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AU6878598A - Nanoporous dielectric films with graded density and process for making such films - Google Patents

Nanoporous dielectric films with graded density and process for making such films

Info

Publication number
AU6878598A
AU6878598A AU68785/98A AU6878598A AU6878598A AU 6878598 A AU6878598 A AU 6878598A AU 68785/98 A AU68785/98 A AU 68785/98A AU 6878598 A AU6878598 A AU 6878598A AU 6878598 A AU6878598 A AU 6878598A
Authority
AU
Australia
Prior art keywords
films
making
graded density
nanoporous dielectric
dielectric films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU68785/98A
Inventor
James S. Drage
Teresa Ramos
Kevin H. Roderick
Douglas M. Smith
Stephen Wallace
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Publication of AU6878598A publication Critical patent/AU6878598A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W20/48
    • H10P14/6342
    • H10P14/6529
    • H10P14/6534
    • H10P14/665
    • H10P14/6686
    • H10P14/6922
    • H10W20/072
    • H10W20/46
    • H10W20/495
AU68785/98A 1997-04-17 1998-04-02 Nanoporous dielectric films with graded density and process for making such films Abandoned AU6878598A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4326197P 1997-04-17 1997-04-17
US60043261 1997-04-17
US4647498A 1998-03-25 1998-03-25
US09046474 1998-03-25
PCT/US1998/006492 WO1998047177A1 (en) 1997-04-17 1998-04-02 Nanoporous dielectric films with graded density and process for making such films

Publications (1)

Publication Number Publication Date
AU6878598A true AU6878598A (en) 1998-11-11

Family

ID=26720199

Family Applications (1)

Application Number Title Priority Date Filing Date
AU68785/98A Abandoned AU6878598A (en) 1997-04-17 1998-04-02 Nanoporous dielectric films with graded density and process for making such films

Country Status (7)

Country Link
EP (1) EP0976153A1 (en)
JP (1) JP2001520805A (en)
KR (1) KR20010006553A (en)
CN (1) CN1260908A (en)
AU (1) AU6878598A (en)
TW (1) TW367591B (en)
WO (1) WO1998047177A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042994A (en) * 1998-01-20 2000-03-28 Alliedsignal Inc. Nanoporous silica dielectric films modified by electron beam exposure and having low dielectric constant and low water content
US6231989B1 (en) 1998-11-20 2001-05-15 Dow Corning Corporation Method of forming coatings
KR100719188B1 (en) * 1999-08-31 2007-05-16 동경 엘렉트론 주식회사 Substrate processing method
US6465365B1 (en) 2000-04-07 2002-10-15 Koninklijke Philips Electronics N.V. Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication
US6495479B1 (en) 2000-05-05 2002-12-17 Honeywell International, Inc. Simplified method to produce nanoporous silicon-based films
KR100382702B1 (en) * 2000-09-18 2003-05-09 주식회사 엘지화학 Method for preparing organic silicate polymer
AU2001296737A1 (en) 2000-10-12 2002-04-22 North Carolina State University Co2-processes photoresists, polymers, and photoactive compounds for microlithography
US20020076543A1 (en) * 2000-12-19 2002-06-20 Sikonia John G. Layered dielectric nanoporous materials and methods of producing same
AU2002251769A1 (en) * 2002-01-03 2003-09-04 Honeywell International Inc. Nanoporous dielectric films with graded density and process for making such films
WO2003088344A1 (en) * 2002-04-10 2003-10-23 Honeywell International, Inc. Low metal porous silica dielectric for integral circuit applications
JP2006500769A (en) * 2002-09-20 2006-01-05 ハネウェル・インターナショナル・インコーポレーテッド Interlayer adhesion promoter for low-k materials
JP4493278B2 (en) * 2003-02-20 2010-06-30 富士通株式会社 Porous resin insulation film, electronic device, and method for manufacturing the same
US7030468B2 (en) * 2004-01-16 2006-04-18 International Business Machines Corporation Low k and ultra low k SiCOH dielectric films and methods to form the same
JP2010131700A (en) * 2008-12-04 2010-06-17 Sony Corp Particulate structure/substrate composite member and method for manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69128073T2 (en) * 1990-08-23 1998-02-26 Univ California As Represented METHOD FOR PRODUCING METAL OXIDE AEROGELS WITH DENSITY LESS THAN 0.02 G / CM3
DE69535718T2 (en) * 1994-05-27 2009-03-19 Texas Instruments Inc., Dallas Connection method using a porous insulator to reduce the capacitance between tracks
US5494858A (en) * 1994-06-07 1996-02-27 Texas Instruments Incorporated Method for forming porous composites as a low dielectric constant layer with varying porosity distribution electronics applications

Also Published As

Publication number Publication date
EP0976153A1 (en) 2000-02-02
WO1998047177A1 (en) 1998-10-22
KR20010006553A (en) 2001-01-26
CN1260908A (en) 2000-07-19
JP2001520805A (en) 2001-10-30
TW367591B (en) 1999-08-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase