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BR0211270A - Contra-eletrodo segmentado para um sistema de tratamento eletrolìtico - Google Patents

Contra-eletrodo segmentado para um sistema de tratamento eletrolìtico

Info

Publication number
BR0211270A
BR0211270A BR0211270-1A BR0211270A BR0211270A BR 0211270 A BR0211270 A BR 0211270A BR 0211270 A BR0211270 A BR 0211270A BR 0211270 A BR0211270 A BR 0211270A
Authority
BR
Brazil
Prior art keywords
workpieces
electrolytic treatment
contact
counter electrode
treatment system
Prior art date
Application number
BR0211270-1A
Other languages
English (en)
Other versions
BR0211270B1 (pt
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BR0211270A publication Critical patent/BR0211270A/pt
Publication of BR0211270B1 publication Critical patent/BR0211270B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

"CONTRA-ELETRODO SEGMENTADO PARA UM SISTEMA DE TRATAMENTO ELETROLìTICO". De maneira a uniformizar o tratamento eletrolítico de peças 9 constituídas de material eletricamente não-condutivo e recebendo uma metalização de base muito delgada 6, 8, um dispositivo é empregado de uma maneira de acordo com a invenção que compreende dispositivos para levar o líquido de tratamento a entrar em contato com as peças 9, meios 10 para contato elétrico das peças 9 em locais de contato e contra-eletrodos 5.x que são de tal maneira situados que as peças 9 podem ser dispostas em relação oposta aos mesmos, com isto os contra-eletrodos 5.x são individualmente subdivididos em pelo menos segmentos de eletrodo 13.x de tal maneira que pelo menos um segmento de eletrodo próximo ao contato 13.1 e pelo menos um segmento de eletrodo distal do contato 13.4 e possivelmente segmentos de eletrodo adicionais 13.2, 13.3 entre estes interpostos são fornecidos e cada segmento de eletrodo 13.x é alimentado por uma fonte de corrente em separado 15.x.
BRPI0211270-1A 2001-08-22 2002-08-21 dispositivo para tratamento eletrolìtico de peças e método de tratamento eletrolìtico de peças. BR0211270B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141056A DE10141056C2 (de) 2001-08-22 2001-08-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
PCT/EP2002/009343 WO2003018878A2 (en) 2001-08-22 2002-08-21 Segmented counterelectrode for an electrolytic treatment system

Publications (2)

Publication Number Publication Date
BR0211270A true BR0211270A (pt) 2004-12-21
BR0211270B1 BR0211270B1 (pt) 2011-10-18

Family

ID=7696199

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0211270-1A BR0211270B1 (pt) 2001-08-22 2002-08-21 dispositivo para tratamento eletrolìtico de peças e método de tratamento eletrolìtico de peças.

Country Status (14)

Country Link
US (1) US7473344B2 (pt)
EP (1) EP1419290B1 (pt)
JP (1) JP4257203B2 (pt)
KR (1) KR100866821B1 (pt)
CN (1) CN1289719C (pt)
AT (1) ATE289636T1 (pt)
AU (1) AU2002336089A1 (pt)
BR (1) BR0211270B1 (pt)
CA (1) CA2449807A1 (pt)
DE (2) DE10141056C2 (pt)
MX (1) MXPA04001545A (pt)
MY (1) MY127490A (pt)
TW (1) TW548349B (pt)
WO (1) WO2003018878A2 (pt)

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DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
EP1865094B1 (de) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem
US20090047783A1 (en) * 2007-08-13 2009-02-19 Bchir Omar J Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same
JP5405475B2 (ja) * 2008-09-30 2014-02-05 富士フイルム株式会社 電解粗面化処理方法および電解粗面化処理装置
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009023768A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
EP2971265A4 (en) 2013-03-15 2016-12-14 Modumetal Inc NICKEL CHROME NANOLAMINE COATING WITH HIGH HARDNESS
BR112015022078B1 (pt) 2013-03-15 2022-05-17 Modumetal, Inc Aparelho e método para eletrodepositar um revestimento nanolaminado
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
WO2014146114A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nanolaminate coatings
CA2961507C (en) 2014-09-18 2024-04-09 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
JP6672572B2 (ja) * 2015-12-25 2020-03-25 住友電工プリントサーキット株式会社 プリント配線板用めっき装置及びプリント配線板の製造方法
KR101880599B1 (ko) 2016-06-22 2018-07-23 (주)포인텍 애노드 이동형 수평도금장치
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
JP7051823B2 (ja) 2016-09-14 2022-04-11 モジュメタル インコーポレイテッド 高信頼性、高スループットの複素電界生成のためのシステム、およびそれにより皮膜を生成するための方法
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
WO2018195516A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
WO2021048343A1 (en) 2019-09-12 2021-03-18 Atotech Deutschland Gmbh Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus
JP7747642B2 (ja) * 2020-02-07 2025-10-01 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 被加工物を電解処理するための電極ならびに装置、装置のセルを形成するためのアセンブリ、方法、およびコンピュータプログラム
CN111826689B (zh) * 2020-07-28 2022-02-11 翔声科技（厦门）有限公司 一种多阶段镀镍工艺
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
US20240003039A1 (en) * 2022-06-29 2024-01-04 Xiamen Hithium Energy Storage Technology Co.,Ltd.. Film plating machine and electroplating production line
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法
KR20250131513A (ko) * 2024-02-27 2025-09-03 주식회사 웨스코일렉트로드 동박 제조용 양극 어셈블리

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EP0095915B1 (en) * 1982-05-28 1987-01-21 De La Rue Systems Limited Banding method and apparatus
DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
US5188721A (en) * 1989-02-10 1993-02-23 Eltech Systems Corporation Plate anode having bias cut edges
US5156730A (en) 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
DE4132418C1 (pt) 1991-09-28 1993-02-11 Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De
DE19633797B4 (de) 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
EP0959153A3 (en) 1998-05-20 2000-09-13 Process Automation International Limited An electroplating machine
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
DE10100297A1 (de) * 2001-01-04 2002-07-18 Gesimat Gmbh Vorrichtung und Verahren zur elektrochemischen Beschichtung

Also Published As

Publication number Publication date
CN1289719C (zh) 2006-12-13
ATE289636T1 (de) 2005-03-15
MXPA04001545A (es) 2004-05-14
CA2449807A1 (en) 2003-03-06
US20040232005A1 (en) 2004-11-25
KR100866821B1 (ko) 2008-11-04
JP4257203B2 (ja) 2009-04-22
US7473344B2 (en) 2009-01-06
CN1561409A (zh) 2005-01-05
DE60203047D1 (de) 2005-03-31
MY127490A (en) 2006-12-29
EP1419290B1 (en) 2005-02-23
EP1419290A2 (en) 2004-05-19
DE10141056C2 (de) 2003-12-24
WO2003018878A2 (en) 2003-03-06
KR20040028802A (ko) 2004-04-03
AU2002336089A1 (en) 2003-03-10
WO2003018878A3 (en) 2004-02-26
DE60203047T2 (de) 2006-01-12
TW548349B (en) 2003-08-21
JP2005501181A (ja) 2005-01-13
DE10141056A1 (de) 2003-05-08
BR0211270B1 (pt) 2011-10-18
HK1060906A1 (en) 2004-08-27

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Legal Events

Date Code Title Description
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 21/08/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 21.08.2022