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WO2004038795A3 - Thermal-conductive substrate package - Google Patents

Thermal-conductive substrate package Download PDF

Info

Publication number
WO2004038795A3
WO2004038795A3 PCT/IB2003/004370 IB0304370W WO2004038795A3 WO 2004038795 A3 WO2004038795 A3 WO 2004038795A3 IB 0304370 W IB0304370 W IB 0304370W WO 2004038795 A3 WO2004038795 A3 WO 2004038795A3
Authority
WO
WIPO (PCT)
Prior art keywords
mesh
conductive
thermally
thermal
conductive substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2003/004370
Other languages
French (fr)
Other versions
WO2004038795A2 (en
Inventor
Chris Wyland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
US Philips Corp
Original Assignee
Koninklijke Philips Electronics NV
US Philips Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, US Philips Corp filed Critical Koninklijke Philips Electronics NV
Priority to JP2004546238A priority Critical patent/JP4987231B2/en
Priority to EP03748414A priority patent/EP1556897A2/en
Priority to AU2003267719A priority patent/AU2003267719A1/en
Publication of WO2004038795A2 publication Critical patent/WO2004038795A2/en
Publication of WO2004038795A3 publication Critical patent/WO2004038795A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W70/685—
    • H10W40/25—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/251—
    • H10W40/257—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H10W40/778—
    • H10W72/075—
    • H10W72/551—
    • H10W72/884—
    • H10W72/951—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A substrate material (130) for mounting an integrated circuit (100) contains a non-electrically-conductive mesh (135) of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces (155) that are proximate to the substrate, thereby using the circuit traces (155) as thermally-coupled heat sinks. In a preferred embodiment, the thermally-conductive mesh (135) replaces the structural fiberglass mesh that is conventionally used in substrates, thereby allowing the mesh (135) to serve a dual structural and thermal function.
PCT/IB2003/004370 2002-10-24 2003-10-04 Thermal-conductive substrate package Ceased WO2004038795A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004546238A JP4987231B2 (en) 2002-10-24 2003-10-04 Thermally conductive substrate package
EP03748414A EP1556897A2 (en) 2002-10-24 2003-10-04 Thermal-conductive substrate package
AU2003267719A AU2003267719A1 (en) 2002-10-24 2003-10-04 Thermal-conductive substrate package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/279,703 2002-10-24
US10/279,703 US6778398B2 (en) 2002-10-24 2002-10-24 Thermal-conductive substrate package

Publications (2)

Publication Number Publication Date
WO2004038795A2 WO2004038795A2 (en) 2004-05-06
WO2004038795A3 true WO2004038795A3 (en) 2004-07-22

Family

ID=32106785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2003/004370 Ceased WO2004038795A2 (en) 2002-10-24 2003-10-04 Thermal-conductive substrate package

Country Status (8)

Country Link
US (1) US6778398B2 (en)
EP (1) EP1556897A2 (en)
JP (1) JP4987231B2 (en)
KR (1) KR101008772B1 (en)
CN (1) CN100423242C (en)
AU (1) AU2003267719A1 (en)
TW (1) TWI319222B (en)
WO (1) WO2004038795A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004835A (en) * 1997-04-25 1999-12-21 Micron Technology, Inc. Method of forming integrated circuitry, conductive lines, a conductive grid, a conductive network, an electrical interconnection to anode location and an electrical interconnection with a transistor source/drain region
TWI290612B (en) * 2003-11-27 2007-12-01 Lg Cable Ltd Flat plate heat transfer device
KR100581115B1 (en) * 2003-12-16 2006-05-16 엘에스전선 주식회사 Plate heat transfer device and manufacturing method thereof
US7549460B2 (en) * 2004-04-02 2009-06-23 Adaptivenergy, Llc Thermal transfer devices with fluid-porous thermally conductive core
US20050224212A1 (en) * 2004-04-02 2005-10-13 Par Technologies, Llc Diffusion bonded wire mesh heat sink
US8319313B1 (en) 2004-10-26 2012-11-27 Marvell Israel (M.I.S.L) Ltd. Circuits, systems, and methods for reducing effects of cross talk in I/O lines and wire bonds
JP4450751B2 (en) * 2005-03-17 2010-04-14 富士通株式会社 Mesh model creation method, simulation apparatus, and program
US7456655B1 (en) 2005-05-16 2008-11-25 Marvell Israel (Misl) Ltd. System and process for overcoming wire-bond originated cross-talk
US7903417B2 (en) 2006-10-10 2011-03-08 Deere & Company Electrical circuit assembly for high-power electronics
US20080084671A1 (en) * 2006-10-10 2008-04-10 Ronnie Dean Stahlhut Electrical circuit assembly for high-power electronics
US8705237B2 (en) 2011-06-01 2014-04-22 Honeywell International Inc. Thermally conductive and electrically insulative card guide
KR102103375B1 (en) 2013-06-18 2020-04-22 삼성전자주식회사 A semiconductor package
EP3454918A1 (en) * 2016-05-13 2019-03-20 Smith & Nephew PLC Sensor enabled wound monitoring and therapy apparatus
TWI845964B (en) * 2016-11-11 2024-06-21 日商京瓷股份有限公司 Package for mounting light-emitting element, array package and electrical device
WO2019030384A2 (en) 2017-08-10 2019-02-14 Smith & Nephew Plc Positioning of sensors for sensor enabled wound monitoring or therapy

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6465895A (en) * 1987-09-07 1989-03-13 Hitachi Cable Mesh-shaped metal core substrate
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components
US5500555A (en) * 1994-04-11 1996-03-19 Lsi Logic Corporation Multi-layer semiconductor package substrate with thermally-conductive prepeg layer

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US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
SE437207B (en) * 1983-12-13 1985-02-11 Rolf Dahlberg SAMPLE CARD WITH BEARING STRAIGHT IN THE FORM OF THERMAL DERIVATIVE METAL PLATE
JPH046907Y2 (en) * 1986-01-29 1992-02-25
JP2965271B2 (en) * 1991-06-27 1999-10-18 昭和アルミニウム株式会社 Aluminum substrate for semiconductor
JPH05235567A (en) * 1992-02-24 1993-09-10 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2936033B2 (en) 1992-06-17 1999-08-23 キヤノン株式会社 Solar cell
US5309321A (en) 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
JPH0888450A (en) * 1994-09-16 1996-04-02 Toshiba Corp Circuit board
US5687062A (en) * 1996-02-20 1997-11-11 Heat Technology, Inc. High-thermal conductivity circuit board
US5929375A (en) * 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates
JPH104260A (en) * 1996-06-14 1998-01-06 Chichibu Onoda Cement Corp Method of manufacturing aluminum radiation substrate
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
JP3323074B2 (en) * 1996-08-28 2002-09-09 京セラ株式会社 Wiring board, package for housing semiconductor element and its mounting structure
US5960863A (en) 1998-01-07 1999-10-05 Hua; Hsu Mei Dissipating device for computer chips
JP3681542B2 (en) * 1998-07-01 2005-08-10 富士通株式会社 Printed circuit boards and relay boards for multistage bumps
JP2000100999A (en) * 1998-09-24 2000-04-07 Ngk Spark Plug Co Ltd Relay board
JP3031363B1 (en) * 1998-10-19 2000-04-10 住友金属工業株式会社 Metal base substrate, semiconductor device and method of manufacturing the same
IL128200A (en) * 1999-01-24 2003-11-23 Amitec Advanced Multilayer Int Chip carrier substrate
US6121680A (en) 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
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JP2001060747A (en) * 1999-08-23 2001-03-06 Sony Corp Manufacturing method of printed wiring board and interlayer sheet
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US6469381B1 (en) 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6465895A (en) * 1987-09-07 1989-03-13 Hitachi Cable Mesh-shaped metal core substrate
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components
US5500555A (en) * 1994-04-11 1996-03-19 Lsi Logic Corporation Multi-layer semiconductor package substrate with thermally-conductive prepeg layer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 280 (E - 779) 27 June 1989 (1989-06-27) *

Also Published As

Publication number Publication date
JP4987231B2 (en) 2012-07-25
CN1708848A (en) 2005-12-14
CN100423242C (en) 2008-10-01
TW200423345A (en) 2004-11-01
JP2006515712A (en) 2006-06-01
EP1556897A2 (en) 2005-07-27
WO2004038795A2 (en) 2004-05-06
KR20050073571A (en) 2005-07-14
AU2003267719A1 (en) 2004-05-13
US20040080915A1 (en) 2004-04-29
US6778398B2 (en) 2004-08-17
KR101008772B1 (en) 2011-01-14
TWI319222B (en) 2010-01-01

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