AU2003294170A1 - Manufacturing process for a multilayer structure - Google Patents

Manufacturing process for a multilayer structure

Info

Publication number: AU2003294170A1
Authority: AU; Australia
Prior art keywords: manufacturing process; multilayer structure; multilayer; manufacturing
Prior art date: 2002-12-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003294170A

Inventor

Carlos Mazure

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Soitec SA

Original Assignee

Soitec SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-12-06

Filing date

2003-12-05

Publication date

2004-06-30

2003-12-05 Application filed by Soitec SA filed Critical Soitec SA

2004-06-30 Publication of AU2003294170A1 publication Critical patent/AU2003294170A1/en

Status Abandoned legal-status Critical Current

Classifications

- H10P90/1924—
- H10P14/20—
- H10P90/1916—
- H10W10/181—

AU2003294170A 2002-12-06 2003-12-05 Manufacturing process for a multilayer structure Abandoned AU2003294170A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
FR0215499A FR2848334A1 (en)	2002-12-06	2002-12-06	Multi-layer structure production of semiconductor materials with different mesh parameters comprises epitaxy of thin film on support substrate and adhesion on target substrate
FR02/15499		2002-12-06
PCT/IB2003/006397 WO2004053961A1 (en)	2002-12-06	2003-12-05	Manufacturing process for a multilayer structure

Publications (1)

Publication Number	Publication Date
AU2003294170A1 true AU2003294170A1 (en)	2004-06-30

Family

ID=32320086

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003294170A Abandoned AU2003294170A1 (en)	2002-12-06	2003-12-05	Manufacturing process for a multilayer structure

Country Status (8)

Country	Link
EP (1)	EP1568073A1 (en)
JP (1)	JP4762547B2 (en)
KR (1)	KR100797210B1 (en)
CN (1)	CN1720605A (en)
AU (1)	AU2003294170A1 (en)
FR (1)	FR2848334A1 (en)
TW (1)	TWI289880B (en)
WO (1)	WO2004053961A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7110081B2 (en)	2002-11-12	2006-09-19	Asml Netherlands B.V.	Lithographic apparatus and device manufacturing method
US7247545B2 (en) *	2004-11-10	2007-07-24	Sharp Laboratories Of America, Inc.	Fabrication of a low defect germanium film by direct wafer bonding
EP2269226A1 (en) *	2008-03-13	2011-01-05	S.O.I.Tec Silicon on Insulator Technologies	Substrate having a charged zone in an insulating buried layer
CN105023991B (en) *	2014-04-30	2018-02-23	环视先进数字显示无锡有限公司	A kind of manufacture method of the LED laminated circuit boards based on inorganic matter
CN108231695A (en) *	2016-12-15	2018-06-29	上海新微技术研发中心有限公司	Composite substrate and method for manufacturing the same
CN107195534B (en) *	2017-05-24	2021-04-13	中国科学院上海微系统与信息技术研究所	Ge composite substrate, substrate epitaxial structure and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5882987A (en) *	1997-08-26	1999-03-16	International Business Machines Corporation	Smart-cut process for the production of thin semiconductor material films
FR2783254B1 (en) *	1998-09-10	2000-11-10	France Telecom	METHOD FOR OBTAINING A LAYER OF MONOCRYSTALLINE GERMANIUM ON A MONOCRYSTALLINE SILICON SUBSTRATE, AND PRODUCTS OBTAINED
JP2001015721A (en) *	1999-04-30	2001-01-19	Canon Inc	Method for separating composite member and method for producing thin film
US6323108B1 (en) *	1999-07-27	2001-11-27	The United States Of America As Represented By The Secretary Of The Navy	Fabrication ultra-thin bonded semiconductor layers
JP3607194B2 (en) *	1999-11-26	2005-01-05	株式会社東芝	Semiconductor device, semiconductor device manufacturing method, and semiconductor substrate
FR2809867B1 (en) *	2000-05-30	2003-10-24	Commissariat Energie Atomique	FRAGILE SUBSTRATE AND METHOD FOR MANUFACTURING SUCH SUBSTRATE
JP2004507084A (en) *	2000-08-16	2004-03-04	マサチューセッツ　インスティテュート　オブ　テクノロジー	Manufacturing process of semiconductor products using graded epitaxial growth
WO2002071491A1 (en) *	2001-03-02	2002-09-12	Amberwave Systems Corporation	Relaxed silicon germanium platform for high speed cmos electronics and high speed analog circuits
US6940089B2 (en) *	2001-04-04	2005-09-06	Massachusetts Institute Of Technology	Semiconductor device structure
US6566158B2 (en) *	2001-08-17	2003-05-20	Rosemount Aerospace Inc.	Method of preparing a semiconductor using ion implantation in a SiC layer
JP2003249641A (en) *	2002-02-22	2003-09-05	Sharp Corp	Semiconductor substrate, method of manufacturing the same, and semiconductor device

2002
- 2002-12-06 FR FR0215499A patent/FR2848334A1/en active Pending
2003
- 2003-12-05 JP JP2004558309A patent/JP4762547B2/en not_active Expired - Lifetime
- 2003-12-05 KR KR1020057010109A patent/KR100797210B1/en not_active Expired - Lifetime
- 2003-12-05 CN CNA2003801052499A patent/CN1720605A/en active Pending
- 2003-12-05 WO PCT/IB2003/006397 patent/WO2004053961A1/en not_active Ceased
- 2003-12-05 AU AU2003294170A patent/AU2003294170A1/en not_active Abandoned
- 2003-12-05 EP EP03789590A patent/EP1568073A1/en not_active Withdrawn
- 2003-12-05 TW TW092134368A patent/TWI289880B/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
CN1720605A (en)	2006-01-11
TWI289880B (en)	2007-11-11
EP1568073A1 (en)	2005-08-31
KR100797210B1 (en)	2008-01-22
TW200511393A (en)	2005-03-16
JP2006509361A (en)	2006-03-16
WO2004053961A1 (en)	2004-06-24
KR20050084146A (en)	2005-08-26
JP4762547B2 (en)	2011-08-31
FR2848334A1 (en)	2004-06-11

Similar Documents

Publication	Publication Date	Title
AUPS309002A0 (en)	2002-07-11	A covertile for a substrate
AU2003234247A1 (en)	2003-11-11	Method for manufacturing clad components
AU2003289764A1 (en)	2004-06-30	Method for forming a dielectric stack
AU2002322966A1 (en)	2003-09-29	Process for manufacturing mems
AU2003214748A1 (en)	2003-10-08	A process for the manufacture of a decorative laminate
AU2003901583A0 (en)	2003-05-01	A process
AU2003232689A1 (en)	2003-12-02	Method for manufacturing a polymer oled
AU2003207217A1 (en)	2003-10-13	Method for manufacturing honeycomb structure
AU2002358148A1 (en)	2004-07-09	Process for manufacturing foils for coatings
AU2003281370A1 (en)	2004-01-23	Method for manufacturing a composite seal
AU2003297325A1 (en)	2004-07-29	A method for forming ceramic film capacitors
AU2003249281A1 (en)	2004-03-11	Method for manufacturing a metallic tubular assembly
AU2003290961A1 (en)	2004-07-29	Process for manufacturing fluoroolefins
PL371243A1 (en)	2005-06-13	Process for manufacturing paper
AU2002339126A1 (en)	2003-05-19	Method for manufacturing a stent
AU2002358790A1 (en)	2003-07-24	Method for maintaining a production installation
AU2003272267A1 (en)	2004-03-29	A diagnostic method for manufacturing processes
AU2002321342A1 (en)	2004-02-09	A manufacturing substrate and a method for forming it
AU2003229282A1 (en)	2003-12-02	Method for producing a ceramic-copper composite substrate
AU2002357087A1 (en)	2003-07-09	Method for manufacturing a mat
AU2003294170A1 (en)	2004-06-30	Manufacturing process for a multilayer structure
AU2002351968A1 (en)	2003-03-03	Method for producing a substrate arrangement
AU2003241263A1 (en)	2003-12-12	A method for manufacturing an evaporator
AU2003240074A1 (en)	2003-12-22	Process for manufacturing alkanes
AU2003234060A1 (en)	2004-12-03	Method and machine for manufacturing a panel element and element so carried out

Legal Events

Date	Code	Title	Description
2005-08-25	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase