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AU2616601A - Micromachine package - Google Patents

Micromachine package

Info

Publication number
AU2616601A
AU2616601A AU26166/01A AU2616601A AU2616601A AU 2616601 A AU2616601 A AU 2616601A AU 26166/01 A AU26166/01 A AU 26166/01A AU 2616601 A AU2616601 A AU 2616601A AU 2616601 A AU2616601 A AU 2616601A
Authority
AU
Australia
Prior art keywords
micromachine package
micromachine
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU26166/01A
Inventor
Thomas P. Glenn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amkor Technology Inc
Original Assignee
Amkor Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/440,808 external-priority patent/US6415505B1/en
Application filed by Amkor Technology Inc filed Critical Amkor Technology Inc
Publication of AU2616601A publication Critical patent/AU2616601A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/004—Testing during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)
  • Food-Manufacturing Devices (AREA)
AU26166/01A 1999-11-15 2000-10-24 Micromachine package Abandoned AU2616601A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US44080599A 1999-11-15 1999-11-15
US09/440,808 US6415505B1 (en) 1999-11-15 1999-11-15 Micromachine package fabrication method
US09440805 1999-11-15
US09440808 1999-11-15
PCT/US2000/041483 WO2001036320A2 (en) 1999-11-15 2000-10-24 Micromachine package

Publications (1)

Publication Number Publication Date
AU2616601A true AU2616601A (en) 2001-05-30

Family

ID=27032562

Family Applications (1)

Application Number Title Priority Date Filing Date
AU26166/01A Abandoned AU2616601A (en) 1999-11-15 2000-10-24 Micromachine package

Country Status (3)

Country Link
AU (1) AU2616601A (en)
TW (1) TW473903B (en)
WO (1) WO2001036320A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10258478A1 (en) * 2002-12-10 2004-07-08 Fh Stralsund Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures
DE102006019080B3 (en) 2006-04-25 2007-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Housing manufacturing method for e.g. infrared sensor, involves enclosing electrical circuit along metal frame, where circuit is isolated along isolating contour that does not cut surface of substrate
DE102010031055B4 (en) * 2010-07-07 2023-02-23 Robert Bosch Gmbh Sensor module and method of manufacturing a sensor module
TWI455266B (en) * 2010-12-17 2014-10-01 矽品精密工業股份有限公司 Package structure with MEMS components and its manufacturing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
JPH07221217A (en) * 1993-12-10 1995-08-18 Sumitomo Kinzoku Ceramics:Kk Lid for semiconductor package and semiconductor package
US5597767A (en) * 1995-01-06 1997-01-28 Texas Instruments Incorporated Separation of wafer into die with wafer-level processing
US5742007A (en) * 1996-08-05 1998-04-21 Motorola, Inc. Electronic device package and method for forming the same
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
US5860210A (en) * 1996-09-30 1999-01-19 Motorola, Inc. Method of manufacturing an electronic component
US6034429A (en) * 1997-04-18 2000-03-07 Amkor Technology, Inc. Integrated circuit package
US6036872A (en) * 1998-03-31 2000-03-14 Honeywell Inc. Method for making a wafer-pair having sealed chambers

Also Published As

Publication number Publication date
TW473903B (en) 2002-01-21
WO2001036320A2 (en) 2001-05-25
WO2001036320A3 (en) 2002-05-30

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase