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AU2003270225A1 - Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region - Google Patents

Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region

Info

Publication number
AU2003270225A1
AU2003270225A1 AU2003270225A AU2003270225A AU2003270225A1 AU 2003270225 A1 AU2003270225 A1 AU 2003270225A1 AU 2003270225 A AU2003270225 A AU 2003270225A AU 2003270225 A AU2003270225 A AU 2003270225A AU 2003270225 A1 AU2003270225 A1 AU 2003270225A1
Authority
AU
Australia
Prior art keywords
rigid
region
flexible
production
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003270225A
Inventor
Markus Wille
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ruwel AG
Original Assignee
Ruwel AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10258090A external-priority patent/DE10258090B4/en
Application filed by Ruwel AG filed Critical Ruwel AG
Publication of AU2003270225A1 publication Critical patent/AU2003270225A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU2003270225A 2002-09-19 2003-09-19 Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region Abandoned AU2003270225A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE20218203.7 2002-09-19
DE20218203 2002-09-19
DE10258090A DE10258090B4 (en) 2002-09-19 2002-12-11 Method for producing rigid-flexible printed circuit boards and printed circuit boards with at least one rigid area and at least one flexible area
DE10258090.1 2002-12-11
PCT/EP2003/010437 WO2004030429A1 (en) 2002-09-19 2003-09-19 Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region

Publications (1)

Publication Number Publication Date
AU2003270225A1 true AU2003270225A1 (en) 2004-04-19

Family

ID=32043983

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003270225A Abandoned AU2003270225A1 (en) 2002-09-19 2003-09-19 Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region

Country Status (3)

Country Link
AU (1) AU2003270225A1 (en)
DE (1) DE20221189U1 (en)
WO (1) WO2004030429A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101617569B (en) * 2007-02-16 2011-03-30 At&S奥地利科技及系统技术股份公司 Non-stick material, method for removing a portion of a flat material layer and multilayer structure and use thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7892625B2 (en) 2006-07-20 2011-02-22 Dyconex Ag Method of fabricating an electrical connecting element, and an electrical connecting element
AT11663U1 (en) * 2007-02-16 2011-02-15 Austria Tech & System Tech ABSORPTION MATERIAL, METHOD FOR REMOVING A PARTIAL AREA OF A SURFACE MATERIAL LAYER, AND MULTILAYER STRUCTURE AND USE OF THE HORTOR
AT11664U1 (en) * 2007-02-16 2011-02-15 Austria Tech & System Tech METHOD FOR REMOVING A PARTIAL AREA OF A SURFACE MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE HIEFÜR
AT10029U1 (en) 2007-02-16 2008-07-15 Austria Tech & System Tech METHOD FOR PRODUCING A RIGID FLEXIBLE PCB AND RIGID FLEXIBLE PCB
DE102008028300B4 (en) * 2008-06-13 2021-10-07 Tdk Electronics Ag Flexible area printed circuit board and method of manufacture
AT13434U1 (en) 2012-02-21 2013-12-15 Austria Tech & System Tech Method for producing a printed circuit board and use of such a method
WO2015077808A1 (en) 2013-11-27 2015-06-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Circuit board structure
AT515101B1 (en) 2013-12-12 2015-06-15 Austria Tech & System Tech Method for embedding a component in a printed circuit board
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
AT515447B1 (en) 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Method for contacting a component embedded in a printed circuit board and printed circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2657212C3 (en) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Process for the production of rigid and flexible areas having printed circuit boards
DE3223981A1 (en) * 1982-06-26 1983-12-29 Hartmann & Braun Ag, 6000 Frankfurt Printed circuit
DE3318717C1 (en) * 1983-05-21 1984-05-30 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth Process for manufacturing printed circuit boards with rigid and flexible areas
DE4003344C1 (en) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
JP3209772B2 (en) * 1991-07-08 2001-09-17 株式会社フジクラ Manufacturing method of rigid flex wiring board
DE4206746C1 (en) * 1992-03-04 1993-06-24 Degussa Ag, 6000 Frankfurt, De Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
JPH06216531A (en) * 1993-01-13 1994-08-05 Ibiden Co Ltd Manufacture of printed wiring board
DE19507607C2 (en) 1995-03-04 1998-12-10 Kaercher Gmbh & Co Alfred Mobile sweeper
JPH0992979A (en) * 1995-09-26 1997-04-04 Toshiba Chem Corp Manufacture of multilayer flex rigid wiring board
DE19635808A1 (en) 1996-09-04 1998-03-05 Bayerische Motoren Werke Ag Auxiliary drive for rimmed vehicle-wheel
JPH10173342A (en) * 1996-12-13 1998-06-26 Toshiba Chem Corp Multilayer flexible rigid wiring board and production thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101617569B (en) * 2007-02-16 2011-03-30 At&S奥地利科技及系统技术股份公司 Non-stick material, method for removing a portion of a flat material layer and multilayer structure and use thereof

Also Published As

Publication number Publication date
WO2004030429A1 (en) 2004-04-08
DE20221189U1 (en) 2005-05-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase