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AU2003239183A1 - Partially patterned lead frames and methods of making and using the same in semiconductor packaging - Google Patents

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Info

Publication number
AU2003239183A1
AU2003239183A1 AU2003239183A AU2003239183A AU2003239183A1 AU 2003239183 A1 AU2003239183 A1 AU 2003239183A1 AU 2003239183 A AU2003239183 A AU 2003239183A AU 2003239183 A AU2003239183 A AU 2003239183A AU 2003239183 A1 AU2003239183 A1 AU 2003239183A1
Authority
AU
Australia
Prior art keywords
making
methods
same
lead frames
semiconductor packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003239183A
Other languages
English (en)
Inventor
Shafidul Islam
Romarico S. San Antonio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Interconnect Technologies Ltd
Original Assignee
Advanced Interconnect Technology Ltd
Advanced Interconnect Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/134,882 external-priority patent/US6812552B2/en
Priority claimed from US10/342,732 external-priority patent/US6777265B2/en
Application filed by Advanced Interconnect Technology Ltd, Advanced Interconnect Technologies Ltd filed Critical Advanced Interconnect Technology Ltd
Publication of AU2003239183A1 publication Critical patent/AU2003239183A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W70/40—
    • H10W70/042—
    • H10W70/048—
    • H10W70/424—
    • H10W72/00—
    • H10W74/014—
    • H10W74/129—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01225—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/252—
    • H10W72/534—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W74/127—
    • H10W90/726—
    • H10W90/736—
    • H10W90/756—
AU2003239183A 2002-04-29 2003-04-28 Partially patterned lead frames and methods of making and using the same in semiconductor packaging Abandoned AU2003239183A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/134,882 2002-04-29
US10/134,882 US6812552B2 (en) 2002-04-29 2002-04-29 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US10/342,732 2003-01-15
US10/342,732 US6777265B2 (en) 2002-04-29 2003-01-15 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
PCT/US2003/013046 WO2003103038A1 (fr) 2002-04-29 2003-04-28 Cadres de montage partiellement structures et procedes de production et d'utilisation de ces derniers dans le conditionnement de semi-conducteurs

Publications (1)

Publication Number Publication Date
AU2003239183A1 true AU2003239183A1 (en) 2003-12-19

Family

ID=29714650

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003239183A Abandoned AU2003239183A1 (en) 2002-04-29 2003-04-28 Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Country Status (7)

Country Link
EP (1) EP1500130A1 (fr)
JP (1) JP2005531137A (fr)
KR (1) KR100789348B1 (fr)
CN (1) CN100380614C (fr)
AU (1) AU2003239183A1 (fr)
TW (1) TWI239054B (fr)
WO (1) WO2003103038A1 (fr)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777265B2 (en) * 2002-04-29 2004-08-17 Advanced Interconnect Technologies Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6812552B2 (en) 2002-04-29 2004-11-02 Advanced Interconnect Technologies Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US7799611B2 (en) 2002-04-29 2010-09-21 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US8236612B2 (en) 2002-04-29 2012-08-07 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US20040058478A1 (en) 2002-09-25 2004-03-25 Shafidul Islam Taped lead frames and methods of making and using the same in semiconductor packaging
JP4522167B2 (ja) * 2004-06-30 2010-08-11 三洋電機株式会社 半導体装置およびその製造方法
CN100578766C (zh) * 2006-08-29 2010-01-06 日月光半导体制造股份有限公司 芯片封装构造制造方法
WO2008057770A2 (fr) 2006-10-27 2008-05-15 Unisem (Mauritius) Holdings Limited Grilles de connexion à motif partiel et procédés de fabrication et d'utilisation correspondant dans une mise en boîtier de semi-conducteurs
US8097945B2 (en) * 2007-11-21 2012-01-17 Lynda Harnden, legal representative Bi-directional, reverse blocking battery switch
JP5224845B2 (ja) * 2008-02-18 2013-07-03 新光電気工業株式会社 半導体装置の製造方法及び半導体装置
US9899349B2 (en) 2009-01-29 2018-02-20 Semiconductor Components Industries, Llc Semiconductor packages and related methods
US8071427B2 (en) * 2009-01-29 2011-12-06 Semiconductor Components Industries, Llc Method for manufacturing a semiconductor component and structure therefor
US10199311B2 (en) 2009-01-29 2019-02-05 Semiconductor Components Industries, Llc Leadless semiconductor packages, leadframes therefor, and methods of making
US10163766B2 (en) 2016-11-21 2018-12-25 Semiconductor Components Industries, Llc Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
JP5215980B2 (ja) * 2009-10-30 2013-06-19 株式会社三井ハイテック 半導体装置の製造方法
CN104658923B (zh) * 2010-09-01 2018-08-14 群成科技股份有限公司 四边扁平无接脚封装方法及其制成的结构
DE102011004544B4 (de) * 2011-02-22 2013-06-13 Semikron Elektronik Gmbh & Co. Kg Schaltungsanordnung
KR101234141B1 (ko) * 2011-03-23 2013-02-22 엘지이노텍 주식회사 리드프레임 및 이를 이용한 반도체패키지, 이들의 제조방법
US9287191B2 (en) 2011-10-12 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device package and method
US8866274B2 (en) * 2012-03-27 2014-10-21 Infineon Technologies Ag Semiconductor packages and methods of formation thereof
JP5990438B2 (ja) * 2012-09-13 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR101411894B1 (ko) 2012-10-23 2014-06-25 주식회사 엠디티 전기 소자-패키지 유닛 제조 방법 및 그 방법에 사용되는 패키지 세트 조립체
CN103745957A (zh) * 2013-11-06 2014-04-23 华天科技（西安）有限公司 一种增强散热功能的aaqfn封装件及其制作工艺
US9287238B2 (en) * 2013-12-02 2016-03-15 Infineon Technologies Ag Leadless semiconductor package with optical inspection feature
US9449876B2 (en) * 2014-01-17 2016-09-20 Infineon Technologies Ag Singulation of semiconductor dies with contact metallization by electrical discharge machining
US9401287B2 (en) * 2014-02-07 2016-07-26 Altera Corporation Methods for packaging integrated circuits
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9219025B1 (en) * 2014-08-15 2015-12-22 Infineon Technologies Ag Molded flip-clip semiconductor package
CN105118787A (zh) * 2015-04-22 2015-12-02 丽智电子(昆山)有限公司 一种采用激光烧铜的产品加工工艺
CN109586680B (zh) * 2017-09-29 2021-09-03 安华高科技股份有限公司 用于声谐振器结构的经锚定聚合物封装
CN109900634B (zh) * 2019-02-26 2021-07-30 四川立泰电子有限公司 一种引线键合工艺可靠性监测方法
JP7800022B2 (ja) * 2021-08-27 2026-01-16 富士電機株式会社 半導体装置
CN114782430B (zh) * 2022-06-20 2022-08-23 新恒汇电子股份有限公司 基于蚀刻金属引线框架的计数系统及其计数方法
CN115132692B (zh) * 2022-08-31 2023-01-17 宁波德洲精密电子有限公司 一种引线框架及其生产装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656550A (en) * 1994-08-24 1997-08-12 Fujitsu Limited Method of producing a semicondutor device having a lead portion with outer connecting terminal
US5847458A (en) * 1996-05-21 1998-12-08 Shinko Electric Industries Co., Ltd. Semiconductor package and device having heads coupled with insulating material
JPH11195742A (ja) * 1998-01-05 1999-07-21 Matsushita Electron Corp 半導体装置及びその製造方法とそれに用いるリードフレーム
JP3436159B2 (ja) * 1998-11-11 2003-08-11 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
US6238952B1 (en) * 2000-02-29 2001-05-29 Advanced Semiconductor Engineering, Inc. Low-pin-count chip package and manufacturing method thereof

Also Published As

Publication number Publication date
KR100789348B1 (ko) 2007-12-28
CN1650410A (zh) 2005-08-03
JP2005531137A (ja) 2005-10-13
KR20050007350A (ko) 2005-01-17
TW200405480A (en) 2004-04-01
CN100380614C (zh) 2008-04-09
EP1500130A1 (fr) 2005-01-26
TWI239054B (en) 2005-09-01
WO2003103038A1 (fr) 2003-12-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase