AU7645300A - Encapsulation for a three-dimensional microsystem - Google Patents

Encapsulation for a three-dimensional microsystem

Info

Publication number: AU7645300A
Authority: AU; Australia
Prior art keywords: encapsulation; dimensional microsystem; microsystem; dimensional
Prior art date: 1999-10-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU76453/00A

Inventor

Jens Anders Branebjerg

Jacob Janting

Pirmin Rombach

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

DELTA DANISH ELECTRONICS LIGHT AND ACOUSTICS

Original Assignee

DELTA DANISH ELECTRONICS LIGHT

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-10-05

Filing date

2000-10-05

Publication date

2001-05-10

2000-10-05 Application filed by DELTA DANISH ELECTRONICS LIGHT filed Critical DELTA DANISH ELECTRONICS LIGHT

2001-05-10 Publication of AU7645300A publication Critical patent/AU7645300A/en

Status Abandoned legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/069—Protection against electromagnetic or electrostatic interferences
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
- H10W90/724—

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Electromagnetism (AREA)
Health & Medical Sciences (AREA)
General Health & Medical Sciences (AREA)
Toxicology (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Laminated Bodies (AREA)
Micromachines (AREA)

AU76453/00A 1999-10-05 2000-10-05 Encapsulation for a three-dimensional microsystem Abandoned AU7645300A (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DKPA199901428		1999-10-05
DKPA199901428		1999-10-05
PCT/DK2000/000559 WO2001026136A2 (en)	1999-10-05	2000-10-05	Encapsulation for a three-dimensional microsystem

Publications (1)

Publication Number	Publication Date
AU7645300A true AU7645300A (en)	2001-05-10

Family

ID=8104737

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU76453/00A Abandoned AU7645300A (en)	1999-10-05	2000-10-05	Encapsulation for a three-dimensional microsystem

Country Status (2)

Country	Link
AU (1)	AU7645300A (en)
WO (1)	WO2001026136A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6859542B2 (en)	2001-05-31	2005-02-22	Sonion Lyngby A/S	Method of providing a hydrophobic layer and a condenser microphone having such a layer
DE10238523B4 (en)	2002-08-22	2014-10-02	Epcos Ag	Encapsulated electronic component and method of manufacture
JP2007532865A (en) *	2004-02-09	2007-11-15	ローベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング	Corrosion protection for pressure sensors
DE102004020204A1 (en)	2004-04-22	2005-11-10	Epcos Ag	Encapsulated electrical component and method of manufacture
US7608789B2 (en)	2004-08-12	2009-10-27	Epcos Ag	Component arrangement provided with a carrier substrate
US8325047B2 (en)	2009-04-08	2012-12-04	Sabic Innovative Plastics Ip B.V.	Encapsulated RFID tags and methods of making same
CN109950237B (en) *	2017-12-21	2024-08-20	成都万应微电子有限公司	Sensor microsystem packaging method and sensor microsystem
WO2023196645A1 (en) *	2022-04-07	2023-10-12	Aculon, Inc.	Electronic circuit packages with reduced mold flash adhesion methods for reducing mold flash adhesion to metal leadframes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4163072A (en) *	1977-06-07	1979-07-31	Bell Telephone Laboratories, Incorporated	Encapsulation of circuits
JPS60140739A (en) *	1983-12-28	1985-07-25	Hitachi Ltd	Plastic ic package having passivation structure
JPS61125022A (en) *	1984-11-21	1986-06-12	Nec Corp	Manufacture of hybrid integrated circuit
DE4040822A1 (en) *	1990-12-20	1992-07-02	Bosch Gmbh Robert	THICK LAYER COVER OVER CHIPS
JPH0735628A (en) *	1993-07-16	1995-02-07	Kyowa Electron Instr Co Ltd	Strain gauge attachment point coating structure and its coating method
US5889211A (en) *	1995-04-03	1999-03-30	Motorola, Inc.	Media compatible microsensor structure and methods of manufacturing and using the same
FR2764113B1 (en) *	1997-05-28	2000-08-04	Motorola Semiconducteurs	SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

2000
- 2000-10-05 WO PCT/DK2000/000559 patent/WO2001026136A2/en not_active Ceased
- 2000-10-05 AU AU76453/00A patent/AU7645300A/en not_active Abandoned

Also Published As

Publication number	Publication date
WO2001026136A2 (en)	2001-04-12
WO2001026136A3 (en)	2001-12-13

Publication	Publication Date	Title
AU2002344503A1 (en)	2003-04-22	A three-dimensional memory
AU2599701A (en)	2001-07-09	A 3d camera
AU8018200A (en)	2001-05-14	A knowledge-engineering protocol-suite
AU2002224937A1 (en)	2002-06-24	A packaging unit
AU2001213969A1 (en)	2002-06-03	A prototyping system
AU7645300A (en)	2001-05-10	Encapsulation for a three-dimensional microsystem
AU6733300A (en)	2001-10-15	A learning-assistance system
AU2800000A (en)	2000-09-04	Encapsulation
AUPQ215199A0 (en)	1999-09-02	A barrier
AU3315000A (en)	2000-10-16	A dietary system
AU2446200A (en)	2000-08-25	A headphone
AU6174300A (en)	2001-02-19	A vehicle
AU2616601A (en)	2001-05-30	Micromachine package
AU6329400A (en)	2001-01-30	Arrangement for a brassiere
AU7439300A (en)	2001-05-10	Packaging
AU2945100A (en)	2000-12-05	A luggage
AUPP846199A0 (en)	1999-02-25	A vehicle
AU5998700A (en)	2001-02-05	A three demensional figure
AU6253700A (en)	2001-02-19	Packaging
AU7798900A (en)	2001-04-23	Booklet comprising a form
AU3833300A (en)	2000-11-14	A device
AUPQ335299A0 (en)	1999-11-04	A vehicle
AUPP937899A0 (en)	1999-04-15	A vehicle
AU2002249780A1 (en)	2002-08-12	Technique for encapsulating a query definition
AUPP991999A0 (en)	1999-05-20	A ligand

Legal Events

Date	Code	Title	Description
2002-06-06	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase