IT1112434B - Custodia per disposizione di semiconduttori - Google Patents

Custodia per disposizione di semiconduttori

Info

Publication number: IT1112434B
Authority: IT; Italy
Prior art keywords: semiconductors; arrangement; case
Prior art date: 1978-05-03

Application number

IT21967/79A

Other languages

English (en)

Other versions

IT7921967A0 (it

Original Assignee

Siemens Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-05-03

Filing date

1979-04-19

Publication date

1986-01-13

1979-04-19 Application filed by Siemens Ag filed Critical Siemens Ag

1979-04-19 Publication of IT7921967A0 publication Critical patent/IT7921967A0/it

1986-01-13 Application granted granted Critical

1986-01-13 Publication of IT1112434B publication Critical patent/IT1112434B/it

Classifications

- H10W74/111—
- H10W40/10—
- H10W76/161—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

IT21967/79A 1978-05-03 1979-04-19 Custodia per disposizione di semiconduttori IT1112434B (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE2819499A DE2819499C3 (de)	1978-05-03	1978-05-03	Gehäuse für eine Halbleiteranordnung

Publications (2)

Publication Number	Publication Date
IT7921967A0 IT7921967A0 (it)	1979-04-19
IT1112434B true IT1112434B (it)	1986-01-13

Family

ID=6038612

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IT21967/79A IT1112434B (it)	1978-05-03	1979-04-19	Custodia per disposizione di semiconduttori

Country Status (6)

Country	Link
US (1)	US4230901A (it)
JP (1)	JPS54144874A (it)
DE (1)	DE2819499C3 (it)
FR (1)	FR2425149A1 (it)
GB (1)	GB2020489B (it)
IT (1)	IT1112434B (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4367523A (en) *	1981-02-17	1983-01-04	Electronic Devices, Inc.	Rectifier bridge unit
US4471407A (en) *	1982-09-27	1984-09-11	Kohler Company	Combination heat sink for a semiconductor
US4633573A (en) *	1982-10-12	1987-01-06	Aegis, Inc.	Microcircuit package and sealing method
US4477828A (en) *	1982-10-12	1984-10-16	Scherer Jeremy D	Microcircuit package and sealing method
DE3443702A1 (de) *	1984-11-30	1986-06-05	Degussa Ag, 6000 Frankfurt	Vorrichtung zur vermeidung von lokalen ueberhitzungen an messumformern
EP0854506A3 (en) *	1987-03-04	1999-03-31	Canon Kabushiki Kaisha	Electrically connecting member and electric circuit member
EP0687588B1 (en) *	1991-09-03	1999-01-07	Honda Giken Kogyo Kabushiki Kaisha	Regenerative braking system in a motor vehicle
DE4224720A1 (de) *	1992-07-27	1994-02-03	Duerrwaechter E Dr Doduco	Gehäuse für eine elektronische Schaltung mit einem Leistungshalbleiter
DE59504639D1 (de) *	1994-05-02	1999-02-04	Siemens Matsushita Components	Verkapselung für elektronische bauelemente
JP3357220B2 (ja) *	1995-07-07	2002-12-16	三菱電機株式会社	半導体装置
DE19533298A1 (de) *	1995-09-08	1997-03-13	Siemens Ag	Elektronisches Modul mit Leistungsbauelementen
US5810608A (en) *	1996-10-15	1998-09-22	Intel Corporation	Contact pad extender for integrated circuit packages
DE19721610A1 (de) *	1997-05-23	1998-11-26	Abb Daimler Benz Transp	Drosselbaugruppe für ein Stromrichtergerät
US5825107A (en) *	1997-06-13	1998-10-20	General Electric Company	Drive package for a dynamoelectric machine
US5932839A (en) *	1997-11-04	1999-08-03	Ren; Jane	Method for dissipating heat away from a heat sensitive device using bicarbonate compositions
DE102007025338B4 (de) *	2007-05-31	2015-02-05	Tyco Electronics Amp Gmbh	Verfahren zum Abdichten eines Gehäuses und elektrische Komponente

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3622419A (en) *	1969-10-08	1971-11-23	Motorola Inc	Method of packaging an optoelectrical device
US3848077A (en) *	1970-10-16	1974-11-12	M Whitman	Package for electronic semiconductor devices
GB1397181A (en) *	1973-01-16	1975-06-11	Lucas Electrical Co Ltd	Film circuit assemblies
IT992650B (it) *	1973-07-19	1975-09-30	Ates Componenti Elettron	Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato

1978
- 1978-05-03 DE DE2819499A patent/DE2819499C3/de not_active Expired
1979
- 1979-04-19 IT IT21967/79A patent/IT1112434B/it active
- 1979-04-27 GB GB7914796A patent/GB2020489B/en not_active Expired
- 1979-05-01 US US06/035,271 patent/US4230901A/en not_active Expired - Lifetime
- 1979-05-02 JP JP5465779A patent/JPS54144874A/ja active Pending
- 1979-05-02 FR FR7910996A patent/FR2425149A1/fr not_active Withdrawn

Also Published As

Publication number	Publication date
US4230901A (en)	1980-10-28
GB2020489B (en)	1982-05-12
IT7921967A0 (it)	1979-04-19
GB2020489A (en)	1979-11-14
DE2819499C3 (de)	1981-01-29
DE2819499B2 (de)	1980-05-22
DE2819499A1 (de)	1979-11-08
JPS54144874A (en)	1979-11-12
FR2425149A1 (fr)	1979-11-30

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