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AU2002225758A1 - Semiconductor device having a ball grid array and method therefor - Google Patents

Semiconductor device having a ball grid array and method therefor

Info

Publication number
AU2002225758A1
AU2002225758A1 AU2002225758A AU2575802A AU2002225758A1 AU 2002225758 A1 AU2002225758 A1 AU 2002225758A1 AU 2002225758 A AU2002225758 A AU 2002225758A AU 2575802 A AU2575802 A AU 2575802A AU 2002225758 A1 AU2002225758 A1 AU 2002225758A1
Authority
AU
Australia
Prior art keywords
semiconductor device
grid array
method therefor
ball grid
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002225758A
Inventor
Terry E. Burnette
Thomas H. Koschmieder
Andrew J. Mawer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2002225758A1 publication Critical patent/AU2002225758A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H10W42/00—
    • H10W70/65—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
AU2002225758A 2000-12-08 2001-11-19 Semiconductor device having a ball grid array and method therefor Abandoned AU2002225758A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/733,170 2000-12-08
US09/733,170 US6552436B2 (en) 2000-12-08 2000-12-08 Semiconductor device having a ball grid array and method therefor
PCT/US2001/044345 WO2002047163A2 (en) 2000-12-08 2001-11-19 Semiconductor device having a ball grid array and method therefor

Publications (1)

Publication Number Publication Date
AU2002225758A1 true AU2002225758A1 (en) 2002-06-18

Family

ID=24946518

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002225758A Abandoned AU2002225758A1 (en) 2000-12-08 2001-11-19 Semiconductor device having a ball grid array and method therefor

Country Status (4)

Country Link
US (2) US6552436B2 (en)
AU (1) AU2002225758A1 (en)
TW (1) TW563230B (en)
WO (1) WO2002047163A2 (en)

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US7098408B1 (en) * 2003-10-14 2006-08-29 Cisco Technology, Inc. Techniques for mounting an area array package to a circuit board using an improved pad layout
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US9029196B2 (en) 2003-11-10 2015-05-12 Stats Chippac, Ltd. Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
US8129841B2 (en) * 2006-12-14 2012-03-06 Stats Chippac, Ltd. Solder joint flip chip interconnection
US8026128B2 (en) 2004-11-10 2011-09-27 Stats Chippac, Ltd. Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
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US7906424B2 (en) * 2007-08-01 2011-03-15 Advanced Micro Devices, Inc. Conductor bump method and apparatus
US8314474B2 (en) * 2008-07-25 2012-11-20 Ati Technologies Ulc Under bump metallization for on-die capacitor
TW201011878A (en) * 2008-09-03 2010-03-16 Phoenix Prec Technology Corp Package structure having substrate and fabrication thereof
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US20140231993A1 (en) * 2013-02-21 2014-08-21 Marvell World Trade Ltd. Package-on-package structures
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US9437490B2 (en) 2013-11-18 2016-09-06 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
US9831205B2 (en) * 2013-11-18 2017-11-28 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
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Also Published As

Publication number Publication date
WO2002047163A2 (en) 2002-06-13
US20030102535A1 (en) 2003-06-05
TW563230B (en) 2003-11-21
WO2002047163A3 (en) 2003-07-24
US20020070451A1 (en) 2002-06-13
US6552436B2 (en) 2003-04-22

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