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AU2002229116A1 - Miniature silicon condenser microphone and method for producing same - Google Patents

Miniature silicon condenser microphone and method for producing same

Info

Publication number
AU2002229116A1
AU2002229116A1 AU2002229116A AU2911602A AU2002229116A1 AU 2002229116 A1 AU2002229116 A1 AU 2002229116A1 AU 2002229116 A AU2002229116 A AU 2002229116A AU 2911602 A AU2911602 A AU 2911602A AU 2002229116 A1 AU2002229116 A1 AU 2002229116A1
Authority
AU
Australia
Prior art keywords
condenser microphone
silicon condenser
producing same
transducer unit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002229116A
Inventor
Anthony D. Minervini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26943352&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2002229116(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Publication of AU2002229116A1 publication Critical patent/AU2002229116A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
AU2002229116A 2000-11-28 2001-10-22 Miniature silicon condenser microphone and method for producing same Abandoned AU2002229116A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US25354300P 2000-11-28 2000-11-28
US60/253,543 2000-11-28
US09/886,854 US7166910B2 (en) 2000-11-28 2001-06-21 Miniature silicon condenser microphone
US09/886,854 2001-06-21
PCT/US2001/049462 WO2002045463A2 (en) 2000-11-28 2001-10-22 Miniature silicon condenser microphone and method for producing same

Publications (1)

Publication Number Publication Date
AU2002229116A1 true AU2002229116A1 (en) 2002-06-11

Family

ID=26943352

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002229116A Abandoned AU2002229116A1 (en) 2000-11-28 2001-10-22 Miniature silicon condenser microphone and method for producing same

Country Status (6)

Country Link
US (3) US7166910B2 (en)
EP (2) EP1346601B1 (en)
JP (3) JP4532827B2 (en)
AT (1) ATE510415T1 (en)
AU (1) AU2002229116A1 (en)
WO (1) WO2002045463A2 (en)

Families Citing this family (322)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US8629005B1 (en) 2000-11-28 2014-01-14 Knowles Electronics, Llc Methods of manufacture of bottom port surface mount silicon condenser microphone packages
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
JP4620303B2 (en) * 2001-09-20 2011-01-26 株式会社東海理化電機製作所 Semiconductor device and manufacturing method thereof
CN1316348C (en) 2002-04-15 2007-05-16 埃波斯技术有限公司 Method and system for obtaining positioning data
FI118505B (en) * 2002-06-04 2007-11-30 Aspocomp Oy Acoustically active element formed in a multilayer circuit board structure, a method for forming an acoustically active element in a multilayer circuit board structure, and a multilayer circuit board structure
DE10238523B4 (en) * 2002-08-22 2014-10-02 Epcos Ag Encapsulated electronic component and method of manufacture
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE10303263B4 (en) * 2003-01-28 2012-01-05 Infineon Technologies Ag microphone array
US7501703B2 (en) * 2003-02-28 2009-03-10 Knowles Electronics, Llc Acoustic transducer module
US7382048B2 (en) * 2003-02-28 2008-06-03 Knowles Electronics, Llc Acoustic transducer module
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
JP2007528120A (en) 2003-07-03 2007-10-04 テッセラ テクノロジーズ ハンガリー コルラートルト フェレロェセーギュー タールシャシャーグ Method and apparatus for packaging integrated circuit devices
US20050095835A1 (en) 2003-09-26 2005-05-05 Tessera, Inc. Structure and method of making capped chips having vertical interconnects
US6932187B2 (en) * 2003-10-14 2005-08-23 Gore Enterprise Holdings, Inc. Protective acoustic cover assembly
US20050116344A1 (en) * 2003-10-29 2005-06-02 Tessera, Inc. Microelectronic element having trace formed after bond layer
KR100675026B1 (en) * 2003-11-05 2007-01-29 주식회사 비에스이 How to mount a condenser microphone on the main PC
EP1720794A2 (en) * 2004-03-01 2006-11-15 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
DE102004011149B3 (en) * 2004-03-08 2005-11-10 Infineon Technologies Ag Microphone and method of making a microphone
DE102004011148B3 (en) * 2004-03-08 2005-11-10 Infineon Technologies Ag Microphone esp. semiconductor capacitor microphone for use in mobile telephones and the like having space between chip and substrate in pressure communication with space between chip and cover
JP4264104B2 (en) * 2004-03-09 2009-05-13 パナソニック株式会社 Electret condenser microphone
DE102004020204A1 (en) * 2004-04-22 2005-11-10 Epcos Ag Encapsulated electrical component and method of manufacture
DE102004020139A1 (en) * 2004-04-24 2005-11-17 Daimlerchrysler Ag lambda probe
US7929714B2 (en) * 2004-08-11 2011-04-19 Qualcomm Incorporated Integrated audio codec with silicon audio transducer
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
DK1792517T3 (en) * 2004-09-13 2013-07-08 Oticon As Audio processing device with embedded electronic component
DK1638366T3 (en) 2004-09-20 2015-12-14 Sonion Nederland Bv microphone device
US7999366B2 (en) * 2004-11-26 2011-08-16 Stmicroelectronics, S.A. Micro-component packaging process and set of micro-components resulting from this process
US7795695B2 (en) 2005-01-27 2010-09-14 Analog Devices, Inc. Integrated microphone
US7373835B2 (en) 2005-01-31 2008-05-20 Sanyo Electric Industries, Ltd. Semiconductor sensor
US20060183270A1 (en) * 2005-02-14 2006-08-17 Tessera, Inc. Tools and methods for forming conductive bumps on microelectronic elements
DE102005008514B4 (en) * 2005-02-24 2019-05-16 Tdk Corporation Microphone membrane and microphone with the microphone membrane
KR20060094316A (en) * 2005-02-24 2006-08-29 주식회사 비에스이 Condenser microphone and its manufacturing method
DE102005008512B4 (en) * 2005-02-24 2016-06-23 Epcos Ag Electrical module with a MEMS microphone
DE102005008511B4 (en) * 2005-02-24 2019-09-12 Tdk Corporation MEMS microphone
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
JP4954971B2 (en) * 2005-03-23 2012-06-20 エポス ディベロップメント リミテッド Method and system for digital pen assembly
DE102005017357A1 (en) * 2005-04-14 2006-10-26 Siemens Audiologische Technik Gmbh Microphone device for a hearing aid
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
JP4256367B2 (en) * 2005-07-06 2009-04-22 東京エレクトロン株式会社 Vibration wave detector
KR100648398B1 (en) 2005-07-07 2006-11-24 주식회사 비에스이 Packaging Structure of Silicon Condenser Microphone and Manufacturing Method Thereof
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
US8483776B2 (en) † 2005-07-27 2013-07-09 Sony Corporation Acoustic path for a wireless communications device
JP2007043327A (en) * 2005-08-01 2007-02-15 Star Micronics Co Ltd Condenser microphone
US20070040231A1 (en) * 2005-08-16 2007-02-22 Harney Kieran P Partially etched leadframe packages having different top and bottom topologies
US7961897B2 (en) 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
US8477983B2 (en) * 2005-08-23 2013-07-02 Analog Devices, Inc. Multi-microphone system
JP4812378B2 (en) * 2005-09-13 2011-11-09 パナソニック株式会社 Condenser microphone
DE102005050398A1 (en) * 2005-10-20 2007-04-26 Epcos Ag Cavity housing for a mechanically sensitive electronic device and method of manufacture
JP4642634B2 (en) * 2005-10-31 2011-03-02 パナソニック株式会社 Manufacturing method of acoustic sensor
US7620376B2 (en) * 2005-11-03 2009-11-17 Nokia Corporation Method and arrangement for performing analog signal processing and measuring between a signal source and a load
EP1949749A1 (en) * 2005-11-09 2008-07-30 Nxp B.V. Arrangement for optimizing the frequency response of an electro-acoustic transducer
DE102005053765B4 (en) * 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
DE102005053767B4 (en) * 2005-11-10 2014-10-30 Epcos Ag MEMS microphone, method of manufacture and method of installation
DE102005054177B4 (en) * 2005-11-14 2011-12-22 Infineon Technologies Ag A method of manufacturing a plurality of packaged sensor modules
JP5186102B2 (en) * 2005-11-25 2013-04-17 パナソニック株式会社 Microphone package manufacturing method and microphone package
KR100868593B1 (en) 2005-12-06 2008-11-13 야마하 가부시키가이샤 Semiconductor device and manufacturing method thereof
EP1795496A2 (en) 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
US20070138644A1 (en) * 2005-12-15 2007-06-21 Tessera, Inc. Structure and method of making capped chip having discrete article assembled into vertical interconnect
JP2007178133A (en) * 2005-12-27 2007-07-12 Yamaha Corp Pressure sensor module, manufacturing method thereof, and semiconductor device
KR101175728B1 (en) * 2006-01-20 2012-08-22 삼성전자주식회사 Apparatus for shielding the electromagnetic interference of a display module and method for manufacturing thereof
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
EP1814356B1 (en) 2006-01-26 2010-03-24 Sonion MEMS A/S An elastomeric shield for miniature microphones
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same
TWI293500B (en) * 2006-03-03 2008-02-11 Advanced Semiconductor Eng Microelectromechanical microphone packaging system
KR100722689B1 (en) 2006-05-03 2007-05-30 주식회사 비에스이 Silicon Condenser Microphone with Additional Back Chamber
KR100722687B1 (en) 2006-05-09 2007-05-30 주식회사 비에스이 Directional Silicon Condenser Microphone with Additional Back Chamber
KR100722686B1 (en) * 2006-05-09 2007-05-30 주식회사 비에스이 Silicon condenser microphone with additional back chamber and acoustic holes formed in the substrate
JP4657974B2 (en) * 2006-05-09 2011-03-23 パナソニック株式会社 Card type MEMS microphone
US7763488B2 (en) * 2006-06-05 2010-07-27 Akustica, Inc. Method of fabricating MEMS device
US8344487B2 (en) * 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
KR20080005854A (en) 2006-07-10 2008-01-15 야마하 가부시키가이샤 Pressure sensor and its manufacturing method
JP4771290B2 (en) * 2006-07-19 2011-09-14 ヤマハ株式会社 Manufacturing method of pressure sensor
WO2008014324A2 (en) * 2006-07-25 2008-01-31 Analog Devices, Inc. Multiple microphone system
KR20080011066A (en) * 2006-07-27 2008-01-31 스타 마이크로닉스 컴퍼니 리미티드 Casing and condenser microphone of microphone
TWI301823B (en) * 2006-08-29 2008-10-11 Ind Tech Res Inst Package structure and packaging method of mems microphone
US7579678B2 (en) * 2006-09-04 2009-08-25 Yamaha Corporation Semiconductor microphone unit
KR100740463B1 (en) * 2006-09-09 2007-07-18 주식회사 비에스이 Silicon condenser microphone
DE102006046292B9 (en) * 2006-09-29 2014-04-30 Epcos Ag Component with MEMS microphone and method of manufacture
US8846161B2 (en) * 2006-10-03 2014-09-30 Brigham Young University Hydrophobic coating and method
JP5351031B2 (en) * 2006-10-03 2013-11-27 ソニック イノヴェイションズ インコーポレイテッド Hydrophobic and oleophobic coatings and methods for their preparation
KR100776210B1 (en) * 2006-10-10 2007-11-16 주식회사 비에스이 Apparatus for manufacturing microphone assembly and method of manufacturing same
PL2056675T3 (en) 2006-10-12 2019-08-30 Galera Labs, Llc Methods of treating oral mucositis
FR2907632A1 (en) * 2006-10-20 2008-04-25 Merry Electronics Co Ltd Micro-electromechanical system package has isolative stuff that seals group of components and upper surface of substrate to protect group of components from moisture and shield protects components from electromagnetic interference
US8369555B2 (en) * 2006-10-27 2013-02-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Piezoelectric microphones
US20080219482A1 (en) * 2006-10-31 2008-09-11 Yamaha Corporation Condenser microphone
DE102006055147B4 (en) * 2006-11-03 2011-01-27 Infineon Technologies Ag Sound transducer structure and method for producing a sound transducer structure
JP2008141409A (en) * 2006-11-30 2008-06-19 Star Micronics Co Ltd Condenser microphone and manufacturing method therefor
US20080175425A1 (en) * 2006-11-30 2008-07-24 Analog Devices, Inc. Microphone System with Silicon Microphone Secured to Package Lid
US20080144863A1 (en) * 2006-12-15 2008-06-19 Fazzio R Shane Microcap packaging of micromachined acoustic devices
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
ITMI20070099A1 (en) 2007-01-24 2008-07-25 St Microelectronics Srl ELECTRONIC DEVICE INCLUDING DIFFERENTIAL SENSOR DEVICES MEMS AND SUBSTRATES LAUNDRY
US7607355B2 (en) 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
EP2138010B1 (en) * 2007-03-14 2013-11-06 QUALCOMM Incorporated Mems microphone
TWI312763B (en) * 2007-03-19 2009-08-01 Ind Tech Res Inst A multi-layer package structure for an acoustic microsensor
CN101279709B (en) * 2007-04-04 2011-01-19 财团法人工业技术研究院 Multilayer packaging structure of miniature acoustic wave sensor
JP2008271426A (en) * 2007-04-24 2008-11-06 Matsushita Electric Works Ltd Acoustic sensor
JP5004840B2 (en) * 2007-04-25 2012-08-22 京セラ株式会社 Microphone element mounting substrate and microphone device
WO2008134530A2 (en) 2007-04-25 2008-11-06 University Of Florida Research Foundation, Inc. A capacitive microphone with integrated cavity
US8767983B2 (en) * 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
KR100904285B1 (en) * 2007-06-04 2009-06-25 주식회사 비에스이 Condenser microphone
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
GB2451909B (en) * 2007-08-17 2012-07-11 Wolfson Microelectronics Plc Mems process and device
WO2009016587A1 (en) * 2007-08-02 2009-02-05 Nxp B.V. Electro-acoustic transducer comprising a mems sensor
JP2009044600A (en) * 2007-08-10 2009-02-26 Panasonic Corp Microphone device and manufacturing method thereof
US20090175477A1 (en) * 2007-08-20 2009-07-09 Yamaha Corporation Vibration transducer
TWI328563B (en) * 2007-08-28 2010-08-11 Ind Tech Res Inst A stacked package structure for reducing package volume of an acoustic microsensor
US8542850B2 (en) * 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
US9305735B2 (en) 2007-09-28 2016-04-05 Brigham Young University Reinforced polymer x-ray window
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI339188B (en) * 2007-11-21 2011-03-21 Ind Tech Res Inst A package structure for mems type microphone and method therefor
JP4416835B2 (en) * 2008-02-08 2010-02-17 船井電機株式会社 Microphone unit
US7843021B2 (en) * 2008-02-28 2010-11-30 Shandong Gettop Acoustic Co. Ltd. Double-side mountable MEMS package
US8349635B1 (en) * 2008-05-20 2013-01-08 Silicon Laboratories Inc. Encapsulated MEMS device and method to form the same
US8604566B2 (en) * 2008-06-17 2013-12-10 Infineon Technologies Ag Sensor module and semiconductor chip
JP5320863B2 (en) 2008-07-02 2013-10-23 オムロン株式会社 Electronic components
DE102008032319B4 (en) * 2008-07-09 2012-06-06 Epcos Ag Method for producing an MST component
JP2010034990A (en) * 2008-07-30 2010-02-12 Funai Electric Co Ltd Differential microphone unit
US8193596B2 (en) * 2008-09-03 2012-06-05 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) package
US8995677B2 (en) * 2008-09-03 2015-03-31 Apple Inc. Accessory controller for electronic devices
US8265329B2 (en) * 2008-09-05 2012-09-11 Apple Inc. Compact housing for portable electronic device with internal speaker
JP4553043B2 (en) * 2008-09-12 2010-09-29 株式会社村田製作所 Acoustic transducer unit
JP4366666B1 (en) * 2008-09-12 2009-11-18 オムロン株式会社 Semiconductor device
US8013404B2 (en) * 2008-10-09 2011-09-06 Shandong Gettop Acoustic Co. Ltd. Folded lead-frame packages for MEMS devices
DE102008053327A1 (en) * 2008-10-27 2010-04-29 Epcos Ag Microphone arrangement for use in communication technology, has cased microphone, and acoustic channel connecting sound entry opening and environment above interconnect device on side of interconnect device
WO2010048833A1 (en) * 2008-10-28 2010-05-06 歌尔声学股份有限公司 Silicon capacitor microphone
US7915715B2 (en) 2008-11-25 2011-03-29 Amkor Technology, Inc. System and method to provide RF shielding for a MEMS microphone package
JP4859253B2 (en) * 2008-12-22 2012-01-25 株式会社エレメント電子 Circuit board having cavity, method for manufacturing the same, and method for manufacturing a circuit device using the same
JP2010161271A (en) * 2009-01-09 2010-07-22 Panasonic Corp Semiconductor package
JP2010171631A (en) * 2009-01-21 2010-08-05 Yamaha Corp Silicon microphone
US8199939B2 (en) * 2009-01-21 2012-06-12 Nokia Corporation Microphone package
JP2010183312A (en) * 2009-02-05 2010-08-19 Funai Electric Co Ltd Microphone unit
US8115283B1 (en) 2009-07-14 2012-02-14 Amkor Technology, Inc. Reversible top/bottom MEMS package
US8030722B1 (en) 2009-03-04 2011-10-04 Amkor Technology, Inc. Reversible top/bottom MEMS package
US8158492B2 (en) * 2009-04-29 2012-04-17 Freescale Semiconductor, Inc. MEMS microphone with cavity and method therefor
US8330239B2 (en) * 2009-04-29 2012-12-11 Freescale Semiconductor, Inc. Shielding for a micro electro-mechanical device and method therefor
US8155366B2 (en) * 2009-05-15 2012-04-10 Mwm Acoustics, Llc Transducer package with interior support frame
CN201438743U (en) * 2009-05-15 2010-04-14 瑞声声学科技(常州)有限公司 microphone
KR20120014591A (en) * 2009-05-18 2012-02-17 노우레스 일렉트로닉스, 엘엘시 Microphone with reduced vibration sensitivity
US8571249B2 (en) * 2009-05-29 2013-10-29 General Mems Corporation Silicon microphone package
US7825509B1 (en) 2009-06-13 2010-11-02 Mwm Acoustics, Llc Transducer package with transducer die unsupported by a substrate
CN101651913A (en) * 2009-06-19 2010-02-17 瑞声声学科技(深圳)有限公司 microphone
US9327316B2 (en) * 2009-06-30 2016-05-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-frequency acoustic array
US8314354B2 (en) 2009-07-27 2012-11-20 Apple Inc. Accessory controller for electronic devices
US8739626B2 (en) * 2009-08-04 2014-06-03 Fairchild Semiconductor Corporation Micromachined inertial sensor devices
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
CN101765047A (en) * 2009-09-28 2010-06-30 瑞声声学科技(深圳)有限公司 Capacitance microphone and manufacturing method thereof
US20110103632A1 (en) * 2009-10-30 2011-05-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Integrated acoustic horn and lead frame
JP5406675B2 (en) * 2009-11-09 2014-02-05 新日本無線株式会社 MEMS condenser microphone
US8421168B2 (en) * 2009-11-17 2013-04-16 Fairchild Semiconductor Corporation Microelectromechanical systems microphone packaging systems
US9344805B2 (en) * 2009-11-24 2016-05-17 Nxp B.V. Micro-electromechanical system microphone
JP2011114506A (en) * 2009-11-26 2011-06-09 Funai Electric Co Ltd Microphone unit
US8724339B2 (en) * 2009-12-01 2014-05-13 Apple Inc. Compact media player
TWI444052B (en) * 2009-12-17 2014-07-01 Ind Tech Res Inst Capacitive transducer and fabrication method
JP5434798B2 (en) * 2009-12-25 2014-03-05 船井電機株式会社 Microphone unit and voice input device including the same
US8577063B2 (en) * 2010-02-18 2013-11-05 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US20120314390A1 (en) * 2010-03-03 2012-12-13 Mutual-Tek Industries Co., Ltd. Multilayer circuit board
US7972888B1 (en) 2010-03-11 2011-07-05 Memsensing Microsystems Technology Co., Ltd. Methods for manufacturing MEMS sensor and thin film and cantilever beam thereof with epitaxial growth process
DE102010003724A1 (en) * 2010-04-08 2011-10-13 Robert Bosch Gmbh Pressure sensor assembly
DE102010018499A1 (en) * 2010-04-22 2011-10-27 Schweizer Electronic Ag PCB with cavity
US8551799B2 (en) 2010-05-06 2013-10-08 Stmicroelectronics S.R.L. Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
CA2704683A1 (en) * 2010-05-28 2010-08-12 Ibm Canada Limited - Ibm Canada Limitee Grounded lid for micro-electronic assemblies
JP5348073B2 (en) * 2010-06-01 2013-11-20 船井電機株式会社 Electroacoustic transducer mounting substrate, microphone unit, and manufacturing method thereof
JP4947191B2 (en) 2010-06-01 2012-06-06 オムロン株式会社 microphone
US8354747B1 (en) 2010-06-01 2013-01-15 Amkor Technology, Inc Conductive polymer lid for a sensor package and method therefor
KR101362398B1 (en) 2012-07-10 2014-02-13 앰코 테크놀로지 코리아 주식회사 Semiconductor package and manufacturing method thereof
JP5029727B2 (en) 2010-06-01 2012-09-19 オムロン株式会社 Semiconductor device and microphone
US7998776B1 (en) 2010-06-10 2011-08-16 Memsensing Microsystems Technology Co., Ltd. Methods for manufacturing MEMS sensor and thin film thereof with improved etching process
DE102010030457B4 (en) 2010-06-24 2019-09-05 Robert Bosch Gmbh A method for the production of packaged micromechanical devices and corresponding housed micromechanical device
US9420378B1 (en) * 2010-07-12 2016-08-16 Amkor Technology, Inc. Top port MEMS microphone package and method
US9258634B2 (en) 2010-07-30 2016-02-09 Invensense, Inc. Microphone system with offset apertures
DE102010035168A1 (en) 2010-08-23 2012-02-23 Günter Kowalski Sensor for microelectromechanical system capacitor microphone used in e.g. medical field, has sound passage openings arranged anisotropically on counter electrode such that reduction of lateral forces on counter electrode is achieved
DE102010040370B4 (en) * 2010-09-08 2016-10-06 Robert Bosch Gmbh MEMS microphone package
KR101904178B1 (en) 2010-09-18 2018-10-04 페어차일드 세미컨덕터 코포레이션 Micromachined monolithic 3-axis gyroscope with single drive
CN103221333B (en) 2010-09-18 2017-05-31 快捷半导体公司 Multi-die MEMS package
KR20130052652A (en) 2010-09-18 2013-05-22 페어차일드 세미컨덕터 코포레이션 Sealed packaging for microelectromechanical systems
DE112011103124B4 (en) 2010-09-18 2025-10-30 Fairchild Semiconductor Corporation Bending bearings for reducing quadrature in oscillating micromechanical devices
EP2616771B8 (en) 2010-09-18 2018-12-19 Fairchild Semiconductor Corporation Micromachined monolithic 6-axis inertial sensor
US9278845B2 (en) 2010-09-18 2016-03-08 Fairchild Semiconductor Corporation MEMS multi-axis gyroscope Z-axis electrode structure
KR101311966B1 (en) 2010-09-20 2013-10-14 페어차일드 세미컨덕터 코포레이션 Through silicon via with reduced shunt capacitance
EP2619536B1 (en) 2010-09-20 2016-11-02 Fairchild Semiconductor Corporation Microelectromechanical pressure sensor including reference capacitor
WO2012051340A1 (en) * 2010-10-12 2012-04-19 Analog Devices, Inc. Microphone package with embedded asic
DE102011002460A1 (en) 2011-01-05 2012-07-05 Robert Bosch Gmbh Microphone has housing comprising cover that is provided with aperture through which MEMS component is mounted inside housing, and external contact that is fed exclusively over housing cover
US9544678B2 (en) 2011-01-12 2017-01-10 Blackberry Limited Printed circuit board with an acoustic channel for a microphone
US8618619B1 (en) 2011-01-28 2013-12-31 Amkor Technology, Inc. Top port with interposer MEMS microphone package and method
DE102011004577B4 (en) * 2011-02-23 2023-07-27 Robert Bosch Gmbh Component carrier, method for producing such a component carrier and component with a MEMS component on such a component carrier
US8921955B1 (en) 2011-02-24 2014-12-30 Amkor Technology, Inc. Semiconductor device with micro electromechanical system die
CN103416075B (en) 2011-03-07 2017-07-04 声奇股份公司 Audio frequency apparatus
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US8625832B2 (en) 2011-04-04 2014-01-07 Invensense, Inc. Packages and methods for packaging microphone devices
TWI484835B (en) * 2011-04-12 2015-05-11 Pixart Imaging Inc Mems microphone device and method for making same
US8781140B2 (en) * 2011-04-15 2014-07-15 Knowles Electronics, Llc Compact, highly integrated microphone assembly
DE102011007604A1 (en) 2011-04-18 2012-10-18 Robert Bosch Gmbh Microelectromechanical sound detection device and method for producing such
US8476087B2 (en) 2011-04-21 2013-07-02 Freescale Semiconductor, Inc. Methods for fabricating sensor device package using a sealing structure
US8384168B2 (en) * 2011-04-21 2013-02-26 Freescale Semiconductor, Inc. Sensor device with sealing structure
US8536663B1 (en) 2011-04-28 2013-09-17 Amkor Technology, Inc. Metal mesh lid MEMS package and method
US9174412B2 (en) 2011-05-16 2015-11-03 Brigham Young University High strength carbon fiber composite wafers for microfabrication
ITTO20110577A1 (en) 2011-06-30 2012-12-31 Stmicroelectronics Malta Ltd ENCAPSULATION FOR A MEMS SENSOR AND ITS MANUFACTURING PROCEDURE
JP5668627B2 (en) * 2011-07-19 2015-02-12 株式会社村田製作所 Circuit module
EP2566189B1 (en) * 2011-08-30 2014-03-05 Harman International Industries Ltd. Loudspeaker arrangement
JP5327299B2 (en) * 2011-09-09 2013-10-30 オムロン株式会社 Semiconductor device and microphone
HK1199261A1 (en) 2011-09-26 2015-06-26 Galera Labs, Llc Methods for treatment of diseases
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
US20130177192A1 (en) * 2011-10-25 2013-07-11 Knowles Electronics, Llc Vented Microphone Module
PH12014500968A1 (en) 2011-11-04 2014-06-09 Knowles Electronics Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
WO2013074270A1 (en) 2011-11-17 2013-05-23 Analog Devices, Inc. Microphone module with sound pipe
DE102011086722A1 (en) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Micromechanical functional device, in particular speaker device, and corresponding manufacturing method
TWI504279B (en) 2011-12-01 2015-10-11 財團法人工業技術研究院 MEMS acoustic wave sensor and manufacturing method thereof
DE102011088256A1 (en) * 2011-12-12 2013-06-13 Zf Friedrichshafen Ag Multilayer printed circuit board and arrangement with such
US9153543B1 (en) 2012-01-23 2015-10-06 Amkor Technology, Inc. Shielding technique for semiconductor package including metal lid and metalized contact area
US9362209B1 (en) 2012-01-23 2016-06-07 Amkor Technology, Inc. Shielding technique for semiconductor package including metal lid
US9062972B2 (en) 2012-01-31 2015-06-23 Fairchild Semiconductor Corporation MEMS multi-axis accelerometer electrode structure
US8978475B2 (en) 2012-02-01 2015-03-17 Fairchild Semiconductor Corporation MEMS proof mass with split z-axis portions
US8983097B2 (en) 2012-02-29 2015-03-17 Infineon Technologies Ag Adjustable ventilation openings in MEMS structures
US9002037B2 (en) 2012-02-29 2015-04-07 Infineon Technologies Ag MEMS structure with adjustable ventilation openings
TWI448163B (en) * 2012-03-05 2014-08-01 Merry Electronics Co Ltd Electret condenser microphone
WO2013134511A2 (en) * 2012-03-07 2013-09-12 Deka Products Limited Partnership Volumetric measurement device, system and method
US8779535B2 (en) 2012-03-14 2014-07-15 Analog Devices, Inc. Packaged integrated device die between an external and internal housing
EP2830989B1 (en) 2012-03-29 2016-01-06 Robert Bosch GmbH Cavity package design
US8754694B2 (en) 2012-04-03 2014-06-17 Fairchild Semiconductor Corporation Accurate ninety-degree phase shifter
US9488693B2 (en) 2012-04-04 2016-11-08 Fairchild Semiconductor Corporation Self test of MEMS accelerometer with ASICS integrated capacitors
US8742964B2 (en) 2012-04-04 2014-06-03 Fairchild Semiconductor Corporation Noise reduction method with chopping for a merged MEMS accelerometer sensor
EP2647955B8 (en) 2012-04-05 2018-12-19 Fairchild Semiconductor Corporation MEMS device quadrature phase shift cancellation
EP2647952B1 (en) 2012-04-05 2017-11-15 Fairchild Semiconductor Corporation Mems device automatic-gain control loop for mechanical amplitude drive
KR102058489B1 (en) 2012-04-05 2019-12-23 페어차일드 세미컨덕터 코포레이션 Mems device front-end charge amplifier
US9069006B2 (en) 2012-04-05 2015-06-30 Fairchild Semiconductor Corporation Self test of MEMS gyroscope with ASICs integrated capacitors
US8890308B2 (en) 2012-04-06 2014-11-18 Freescale Semiconductor, Inc. Integrated circuit package and method of forming the same
US9625272B2 (en) 2012-04-12 2017-04-18 Fairchild Semiconductor Corporation MEMS quadrature cancellation and signal demodulation
US9094027B2 (en) 2012-04-12 2015-07-28 Fairchild Semiconductor Corporation Micro-electro-mechanical-system (MEMS) driver
US9061884B1 (en) 2012-04-24 2015-06-23 Amkor Technology, Inc. Integrated circuit with efficient MEMS architecture
US9046546B2 (en) 2012-04-27 2015-06-02 Freescale Semiconductor Inc. Sensor device and related fabrication methods
US9502206B2 (en) 2012-06-05 2016-11-22 Brigham Young University Corrosion-resistant, strong x-ray window
US20140127446A1 (en) * 2012-06-05 2014-05-08 Moxtek, Inc. Amorphous carbon and aluminum membrane
US9738515B2 (en) * 2012-06-27 2017-08-22 Invensense, Inc. Transducer with enlarged back volume
US9402118B2 (en) 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
US9491539B2 (en) 2012-08-01 2016-11-08 Knowles Electronics, Llc MEMS apparatus disposed on assembly lid
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102013014881B4 (en) 2012-09-12 2023-05-04 Fairchild Semiconductor Corporation Enhanced silicon via with multi-material fill
US8841738B2 (en) 2012-10-01 2014-09-23 Invensense, Inc. MEMS microphone system for harsh environments
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US9156680B2 (en) * 2012-10-26 2015-10-13 Analog Devices, Inc. Packages and methods for packaging
US9018715B2 (en) 2012-11-30 2015-04-28 Silicon Laboratories Inc. Gas-diffusion barriers for MEMS encapsulation
US9079760B2 (en) * 2012-12-17 2015-07-14 Invensense, Inc. Integrated microphone package
DE112013006080T5 (en) 2012-12-19 2015-08-27 Knowles Electronics, Llc Apparatus and method for high voltage I / O electrostatic discharge protection
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US8965027B2 (en) 2013-02-15 2015-02-24 Invensense, Inc. Packaged microphone with frame having die mounting concavity
US8999757B2 (en) 2013-03-04 2015-04-07 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US9082883B2 (en) 2013-03-04 2015-07-14 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US9809448B2 (en) 2013-03-13 2017-11-07 Invensense, Inc. Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same
US8692340B1 (en) 2013-03-13 2014-04-08 Invensense, Inc. MEMS acoustic sensor with integrated back cavity
US9467785B2 (en) * 2013-03-28 2016-10-11 Knowles Electronics, Llc MEMS apparatus with increased back volume
US9301075B2 (en) 2013-04-24 2016-03-29 Knowles Electronics, Llc MEMS microphone with out-gassing openings and method of manufacturing the same
US8928137B2 (en) * 2013-05-15 2015-01-06 Kamstrup A/S Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board
DE102013106353B4 (en) * 2013-06-18 2018-06-28 Tdk Corporation Method for applying a structured coating to a component
US9024396B2 (en) 2013-07-12 2015-05-05 Infineon Technologies Ag Device with MEMS structure and ventilation path in support structure
US9296607B2 (en) 2013-07-22 2016-03-29 Invensense, Inc. Apparatus and method for reduced strain on MEMS devices
US20150090030A1 (en) * 2013-09-27 2015-04-02 Infineon Technologies Ag Transducer arrangement comprising a transducer die and method of covering a transducer die
CN104517944A (en) * 2013-09-30 2015-04-15 日月光半导体制造股份有限公司 Package structure and manufacturing method thereof
US9299671B2 (en) 2013-10-15 2016-03-29 Invensense, Inc. Integrated CMOS back cavity acoustic transducer and the method of producing the same
US9847462B2 (en) 2013-10-29 2017-12-19 Point Engineering Co., Ltd. Array substrate for mounting chip and method for manufacturing the same
KR101469606B1 (en) * 2013-11-13 2014-12-05 (주)파트론 Manufacturing method of microphone package
DE102013223359A1 (en) * 2013-11-15 2015-05-21 Robert Bosch Gmbh Printed circuit board for the 2nd level mounting of a microphone component and microphone module with such a printed circuit board
CN103607688A (en) * 2013-11-19 2014-02-26 歌尔声学股份有限公司 MEMS microphone making method
KR20150058780A (en) 2013-11-21 2015-05-29 삼성전기주식회사 Microphone package and mounting structure thereof
US9307328B2 (en) 2014-01-09 2016-04-05 Knowles Electronics, Llc Interposer for MEMS-on-lid microphone
DE102014203881A1 (en) 2014-03-04 2015-09-10 Robert Bosch Gmbh Component with microphone and media sensor function
JP6311376B2 (en) 2014-03-14 2018-04-18 オムロン株式会社 microphone
DE102014105754B4 (en) 2014-04-24 2022-02-10 USound GmbH Loudspeaker arrangement with circuit board integrated ASIC
WO2015174158A1 (en) * 2014-05-15 2015-11-19 富士電機株式会社 Power semiconductor module and composite module
DE102014211197B4 (en) 2014-06-12 2019-09-12 Robert Bosch Gmbh Micromechanical combination sensor arrangement
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US9554214B2 (en) 2014-10-02 2017-01-24 Knowles Electronics, Llc Signal processing platform in an acoustic capture device
EP3018092A1 (en) 2014-11-10 2016-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft MEMS package
US20160150327A1 (en) * 2014-11-25 2016-05-26 Knowles Electronics, Llc Photosensitive Microphone
TWI539831B (en) 2014-12-05 2016-06-21 財團法人工業技術研究院 MEMS microphone package
US10429509B2 (en) 2014-12-24 2019-10-01 Stmicroelectronics Pte Ltd. Molded proximity sensor
US9800971B2 (en) 2015-03-17 2017-10-24 Knowles Electronics, Llc Acoustic apparatus with side port
DE102015107557A1 (en) * 2015-05-13 2016-11-17 USound GmbH Circuit board module with a continuous recess and related sound transducer arrangement and manufacturing method
US10291973B2 (en) * 2015-05-14 2019-05-14 Knowles Electronics, Llc Sensor device with ingress protection
EP3101441B1 (en) * 2015-06-03 2018-05-16 Pepperl + Fuchs GmbH Ultrasound converter
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
PT3334744T (en) 2015-08-11 2020-07-28 Galera Labs Llc MACROCYCLIC PENTA-AZA RING COMPLEXES THAT HAVE ORAL BIOAVAILABILITY
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
US9793237B2 (en) 2015-10-19 2017-10-17 Qorvo Us, Inc. Hollow-cavity flip-chip package with reinforced interconnects and process for making the same
US9799637B2 (en) * 2016-02-12 2017-10-24 Qorvo Us, Inc. Semiconductor package with lid having lid conductive structure
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
IL300085A (en) 2016-05-03 2023-03-01 Galera Labs Llc Combined treatment for cancer
WO2018045348A2 (en) 2016-09-01 2018-03-08 Galera Labs, Llc Combination cancer therapy with pentaaza macrocyclic ring complex and ascorbate compound
US10943577B2 (en) 2017-01-03 2021-03-09 Michigan Technological University Solid-state transducer, system, and method
US10667701B1 (en) * 2017-02-03 2020-06-02 University Of South Florida Systems and methods for determining physiological parameters from blood flow dynamics
US9932221B1 (en) 2017-03-02 2018-04-03 Amkor Technology, Inc. Semiconductor package with multiple compartments
US10497650B2 (en) 2017-04-13 2019-12-03 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
EP3625554A1 (en) 2017-05-15 2020-03-25 Analog Devices Global Unlimited Company Integrated ion sensing apparatus and methods
EP3456682B1 (en) * 2017-09-15 2023-09-13 TE Connectivity Solutions GmbH Sensor system, sensor arrangement, and assembly method using solder for sealing
JP6939429B2 (en) * 2017-11-02 2021-09-22 株式会社デンソー Ultrasonic sensor
US10730743B2 (en) 2017-11-06 2020-08-04 Analog Devices Global Unlimited Company Gas sensor packages
KR102409521B1 (en) * 2017-12-13 2022-06-15 현대자동차주식회사 Mems microphone
DE102018203098B3 (en) * 2018-03-01 2019-06-19 Infineon Technologies Ag MEMS sensor
WO2019190559A1 (en) * 2018-03-30 2019-10-03 Hewlett-Packard Development Company, L.P. Microphone units with multiple openings
CN108882663B (en) * 2018-07-16 2020-04-21 Oppo广东移动通信有限公司 Electronic equipment
US11533573B2 (en) * 2018-12-31 2022-12-20 Knowles Electronics, Llc Receiver housing with integrated sensors for hearing device
DE102019201228B4 (en) * 2019-01-31 2023-10-05 Robert Bosch Gmbh Method for producing a plurality of sensor devices and sensor device
US10871407B2 (en) * 2019-04-25 2020-12-22 Measurement Specialties, Inc. Sensor assemblies with multirange construction
US11245975B2 (en) * 2019-05-30 2022-02-08 Bose Corporation Techniques for wind noise reduction
WO2020258171A1 (en) * 2019-06-27 2020-12-30 瑞声声学科技(深圳)有限公司 Vibration sensor and audio device
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber
WO2021064871A1 (en) * 2019-10-01 2021-04-08 日産自動車株式会社 Electric component housing
US12474290B2 (en) 2019-11-20 2025-11-18 Analog Devices International Unlimited Company Electrochemical device
JP2021081348A (en) * 2019-11-21 2021-05-27 Tdk株式会社 Sensor module
CN213694049U (en) * 2019-12-10 2021-07-13 楼氏电子(苏州)有限公司 Microphone assembly and microphone assembly substrate
CN213818100U (en) 2019-12-30 2021-07-27 楼氏电子(苏州)有限公司 Microphone assembly
CN113132838B (en) 2019-12-30 2025-01-28 美商楼氏电子有限公司 Helmholtz resonator for microphone assembly
CN213547840U (en) 2019-12-30 2021-06-25 美商楼氏电子有限公司 Sound port adapter for microphone assembly
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
US11706561B1 (en) 2021-12-23 2023-07-18 Knowles Electronics, Llc Balanced armature receiver with liquid-resistant pressure relief vent

Family Cites Families (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4958335U (en) * 1972-08-30 1974-05-23
US4127840A (en) 1977-02-22 1978-11-28 Conrac Corporation Solid state force transducer
JPS5524423A (en) * 1978-08-10 1980-02-21 Nissan Motor Co Ltd Semiconductor pressure sensor
US4454440A (en) * 1978-12-22 1984-06-12 United Technologies Corporation Surface acoustic wave (SAW) pressure sensor structure
JPS55112864U (en) 1979-02-02 1980-08-08
US4277814A (en) * 1979-09-04 1981-07-07 Ford Motor Company Semiconductor variable capacitance pressure transducer assembly
JPS5640268A (en) * 1979-09-11 1981-04-16 Mitsubishi Electric Corp Semiconductor device
CA1165859A (en) 1981-10-19 1984-04-17 Guy J. Chaput Electret microphone shield
US4533795A (en) 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
JPS60111129A (en) 1983-11-21 1985-06-17 Yokogawa Hokushin Electric Corp Pressure sensor
JPS62173814A (en) * 1986-01-28 1987-07-30 Alps Electric Co Ltd Mounting unit for surface acoustic wave element
JPH0726887B2 (en) 1986-05-31 1995-03-29 株式会社堀場製作所 Condenser Microphone type detector diaphragm
NL8702589A (en) 1987-10-30 1989-05-16 Microtel Bv ELECTRO-ACOUSTIC TRANSDUCENT OF THE KIND OF ELECTRET, AND A METHOD FOR MANUFACTURING SUCH TRANSDUCER.
US5293781A (en) 1987-11-09 1994-03-15 California Institute Of Technology Tunnel effect measuring systems and particle detectors
US4825335A (en) 1988-03-14 1989-04-25 Endevco Corporation Differential capacitive transducer and method of making
US4993072A (en) * 1989-02-24 1991-02-12 Lectret S.A. Shielded electret transducer and method of making the same
US5146435A (en) 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
DE4000903C1 (en) 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
US5101543A (en) 1990-07-02 1992-04-07 Gentex Corporation Method of making a variable capacitor microphone
JPH0465643A (en) 1990-07-05 1992-03-02 Mitsubishi Electric Corp Semiconductor pressure sensor and its manufacture
JP2925722B2 (en) * 1990-11-30 1999-07-28 三井化学株式会社 Hermetic seal type electric circuit device
US5189777A (en) 1990-12-07 1993-03-02 Wisconsin Alumni Research Foundation Method of producing micromachined differential pressure transducers
JP2579188Y2 (en) * 1991-06-28 1998-08-20 株式会社オーディオテクニカ Condenser microphone unit
US5178015A (en) * 1991-07-22 1993-01-12 Monolithic Sensors Inc. Silicon-on-silicon differential input sensors
US5257547A (en) 1991-11-26 1993-11-02 Honeywell Inc. Amplified pressure transducer
US5490220A (en) 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
FR2697675B1 (en) 1992-11-05 1995-01-06 Suisse Electronique Microtech Method for manufacturing integrated capacitive transducers.
US5531787A (en) 1993-01-25 1996-07-02 Lesinski; S. George Implantable auditory system with micromachined microsensor and microactuator
US5475606A (en) 1993-03-05 1995-12-12 International Business Machines Corporation Faraday cage for a printed circuit card
US5477008A (en) 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
JP3342748B2 (en) * 1993-09-06 2002-11-11 富士通株式会社 Acceleration sensor
JPH07111254A (en) 1993-10-12 1995-04-25 Sumitomo Electric Ind Ltd Method for manufacturing semiconductor device
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5452268A (en) 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US5545912A (en) * 1994-10-27 1996-08-13 Motorola, Inc. Electronic device enclosure including a conductive cap and substrate
JP3171043B2 (en) 1995-01-11 2001-05-28 株式会社村田製作所 Surface acoustic wave device
US5506919A (en) 1995-03-27 1996-04-09 Eastman Kodak Company Conductive membrane optical modulator
US5659195A (en) * 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
JPH098163A (en) * 1995-06-22 1997-01-10 Nippon Avionics Co Ltd Semiconductor hermetically sealed package
JPH09107192A (en) 1995-10-09 1997-04-22 Kitagawa Ind Co Ltd Printed board and printed board serving also as case and portable communication appliance
CN1094717C (en) 1995-11-16 2002-11-20 松下电器产业株式会社 PC board and fixing body thereof
US5748758A (en) 1996-01-25 1998-05-05 Menasco, Jr.; Lawrence C. Acoustic audio transducer with aerogel diaphragm
JPH09222372A (en) * 1996-02-19 1997-08-26 Mitsubishi Electric Corp Semiconductor type sensor
US5888845A (en) 1996-05-02 1999-03-30 National Semiconductor Corporation Method of making high sensitivity micro-machined pressure sensors and acoustic transducers
JPH09318650A (en) * 1996-05-27 1997-12-12 Matsushita Electric Works Ltd Sensor device and its manufacture
US5939968A (en) 1996-06-19 1999-08-17 Littelfuse, Inc. Electrical apparatus for overcurrent protection of electrical circuits
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5740261A (en) 1996-11-21 1998-04-14 Knowles Electronics, Inc. Miniature silicon condenser microphone
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US5923995A (en) 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems
US5831262A (en) 1997-06-27 1998-11-03 Lucent Technologies Inc. Article comprising an optical fiber attached to a micromechanical device
TW387198B (en) * 1997-09-03 2000-04-11 Hosiden Corp Audio sensor and its manufacturing method, and semiconductor electret capacitance microphone using the same
JPH1188992A (en) * 1997-09-03 1999-03-30 Hosiden Corp Integrated capacitive transducer and its manufacture
US6282072B1 (en) 1998-02-24 2001-08-28 Littelfuse, Inc. Electrical devices having a polymer PTC array
JP3516011B2 (en) * 1998-03-13 2004-04-05 オムロン株式会社 Capacitive pressure sensor and packaging structure
FI105880B (en) * 1998-06-18 2000-10-13 Nokia Mobile Phones Ltd Fastening of a micromechanical microphone
US6108184A (en) 1998-11-13 2000-08-22 Littlefuse, Inc. Surface mountable electrical device comprising a voltage variable material
JP3472493B2 (en) 1998-11-30 2003-12-02 ホシデン株式会社 Semiconductor electret condenser microphone
US6078245A (en) 1998-12-17 2000-06-20 Littelfuse, Inc. Containment of tin diffusion bar
JP3377957B2 (en) * 1998-12-25 2003-02-17 京セラ株式会社 Electret condenser microphone
US7003127B1 (en) 1999-01-07 2006-02-21 Sarnoff Corporation Hearing aid with large diaphragm microphone element including a printed circuit board
JP3378207B2 (en) * 1999-02-05 2003-02-17 京セラ株式会社 Semiconductor electret condenser microphone and case used therein
JP3987228B2 (en) * 1999-03-10 2007-10-03 松下電器産業株式会社 Electret condenser microphone
JP2000277970A (en) 1999-03-24 2000-10-06 Matsushita Electric Ind Co Ltd Magnetic shielding device and portable information device having the same
JP3571575B2 (en) 1999-04-30 2004-09-29 シャープ株式会社 Mobile phone
US6136419A (en) 1999-05-26 2000-10-24 International Business Machines Corporation Ceramic substrate having a sealed layer
JP2001054196A (en) * 1999-08-11 2001-02-23 Kyocera Corp Electret condenser microphone
CA2315417A1 (en) * 1999-08-11 2001-02-11 Hiroshi Une Electret capacitor microphone
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
PL354000A1 (en) 1999-09-06 2003-12-15 Sonionmems A/Ssonionmems A/S A pressure transducer
US6656768B2 (en) 2001-02-08 2003-12-02 Texas Instruments Incorporated Flip-chip assembly of protected micromechanical devices
US6535460B2 (en) 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
ATE321429T1 (en) 2000-08-11 2006-04-15 Knowles Electronics Llc BROADBAND MINIATURE CONVERTER
US6439869B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
AU2002365352A1 (en) 2001-11-27 2003-06-10 Corporation For National Research Initiatives A miniature condenser microphone and fabrication method therefor
US6621392B1 (en) 2002-04-25 2003-09-16 International Business Machines Corporation Micro electromechanical switch having self-aligned spacers
US6850133B2 (en) 2002-08-14 2005-02-01 Intel Corporation Electrode configuration in a MEMS switch
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
US7501703B2 (en) 2003-02-28 2009-03-10 Knowles Electronics, Llc Acoustic transducer module
US7233679B2 (en) * 2003-09-30 2007-06-19 Motorola, Inc. Microphone system for a communication device
US7929714B2 (en) 2004-08-11 2011-04-19 Qualcomm Incorporated Integrated audio codec with silicon audio transducer
DE102004058879B4 (en) 2004-12-06 2013-11-07 Austriamicrosystems Ag MEMS microphone and method of manufacture

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JP5216717B2 (en) 2013-06-19
WO2002045463A3 (en) 2003-05-15
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US20050185812A1 (en) 2005-08-25
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EP1346601A2 (en) 2003-09-24
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US7242089B2 (en) 2007-07-10
JP2004537182A (en) 2004-12-09
EP2249583A3 (en) 2014-12-10
US20070082421A1 (en) 2007-04-12

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