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AU2003280468A1 - Miniature rf and microwave components and methods for fabricating such components - Google Patents

Miniature rf and microwave components and methods for fabricating such components

Info

Publication number
AU2003280468A1
AU2003280468A1 AU2003280468A AU2003280468A AU2003280468A1 AU 2003280468 A1 AU2003280468 A1 AU 2003280468A1 AU 2003280468 A AU2003280468 A AU 2003280468A AU 2003280468 A AU2003280468 A AU 2003280468A AU 2003280468 A1 AU2003280468 A1 AU 2003280468A1
Authority
AU
Australia
Prior art keywords
components
miniature
fabricating
methods
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003280468A
Other languages
English (en)
Inventor
Christopher A. Bang
Elliott R. Brown
Adam L. Cohen
John D. Evans
Morton Grosser
Michael S. Lockard
Dennis R. Smalley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Memgen Corp
Original Assignee
Memgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/309,521 external-priority patent/US7259640B2/en
Priority claimed from US10/434,519 external-priority patent/US7252861B2/en
Priority claimed from US10/434,497 external-priority patent/US7303663B2/en
Priority claimed from US10/434,103 external-priority patent/US7160429B2/en
Priority claimed from US10/434,295 external-priority patent/US20040004001A1/en
Application filed by Memgen Corp filed Critical Memgen Corp
Publication of AU2003280468A1 publication Critical patent/AU2003280468A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/005—Manufacturing coaxial lines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00126—Static structures not provided for in groups B81C1/00031 - B81C1/00119
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/202—Coaxial filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/183—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers at least one of the guides being a coaxial line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguides (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
AU2003280468A 2002-06-27 2003-06-27 Miniature rf and microwave components and methods for fabricating such components Abandoned AU2003280468A1 (en)

Applications Claiming Priority (19)

Application Number Priority Date Filing Date Title
US39253102P 2002-06-27 2002-06-27
US60/392,531 2002-06-27
US41537402P 2002-10-01 2002-10-01
US60/415,374 2002-10-01
US10/309,521 2002-12-03
US10/309,521 US7259640B2 (en) 2001-12-03 2002-12-03 Miniature RF and microwave components and methods for fabricating such components
US46450403P 2003-04-21 2003-04-21
US60/464,504 2003-04-21
US10/434,519 US7252861B2 (en) 2002-05-07 2003-05-07 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
US10/434,497 2003-05-07
US10/434,519 2003-05-07
US10/434,497 US7303663B2 (en) 2002-05-07 2003-05-07 Multistep release method for electrochemically fabricated structures
US10/434,103 2003-05-07
US10/434,103 US7160429B2 (en) 2002-05-07 2003-05-07 Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
US10/434,295 US20040004001A1 (en) 2002-05-07 2003-05-07 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
US10/434,295 2003-05-07
US47655403P 2003-06-06 2003-06-06
US60/476,554 2003-06-06
PCT/US2003/020458 WO2004004061A1 (fr) 2002-06-27 2003-06-27 Composants rf et electromagnetiques miniatures et procedes de fabrication desdits composants

Publications (1)

Publication Number Publication Date
AU2003280468A1 true AU2003280468A1 (en) 2004-01-19

Family

ID=30004145

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003280468A Abandoned AU2003280468A1 (en) 2002-06-27 2003-06-27 Miniature rf and microwave components and methods for fabricating such components

Country Status (5)

Country Link
EP (1) EP1520321A1 (fr)
JP (2) JP2005532015A (fr)
CN (1) CN1669177A (fr)
AU (1) AU2003280468A1 (fr)
WO (1) WO2004004061A1 (fr)

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TWI238513B (en) 2003-03-04 2005-08-21 Rohm & Haas Elect Mat Coaxial waveguide microstructures and methods of formation thereof
EP2016644B1 (fr) * 2006-04-25 2011-08-17 ThruVision Systems Limited Ensemble de cornets d'alimentation et son procede de fabrication
US7482893B2 (en) * 2006-05-18 2009-01-27 The Regents Of The University Of California Power combiners using meta-material composite right/left hand transmission line at infinite wavelength frequency
KR101476438B1 (ko) 2006-12-30 2014-12-24 누보트로닉스, 엘.엘.씨 3차원 미세구조 및 그 형성방법
CN101274735B (zh) * 2006-12-30 2012-11-21 罗门哈斯电子材料有限公司 三维微结构及其形成方法
CN101274736A (zh) * 2006-12-30 2008-10-01 罗门哈斯电子材料有限公司 三维微结构及其形成方法
EP3104450A3 (fr) 2007-03-20 2016-12-28 Nuvotronics, LLC Composants électroniques intégrés et leurs procédés de formation
US7898356B2 (en) 2007-03-20 2011-03-01 Nuvotronics, Llc Coaxial transmission line microstructures and methods of formation thereof
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
JP4980397B2 (ja) * 2009-07-06 2012-07-18 三菱電機株式会社 方形同軸線路スロットアレーアンテナ
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
KR101796098B1 (ko) 2010-01-22 2017-11-10 누보트로닉스, 인크. 열관리
DE102010013384A1 (de) * 2010-03-30 2011-10-06 Spinner Gmbh Koaxialleiterstruktur
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
US8786515B2 (en) 2011-08-30 2014-07-22 Harris Corporation Phased array antenna module and method of making same
US9142497B2 (en) 2011-10-05 2015-09-22 Harris Corporation Method for making electrical structure with air dielectric and related electrical structures
US9706605B2 (en) * 2012-03-30 2017-07-11 Applied Materials, Inc. Substrate support with feedthrough structure
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
JP6284144B2 (ja) * 2014-02-14 2018-02-28 マクセルホールディングス株式会社 電鋳品及びその製造方法
WO2016061777A1 (fr) * 2014-10-23 2016-04-28 华为技术有限公司 Multiplexeur micro-bande
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
WO2016094129A1 (fr) 2014-12-03 2016-06-16 Nuvotronics, Inc. Systèmes et procédés de fabrication de circuits et de lignes de transmission empilés
DE102015201927A1 (de) 2015-02-04 2016-08-04 Siemens Aktiengesellschaft Verfahren zum Kaltgasspritzen mit Maske
JP6832871B2 (ja) * 2015-12-28 2021-02-24 株式会社村田製作所 マルチプレクサ
EP3301758A1 (fr) * 2016-09-30 2018-04-04 IMS Connector Systems GmbH Élément d'antenne
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
DE102018109505A1 (de) 2018-04-20 2019-10-24 Stl Systems Ag Polyederförmige Spulensysteme mit großem Homogenitätsvolumen und großem Zugangsbereich
CN113228503B (zh) 2018-12-20 2024-12-27 京瓷Avx元器件公司 包括高精度电感器的多层电子装置
US11114993B2 (en) 2018-12-20 2021-09-07 Avx Corporation High frequency multilayer filter
WO2020132179A1 (fr) 2018-12-20 2020-06-25 Avx Corporation Filtre multicouche comprenant un condensateur connecté à au moins deux trous d'interconnexion
WO2020132025A1 (fr) 2018-12-20 2020-06-25 Avx Corporation Filtre multicouche comprenant une saillie de réduction de signal de retour
JP7355827B2 (ja) 2018-12-20 2023-10-03 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 精密に制御された容量性エリアを有するコンデンサを備える多層電子デバイス
CN109940398B (zh) * 2019-03-26 2020-09-29 中国科学院微电子研究所 一种微观零件批量精密加工仪器
CN110380178B (zh) * 2019-07-29 2021-07-13 中国电子科技集团公司第五十五研究所 基于硅微机械加工的毫米波径向多路功率分配器
CN111585045B (zh) * 2020-05-20 2022-04-12 西安黄河机电有限公司 一种多联骨牌稀布天线及其布阵方法

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Also Published As

Publication number Publication date
JP2005532015A (ja) 2005-10-20
WO2004004061A1 (fr) 2004-01-08
CN1669177A (zh) 2005-09-14
EP1520321A1 (fr) 2005-04-06
JP2009038806A (ja) 2009-02-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase