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AU2002351206A1 - Lateral lubistor structure and method - Google Patents

Lateral lubistor structure and method

Info

Publication number
AU2002351206A1
AU2002351206A1 AU2002351206A AU2002351206A AU2002351206A1 AU 2002351206 A1 AU2002351206 A1 AU 2002351206A1 AU 2002351206 A AU2002351206 A AU 2002351206A AU 2002351206 A AU2002351206 A AU 2002351206A AU 2002351206 A1 AU2002351206 A1 AU 2002351206A1
Authority
AU
Australia
Prior art keywords
lateral
lubistor
lubistor structure
lateral lubistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002351206A
Inventor
Jack Mandelman
Steven H. Voldman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2002351206A1 publication Critical patent/AU2002351206A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/711Insulated-gate field-effect transistors [IGFET] having floating bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/211Gated diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/62Fin field-effect transistors [FinFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/62Fin field-effect transistors [FinFET]
    • H10D30/6218Fin field-effect transistors [FinFET] of the accumulation type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/611Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
AU2002351206A 2002-12-03 2002-12-03 Lateral lubistor structure and method Abandoned AU2002351206A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/038546 WO2004051749A1 (en) 2002-12-03 2002-12-03 Lateral lubistor structure and method

Publications (1)

Publication Number Publication Date
AU2002351206A1 true AU2002351206A1 (en) 2004-06-23

Family

ID=32467120

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002351206A Abandoned AU2002351206A1 (en) 2002-12-03 2002-12-03 Lateral lubistor structure and method

Country Status (5)

Country Link
EP (1) EP1599904A4 (en)
JP (1) JP2006522460A (en)
CN (1) CN100459119C (en)
AU (1) AU2002351206A1 (en)
WO (1) WO2004051749A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005007822B4 (en) 2005-02-21 2014-05-22 Infineon Technologies Ag Integrated circuit arrangement with tunnel field effect transistor
DE102005022763B4 (en) 2005-05-18 2018-02-01 Infineon Technologies Ag Electronic circuit arrangement and method for producing an electronic circuit
DE102005039365B4 (en) 2005-08-19 2022-02-10 Infineon Technologies Ag Gate-controlled fin resistive element operating as a pinch - resistor for use as an ESD protection element in an electrical circuit and a device for protecting against electrostatic discharges in an electrical circuit
CN100449783C (en) * 2005-11-29 2009-01-07 台湾积体电路制造股份有限公司 Fin field effect transistor with body contact window and manufacturing method thereof
DE102006022105B4 (en) * 2006-05-11 2012-03-08 Infineon Technologies Ag ESD protection element and ESD protection device for use in an electrical circuit
DE102006023429B4 (en) 2006-05-18 2011-03-10 Infineon Technologies Ag ESD protection element for use in an electrical circuit
US7456471B2 (en) * 2006-09-15 2008-11-25 International Business Machines Corporation Field effect transistor with raised source/drain fin straps
EP2117045A1 (en) * 2008-05-09 2009-11-11 Imec Design Methodology for MuGFET ESD Protection Devices
US8232603B2 (en) * 2009-03-19 2012-07-31 International Business Machines Corporation Gated diode structure and method including relaxed liner
CN102683418B (en) * 2012-05-22 2014-11-26 清华大学 FINFET dynamic random access memory unit and processing method thereof
US8785968B2 (en) * 2012-10-08 2014-07-22 Intel Mobile Communications GmbH Silicon controlled rectifier (SCR) device for bulk FinFET technology
US9209265B2 (en) * 2012-11-15 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. ESD devices comprising semiconductor fins
US9093492B2 (en) 2012-11-29 2015-07-28 Taiwan Semiconductor Manufacturing Company, Ltd. Diode structure compatible with FinFET process
CN104124153B (en) * 2013-04-28 2016-08-31 中芯国际集成电路制造(上海)有限公司 Fin bipolar junction transistor and forming method thereof
US9601607B2 (en) * 2013-11-27 2017-03-21 Qualcomm Incorporated Dual mode transistor
CN107369710B (en) * 2016-05-12 2020-06-09 中芯国际集成电路制造(上海)有限公司 Gate-controlled diode and method of forming the same
CN107492569B (en) * 2016-06-12 2020-02-07 中芯国际集成电路制造(上海)有限公司 Gated diode and method of forming the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037140A (en) * 1976-04-14 1977-07-19 Rca Corporation Protection circuit for insulated-gate field-effect transistors (IGFETS)
US4282556A (en) * 1979-05-21 1981-08-04 Rca Corporation Input protection device for insulated gate field effect transistor
JPH0425175A (en) * 1990-05-21 1992-01-28 Canon Inc diode
US5610790A (en) * 1995-01-20 1997-03-11 Xilinx, Inc. Method and structure for providing ESD protection for silicon on insulator integrated circuits
JPH10125801A (en) * 1996-09-06 1998-05-15 Mitsubishi Electric Corp Semiconductor integrated circuit device
US5952695A (en) * 1997-03-05 1999-09-14 International Business Machines Corporation Silicon-on-insulator and CMOS-on-SOI double film structures
US6413802B1 (en) * 2000-10-23 2002-07-02 The Regents Of The University Of California Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture
US6894324B2 (en) * 2001-02-15 2005-05-17 United Microelectronics Corp. Silicon-on-insulator diodes and ESD protection circuits

Also Published As

Publication number Publication date
CN1695245A (en) 2005-11-09
EP1599904A4 (en) 2006-04-26
CN100459119C (en) 2009-02-04
JP2006522460A (en) 2006-09-28
EP1599904A1 (en) 2005-11-30
WO2004051749A1 (en) 2004-06-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase