AU7371898A - Low density film for low dielectric constant applications - Google Patents
Low density film for low dielectric constant applicationsInfo
- Publication number
- AU7371898A AU7371898A AU73718/98A AU7371898A AU7371898A AU 7371898 A AU7371898 A AU 7371898A AU 73718/98 A AU73718/98 A AU 73718/98A AU 7371898 A AU7371898 A AU 7371898A AU 7371898 A AU7371898 A AU 7371898A
- Authority
- AU
- Australia
- Prior art keywords
- dielectric constant
- low
- density film
- low density
- constant applications
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3694—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer one layer having a composition gradient through its thickness
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
- C03C17/009—Mixtures of organic and inorganic materials, e.g. ormosils and ormocers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- H10P14/6334—
-
- H10P14/6342—
-
- H10P14/662—
-
- H10P14/665—
-
- H10P14/6922—
-
- H10P14/69394—
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/42—Coatings comprising at least one inhomogeneous layer consisting of particles only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Health & Medical Sciences (AREA)
- Composite Materials (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85236297A | 1997-05-07 | 1997-05-07 | |
| US08852362 | 1997-05-07 | ||
| PCT/US1998/009295 WO1998050945A2 (en) | 1997-05-07 | 1998-05-06 | Low density film for low dielectric constant applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU7371898A true AU7371898A (en) | 1998-11-27 |
Family
ID=25313123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU73718/98A Abandoned AU7371898A (en) | 1997-05-07 | 1998-05-06 | Low density film for low dielectric constant applications |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU7371898A (en) |
| WO (1) | WO1998050945A2 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6469390B2 (en) * | 1999-01-26 | 2002-10-22 | Agere Systems Guardian Corp. | Device comprising thermally stable, low dielectric constant material |
| JP3827056B2 (en) * | 1999-03-17 | 2006-09-27 | キヤノンマーケティングジャパン株式会社 | Method for forming interlayer insulating film and semiconductor device |
| JP3600507B2 (en) | 2000-05-18 | 2004-12-15 | キヤノン販売株式会社 | Semiconductor device and manufacturing method thereof |
| JP3532830B2 (en) | 2000-05-24 | 2004-05-31 | キヤノン販売株式会社 | Semiconductor device and manufacturing method thereof |
| JP2002009069A (en) | 2000-06-22 | 2002-01-11 | Canon Sales Co Inc | Method for forming film |
| JP3934343B2 (en) | 2000-07-12 | 2007-06-20 | キヤノンマーケティングジャパン株式会社 | Semiconductor device and manufacturing method thereof |
| KR100486333B1 (en) | 2000-07-21 | 2005-04-29 | 가부시끼가이샤 한도따이 프로세스 켄큐쇼 | Semiconductor apparatus and method of manufacturing the same |
| US6500752B2 (en) | 2000-07-21 | 2002-12-31 | Canon Sales Co., Inc. | Semiconductor device and semiconductor device manufacturing method |
| US6835669B2 (en) | 2000-07-21 | 2004-12-28 | Canon Sales Co., Inc. | Film forming method, semiconductor device and semiconductor device manufacturing method |
| JP3545364B2 (en) | 2000-12-19 | 2004-07-21 | キヤノン販売株式会社 | Semiconductor device and manufacturing method thereof |
| JP2005504433A (en) | 2001-07-18 | 2005-02-10 | トリコン ホールディングス リミティド | Low dielectric constant layer |
| JP3701626B2 (en) | 2001-12-06 | 2005-10-05 | キヤノン販売株式会社 | Manufacturing method of semiconductor device |
| US9061317B2 (en) | 2002-04-17 | 2015-06-23 | Air Products And Chemicals, Inc. | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants |
| ATE499458T1 (en) * | 2002-04-17 | 2011-03-15 | Air Prod & Chem | METHOD FOR PRODUCING A POROUS SIZE LAYER |
| JP3859540B2 (en) | 2002-05-14 | 2006-12-20 | 松下電器産業株式会社 | Low dielectric constant insulating film forming material |
| US6825130B2 (en) | 2002-12-12 | 2004-11-30 | Asm Japan K.K. | CVD of porous dielectric materials |
| DE102012108704A1 (en) * | 2012-09-17 | 2014-03-20 | Osram Opto Semiconductors Gmbh | Method for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip and radiation-emitting semiconductor component |
| EP3655494B1 (en) | 2017-07-20 | 2021-04-14 | Saudi Arabian Oil Company | Mitigation of condensate banking using surface modification |
| EP3914667A1 (en) | 2019-01-23 | 2021-12-01 | Saudi Arabian Oil Company | Mitigation of condensate and water banking using functionalized nanoparticles |
| JP7618439B2 (en) * | 2020-12-17 | 2025-01-21 | 積水化成品工業株式会社 | Hollow resin particles for use in resin composition for semiconductor members |
| CN119419064A (en) * | 2024-09-29 | 2025-02-11 | 黄山申格电子科技股份有限公司 | Composite dielectric film, metallized film and capacitor |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4865875A (en) * | 1986-02-28 | 1989-09-12 | Digital Equipment Corporation | Micro-electronics devices and methods of manufacturing same |
| US4849284A (en) * | 1987-02-17 | 1989-07-18 | Rogers Corporation | Electrical substrate material |
| US5055342A (en) * | 1990-02-16 | 1991-10-08 | International Business Machines Corporation | Fluorinated polymeric composition, fabrication thereof and use thereof |
| US5354611A (en) * | 1990-02-21 | 1994-10-11 | Rogers Corporation | Dielectric composite |
| JPH0697298A (en) * | 1992-09-14 | 1994-04-08 | Fujitsu Ltd | Method for forming insulating film of semiconductor device |
| EP0604799A1 (en) * | 1992-12-29 | 1994-07-06 | International Business Machines Corporation | Coated filler and use thereof |
| JP3567494B2 (en) * | 1993-08-27 | 2004-09-22 | 旭硝子株式会社 | Coating agent consisting of organosol dispersed in fluorinated solvent |
| US5835987A (en) * | 1995-10-31 | 1998-11-10 | Micron Technology, Inc. | Reduced RC delay between adjacent substrate wiring lines |
| US5801092A (en) * | 1997-09-04 | 1998-09-01 | Ayers; Michael R. | Method of making two-component nanospheres and their use as a low dielectric constant material for semiconductor devices |
-
1998
- 1998-05-06 WO PCT/US1998/009295 patent/WO1998050945A2/en not_active Ceased
- 1998-05-06 AU AU73718/98A patent/AU7371898A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO1998050945A2 (en) | 1998-11-12 |
| WO1998050945A3 (en) | 1999-03-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |