BR0112032A - Mechanical stapler for matrix affixed heated substrates - Google Patents
Mechanical stapler for matrix affixed heated substratesInfo
- Publication number
- BR0112032A BR0112032A BR0112032-8A BR0112032A BR0112032A BR 0112032 A BR0112032 A BR 0112032A BR 0112032 A BR0112032 A BR 0112032A BR 0112032 A BR0112032 A BR 0112032A
- Authority
- BR
- Brazil
- Prior art keywords
- substrate
- matrix
- heated substrates
- heated
- warping
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 10
- 239000011159 matrix material Substances 0.000 title abstract 5
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
"GRAMPEADOR MECâNICO PARA SUBSTRATOS AQUECIDOS EM AFIXAçãO DE MATRIZ". Um aparelho é provido, onde um substrato é mecanicamente grampeado a um bloco aquecedor de um agente de ligação de matriz, para manter baixo o substrato aquecido, antes e durante a operação de ligação de matriz, desse modo impedindo o empenamento do substrato. As montagens incluem um grampo, que compreende uma pluralidade de roletes carregados por mola, os quais empurram para baixo as bordas externas opostas do substrato sobre o bloco aquecedor, enquanto o substrato estiver sendo aquecido e a matriz ligada. O grampo minimiza o empenamento do substrato ao empurrar o substrato plano sobre o bloco aquecedor, e permite que o substrato seja movido para perto e para longe da área de ligação de matriz. 1"MECHANICAL STAPLER FOR HEATED SUBSTRATES IN MATRIX POSITION". An apparatus is provided where a substrate is mechanically clamped to a heating block of a matrix bonding agent to keep the substrate warm down before and during the matrix bonding operation, thereby preventing the substrate from warping. The assemblies include a clamp comprising a plurality of spring loaded rollers which push down the opposite outer edges of the substrate onto the heater block while the substrate is being heated and the die is bonded. The clamp minimizes substrate warping by pushing the flat substrate over the heater block, and allows the substrate to be moved closer to and away from the matrix bonding area. 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21441700P | 2000-06-28 | 2000-06-28 | |
| PCT/US2001/020100 WO2002001612A2 (en) | 2000-06-28 | 2001-06-22 | Mechanical clamper for heated substrates at die attach |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0112032A true BR0112032A (en) | 2003-05-13 |
Family
ID=22799019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0112032-8A BR0112032A (en) | 2000-06-28 | 2001-06-22 | Mechanical stapler for matrix affixed heated substrates |
Country Status (1)
| Country | Link |
|---|---|
| BR (1) | BR0112032A (en) |
-
2001
- 2001-06-22 BR BR0112032-8A patent/BR0112032A/en not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |