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AU2003303677A1 - Composition and method used for chemical mechanical planarization of metals - Google Patents

Composition and method used for chemical mechanical planarization of metals

Info

Publication number
AU2003303677A1
AU2003303677A1 AU2003303677A AU2003303677A AU2003303677A1 AU 2003303677 A1 AU2003303677 A1 AU 2003303677A1 AU 2003303677 A AU2003303677 A AU 2003303677A AU 2003303677 A AU2003303677 A AU 2003303677A AU 2003303677 A1 AU2003303677 A1 AU 2003303677A1
Authority
AU
Australia
Prior art keywords
metals
composition
method used
chemical mechanical
mechanical planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003303677A
Inventor
Song Y. Chang
Mark Evans
Stephen W. Hymes
Dnyanesh Tamboli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Publication of AU2003303677A1 publication Critical patent/AU2003303677A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H10P52/403—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H10W20/062—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Catalysts (AREA)
  • Removal Of Specific Substances (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AU2003303677A 2003-01-03 2003-12-29 Composition and method used for chemical mechanical planarization of metals Abandoned AU2003303677A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US43782603P 2003-01-03 2003-01-03
US60/437,826 2003-01-03
US10/744,285 2003-12-23
US10/744,285 US20040175942A1 (en) 2003-01-03 2003-12-23 Composition and method used for chemical mechanical planarization of metals
PCT/US2003/041291 WO2004063301A1 (en) 2003-01-03 2003-12-29 Composition and method used for chemical mechanical planarization of metals

Publications (1)

Publication Number Publication Date
AU2003303677A1 true AU2003303677A1 (en) 2004-08-10

Family

ID=32717930

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003303677A Abandoned AU2003303677A1 (en) 2003-01-03 2003-12-29 Composition and method used for chemical mechanical planarization of metals

Country Status (6)

Country Link
US (3) US20040175942A1 (en)
KR (2) KR101366879B1 (en)
CN (1) CN1735670B (en)
AU (1) AU2003303677A1 (en)
TW (1) TWI348492B (en)
WO (1) WO2004063301A1 (en)

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Also Published As

Publication number Publication date
US20040175942A1 (en) 2004-09-09
US20160079084A1 (en) 2016-03-17
TW200508373A (en) 2005-03-01
TWI348492B (en) 2011-09-11
CN1735670A (en) 2006-02-15
US20080254629A1 (en) 2008-10-16
KR101167306B1 (en) 2012-07-19
KR101366879B1 (en) 2014-02-24
US10373842B2 (en) 2019-08-06
WO2004063301A1 (en) 2004-07-29
KR20050111315A (en) 2005-11-24
KR20120061981A (en) 2012-06-13
CN1735670B (en) 2012-06-27
US20170372918A9 (en) 2017-12-28

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