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AU4318100A - Method and apparatus for exposure - Google Patents

Method and apparatus for exposure

Info

Publication number
AU4318100A
AU4318100A AU43181/00A AU4318100A AU4318100A AU 4318100 A AU4318100 A AU 4318100A AU 43181/00 A AU43181/00 A AU 43181/00A AU 4318100 A AU4318100 A AU 4318100A AU 4318100 A AU4318100 A AU 4318100A
Authority
AU
Australia
Prior art keywords
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU43181/00A
Inventor
Takashi Aoki
Naomasa Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU4318100A publication Critical patent/AU4318100A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU43181/00A 1999-05-07 2000-05-08 Method and apparatus for exposure Abandoned AU4318100A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11/127802 1999-05-07
JP12780299 1999-05-07
PCT/JP2000/002924 WO2000068980A1 (en) 1999-05-07 2000-05-08 Method and apparatus for exposure

Publications (1)

Publication Number Publication Date
AU4318100A true AU4318100A (en) 2000-11-21

Family

ID=14969048

Family Applications (1)

Application Number Title Priority Date Filing Date
AU43181/00A Abandoned AU4318100A (en) 1999-05-07 2000-05-08 Method and apparatus for exposure

Country Status (2)

Country Link
AU (1) AU4318100A (en)
WO (1) WO2000068980A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111326414A (en) * 2018-12-14 2020-06-23 东京毅力科创株式会社 Substrate processing method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075795A1 (en) * 2001-03-19 2002-09-26 Nikon Corporation Method and device for exposure, and method of manufacturing device
JPWO2003079419A1 (en) * 2002-03-15 2005-07-21 株式会社ニコン Mask storage apparatus, exposure apparatus, and device manufacturing method
TW200423224A (en) * 2002-12-03 2004-11-01 Nippon Kogaku Kk Exposure system, exposure method, and device fabricating method
JP2005243771A (en) * 2004-02-25 2005-09-08 Nikon Corp Exposure equipment
CN113703282B (en) * 2021-08-02 2022-09-06 联芯集成电路制造(厦门)有限公司 Photomask Thermal Expansion Correction Method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232213A (en) * 1996-02-26 1997-09-05 Nikon Corp Projection exposure equipment
JPH09266151A (en) * 1996-03-28 1997-10-07 Nikon Corp Exposure apparatus and exposure method
JP3823408B2 (en) * 1997-01-10 2006-09-20 株式会社ニコン Optical element manufacturing method and optical element cleaning method
EP0874283B1 (en) * 1997-04-23 2003-09-03 Nikon Corporation Optical exposure apparatus and photo-cleaning method
JP3635860B2 (en) * 1997-05-14 2005-04-06 株式会社ニコン Optical device
JPH11219902A (en) * 1997-11-27 1999-08-10 Nikon Corp Exposure apparatus and device manufacturing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111326414A (en) * 2018-12-14 2020-06-23 东京毅力科创株式会社 Substrate processing method

Also Published As

Publication number Publication date
WO2000068980A1 (en) 2000-11-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase