prior art date: 1979-09-13

Application number

BR8005816A

Other languages

English (en)

Inventor

H Holich

A Jester

Original Assignee

Bbc Brown Boveri & Cie

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-09-13

Filing date

1980-09-11

Publication date

1981-03-24

1980-09-11 Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie

1981-03-24 Publication of BR8005816A publication Critical patent/BR8005816A/pt

Classifications

- H10W70/40—
- H10W76/138—

BR8005816A 1979-09-13 1980-09-11 Semicondutor de potencia BR8005816A (pt)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19792937049 DE2937049A1 (de)	1979-09-13	1979-09-13	Leistungs-halbleiterbauelement

Publications (1)

Publication Number	Publication Date
BR8005816A true BR8005816A (pt)	1981-03-24

Family

ID=6080799

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR8005816A BR8005816A (pt)	1979-09-13	1980-09-11	Semicondutor de potencia

Country Status (6)

Country	Link
US (1)	US4407006A (pt)
EP (1)	EP0025612B1 (pt)
JP (1)	JPS5648143A (pt)
BR (1)	BR8005816A (pt)
CA (1)	CA1151318A (pt)
DE (2)	DE2937049A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3031912A1 (de) *	1980-08-23	1982-04-01	Brown, Boveri & Cie Ag, 6800 Mannheim	Anordnung zur potentialunabhaengigen waermeabfuehrung
JPS60217864A (ja) *	1984-04-12	1985-10-31	Kazuo Hara	調理食品の製造方法
US4745455A (en) *	1986-05-16	1988-05-17	General Electric Company	Silicon packages for power semiconductor devices
JPS63169952A (ja) *	1987-01-07	1988-07-13	Akio Sugi	炊飯方法
US4879828A (en) *	1988-02-29	1989-11-14	Dieringer Dale E	Constant force spring for cartridge magazines
US5243217A (en) *	1990-11-03	1993-09-07	Fuji Electric Co., Ltd.	Sealed semiconductor device with protruding portion
US5293301A (en) *	1990-11-30	1994-03-08	Shinko Electric Industries Co., Ltd.	Semiconductor device and lead frame used therein
US5344795A (en) *	1992-09-22	1994-09-06	Microelectronics And Computer Technology Corporation	Method for encapsulating an integrated circuit using a removable heatsink support block
US5309321A (en) *	1992-09-22	1994-05-03	Microelectronics And Computer Technology Corporation	Thermally conductive screen mesh for encapsulated integrated circuit packages
US5265321A (en) *	1992-09-22	1993-11-30	Microelectronics And Computer Technology Corporation	Integrated circuit structure with heat exchanger elements secured thereto and method of making
US5510650A (en) *	1994-09-02	1996-04-23	General Motors Corporation	Low mechanical stress, high electrical and thermal conductance semiconductor die mount
DE19732738A1 (de) *	1997-07-30	1999-02-04	Asea Brown Boveri	Leistungshalbleiterbauelemente mit druckausgleichender Kontaktplatte
EP1182701A1 (de) *	2000-08-21	2002-02-27	Abb Research Ltd.	Verfahren zur Herstellung eines Pufferelementes zur Verminderung von mechanischen Spannungen
US7922767B2 (en)	2007-07-07	2011-04-12	Jmea Corporation	Disk fusion implant
JP5386863B2 (ja) *	2008-06-20	2014-01-15	株式会社デンソー	半導体装置
US8431445B2 (en)	2011-06-01	2013-04-30	Toyota Motor Engineering & Manufacturing North America, Inc.	Multi-component power structures and methods for forming the same
US9901457B2 (en)	2014-10-16	2018-02-27	Jmea Corporation	Coiling implantable prostheses
DE112017007965B4 (de)	2017-08-31	2024-10-02	Mitsubishi Electric Corporation	Federelektrode für ein Druckkontaktgehäuse-Leistungshalbleitermodul
US20200024025A1 (en) *	2018-07-19	2020-01-23	Maluki Takumah	Insert lock tab wrap folder and adhesive tab wrap folder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1057241B (de) *	1955-12-12	1959-05-14	Siemens Ag	Gleichrichteranordnung mit Halbleiterelement
US2927953A (en) *	1957-01-28	1960-03-08	Itt	Electrical lead conductor
DE1141029B (de) *	1960-06-23	1962-12-13	Siemens Ag	Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3296501A (en) *	1962-11-07	1967-01-03	Westinghouse Electric Corp	Metallic ceramic composite contacts for semiconductor devices
US3273029A (en) *	1963-08-23	1966-09-13	Hoffman Electronics Corp	Method of attaching leads to a semiconductor body and the article formed thereby
GB1004020A (en) *	1964-04-24	1965-09-08	Standard Telephones Cables Ltd	Improvements in or relating to the mounting of electrical components
JPS603776B2 (ja) *	1977-06-03	1985-01-30	株式会社日立製作所	半導体素子
DE2840945C3 (de) *	1978-09-20	1981-07-23	Hamburger Stahlwerke Gmbh, 2103 Hamburg	Verfahren und Vorrichtung zum Vorwärmen von wenigstens 0,5 Prozent Kohlenstoff enthaltendem Eisenschwamm
DE2855493A1 (de) *	1978-12-22	1980-07-03	Bbc Brown Boveri & Cie	Leistungs-halbleiterbauelement
US4315591A (en) *	1979-03-08	1982-02-16	General Electric Company	Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer

1979
- 1979-09-13 DE DE19792937049 patent/DE2937049A1/de not_active Withdrawn
1980
- 1980-07-07 DE DE8080200657T patent/DE3061343D1/de not_active Expired
- 1980-07-07 EP EP80200657A patent/EP0025612B1/de not_active Expired
- 1980-08-05 JP JP10682580A patent/JPS5648143A/ja active Granted
- 1980-08-29 US US06/182,822 patent/US4407006A/en not_active Expired - Lifetime
- 1980-09-11 BR BR8005816A patent/BR8005816A/pt unknown
- 1980-09-11 CA CA000360124A patent/CA1151318A/en not_active Expired

Also Published As

Publication number	Publication date
CA1151318A (en)	1983-08-02
DE3061343D1 (en)	1983-01-20
US4407006A (en)	1983-09-27
DE2937049A1 (de)	1981-04-02
EP0025612B1 (de)	1982-12-15
JPS6262050B2 (pt)	1987-12-24
EP0025612A1 (de)	1981-03-25
JPS5648143A (en)	1981-05-01

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