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AU2003229661A1 - Device for treating substrates by laser radiation - Google Patents

Device for treating substrates by laser radiation

Info

Publication number
AU2003229661A1
AU2003229661A1 AU2003229661A AU2003229661A AU2003229661A1 AU 2003229661 A1 AU2003229661 A1 AU 2003229661A1 AU 2003229661 A AU2003229661 A AU 2003229661A AU 2003229661 A AU2003229661 A AU 2003229661A AU 2003229661 A1 AU2003229661 A1 AU 2003229661A1
Authority
AU
Australia
Prior art keywords
laser radiation
treating substrates
substrates
treating
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003229661A
Inventor
Helmut Paul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MLT Micro Laser Tech GmbH
Original Assignee
MLT Micro Laser Tech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MLT Micro Laser Tech GmbH filed Critical MLT Micro Laser Tech GmbH
Publication of AU2003229661A1 publication Critical patent/AU2003229661A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
AU2003229661A 2002-06-07 2003-04-14 Device for treating substrates by laser radiation Abandoned AU2003229661A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10225387.0 2002-06-07
DE10225387A DE10225387B4 (en) 2002-06-07 2002-06-07 Device for substrate treatment by means of laser radiation
PCT/EP2003/003855 WO2003103887A1 (en) 2002-06-07 2003-04-14 Device for treating substrates by laser radiation

Publications (1)

Publication Number Publication Date
AU2003229661A1 true AU2003229661A1 (en) 2003-12-22

Family

ID=29557656

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003229661A Abandoned AU2003229661A1 (en) 2002-06-07 2003-04-14 Device for treating substrates by laser radiation

Country Status (3)

Country Link
AU (1) AU2003229661A1 (en)
DE (1) DE10225387B4 (en)
WO (1) WO2003103887A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007026072B4 (en) * 2007-05-25 2019-02-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optical arrangement
DE102008020575B4 (en) * 2008-04-24 2015-05-28 Mlt Micro Laser Technology Gmbh perforation
DE102008053507B4 (en) * 2008-10-28 2011-05-12 Lpkf Laser & Electronics Ag Device for processing a workpiece by means of laser beams
CN101804518A (en) * 2010-04-02 2010-08-18 苏州市博海激光科技有限公司 Laser boring method and equipment of multi-laser parallel cigarette tipping paper
DE102010028469B4 (en) * 2010-04-30 2012-05-31 Rofin-Baasel Lasertech Gmbh & Co. Kg Device for introducing grooves or slots spaced apart in a longitudinal direction into a material web moved in this longitudinal direction with a laser beam
DE102010062071A1 (en) * 2010-11-26 2012-05-31 Rofin-Baasel Lasertech Gmbh & Co. Kg Device, useful for introducing recesses or openings spaced from each other in longitudinal direction, in material web, comprises a laser beam source for generating laser beam, and a first polygon mirror rotating around a rotational axis
US9283638B2 (en) 2011-11-25 2016-03-15 Rofin-Baasel Lasertech Gmbh & Co. Kg Device for forming longitudinally spaced grooves or slits into a material web with a focused laser beam
CN104551387B (en) * 2014-12-23 2016-08-24 中国科学院力学研究所 Multi-beam synthetic focusing device
CN104625397B (en) * 2014-12-23 2017-03-01 中国科学院力学研究所 Multi-beam synthetic focusing control system and control method
EP3138636A1 (en) * 2015-09-03 2017-03-08 Haas Food Equipment GmbH Assembly for the purification of baking surfaces
CN106041326B (en) * 2016-07-14 2017-09-19 梅笑雨 The punching machine and its control method of thin rod object
DE102017105955A1 (en) * 2017-03-20 2018-09-20 Laserpluss Ag Laser grinding device and method for processing a workpiece
EP4318075A4 (en) * 2021-03-30 2024-10-23 Nippon Steel Corporation LASER SCANNING DEVICE, LASER SCANNING METHOD, LASER PROCESSING DEVICE AND MANUFACTURING METHOD FOR ELECTRIC STEEL PLATE
JP2023045543A (en) * 2021-09-22 2023-04-03 川崎重工業株式会社 Laser beam machining method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2918283C2 (en) * 1979-05-07 1983-04-21 Carl Baasel, Lasertechnik KG, 8000 München Device for substrate treatment with a rotating mirror or the like.
US4468551A (en) * 1982-07-30 1984-08-28 Armco Inc. Laser treatment of electrical steel and optical scanning assembly therefor
JPS5940621A (en) * 1982-08-30 1984-03-06 Canon Inc Scanning optical system
US4624528A (en) * 1985-02-21 1986-11-25 Xerox Corporation Scanning systems with polygon scanner having curved facets
DE3728660A1 (en) * 1987-08-27 1989-03-09 Baasel Carl Lasertech Device for treating a substrate, especially for perforating paper
US5037183A (en) * 1989-02-22 1991-08-06 United Technologies Corporation Laser drilling
US5179271A (en) * 1991-09-19 1993-01-12 Ncr Corporation Compact optical scan pattern generator for bar code reading systems
DE19511393B4 (en) * 1995-03-28 2005-08-25 Carl Baasel Lasertechnik Gmbh Apparatus for substrate treatment, in particular for perforating paper
DE69706964T2 (en) * 1996-03-07 2002-04-04 Accu-Sort Systems, Inc. DYNAMIC FOCUSING DEVICE FOR OPTICAL IMAGING SYSTEMS
JPH1049618A (en) * 1996-07-31 1998-02-20 Casio Comput Co Ltd Laser scanner
DE19937267A1 (en) * 1999-08-06 2001-02-15 Baasel Carl Lasertech Device for treating a substrate using laser radiation
JP2001062577A (en) * 1999-08-31 2001-03-13 Toppan Forms Co Ltd Laser processing equipment
JP2001105164A (en) * 1999-10-07 2001-04-17 Sumitomo Heavy Ind Ltd Method for laser beam piercing and device therefor
DE10105878A1 (en) * 2001-02-09 2002-09-12 Mlt Micro Laser Technology Gmb Device for substrate treatment using laser radiation

Also Published As

Publication number Publication date
WO2003103887A1 (en) 2003-12-18
DE10225387B4 (en) 2007-09-20
DE10225387A1 (en) 2003-12-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase