[go: up one dir, main page]

AU2002213295A1 - Electronic module having canopy-type carriers - Google Patents

Electronic module having canopy-type carriers

Info

Publication number
AU2002213295A1
AU2002213295A1 AU2002213295A AU1329502A AU2002213295A1 AU 2002213295 A1 AU2002213295 A1 AU 2002213295A1 AU 2002213295 A AU2002213295 A AU 2002213295A AU 1329502 A AU1329502 A AU 1329502A AU 2002213295 A1 AU2002213295 A1 AU 2002213295A1
Authority
AU
Australia
Prior art keywords
package
circuit board
carrier
main circuit
planar surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002213295A
Other languages
English (en)
Inventor
Jason C. Engle
Kenneth J. Kledizk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Legacy Electronics Inc
Original Assignee
Legacy Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Legacy Electronics Inc filed Critical Legacy Electronics Inc
Publication of AU2002213295A1 publication Critical patent/AU2002213295A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H10W70/40—
    • H10W70/60—
    • H10W90/20—
    • H10W90/288—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Casings For Electric Apparatus (AREA)
  • Credit Cards Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AU2002213295A 2000-10-16 2001-10-16 Electronic module having canopy-type carriers Abandoned AU2002213295A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/688,499 US6545868B1 (en) 2000-03-13 2000-10-16 Electronic module having canopy-type carriers
US09/688,499 2000-10-16
PCT/US2001/032330 WO2002033752A2 (fr) 2000-10-16 2001-10-16 Module electronique presentant des supports de type element de recouvrement

Publications (1)

Publication Number Publication Date
AU2002213295A1 true AU2002213295A1 (en) 2002-04-29

Family

ID=24764663

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002213295A Abandoned AU2002213295A1 (en) 2000-10-16 2001-10-16 Electronic module having canopy-type carriers

Country Status (9)

Country Link
US (2) US6545868B1 (fr)
EP (1) EP1327265B1 (fr)
JP (2) JP2004523882A (fr)
KR (1) KR100628286B1 (fr)
CN (1) CN1685508B (fr)
AT (1) ATE427561T1 (fr)
AU (1) AU2002213295A1 (fr)
DE (1) DE60138205D1 (fr)
WO (1) WO2002033752A2 (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6545868B1 (en) * 2000-03-13 2003-04-08 Legacy Electronics, Inc. Electronic module having canopy-type carriers
US6713854B1 (en) * 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7103970B2 (en) * 2001-03-14 2006-09-12 Legacy Electronics, Inc. Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US6944292B2 (en) * 2001-03-22 2005-09-13 Adc Telecommunications, Inc. Insulation strip for a pots splitter card
JP2004222486A (ja) * 2002-12-27 2004-08-05 Murata Mfg Co Ltd スイッチング電源モジュール
US6924437B1 (en) 2003-04-10 2005-08-02 Cisco Technology, Inc. Techniques for coupling an object to a circuit board using a surface mount coupling device
US7180165B2 (en) 2003-09-05 2007-02-20 Sanmina, Sci Corporation Stackable electronic assembly
TWI237889B (en) * 2004-01-16 2005-08-11 Optimum Care Int Tech Inc Chip leadframe module
TWM256012U (en) * 2004-03-04 2005-01-21 Carry Computer Eng Co Ltd USB connector with card detector
DE102004012979B4 (de) * 2004-03-16 2009-05-20 Infineon Technologies Ag Kopplungssubstrat für Halbleiterbauteile, Anordnungen mit dem Kopplungssubstrat, Kopplungssubstratstreifen, Verfahren zur Herstellung dieser Gegenstände und Verfahren zur Herstellung eines Halbleitermoduls
US20060051912A1 (en) * 2004-09-09 2006-03-09 Ati Technologies Inc. Method and apparatus for a stacked die configuration
US7321493B2 (en) * 2004-12-01 2008-01-22 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7324344B2 (en) * 2004-12-01 2008-01-29 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
KR100688514B1 (ko) * 2005-01-05 2007-03-02 삼성전자주식회사 다른 종류의 ｍｃｐ를 탑재한 메모리 모듈
WO2006076381A2 (fr) * 2005-01-12 2006-07-20 Legacy Electronics, Inc. Carte de circuit radial, systeme et procedes
US7709943B2 (en) * 2005-02-14 2010-05-04 Daniel Michaels Stacked ball grid array package module utilizing one or more interposer layers
KR100725458B1 (ko) 2005-12-23 2007-06-07 삼성전자주식회사 온도 보상 셀프 리프레시 신호를 공유하는 멀티 칩 패키지
KR101012716B1 (ko) 2006-01-05 2011-02-09 아사히 가세이 일렉트로닉스 가부시끼가이샤 가속도 계측 장치
CN101266965B (zh) * 2007-03-15 2010-06-16 卓恩民 半导体封装体堆叠结构及其制法
EP2212983B1 (fr) 2007-10-15 2021-04-07 Ampt, Llc Systèmes pour énergie solaire hautement efficace
WO2009055474A1 (fr) * 2007-10-23 2009-04-30 And, Llc Systèmes d'alimentation à haute fiabilité et convertisseurs d'énergie solaire
US20110210611A1 (en) * 2008-10-10 2011-09-01 Ampt, Llc Novel Solar Power Circuits
SG175717A1 (en) 2009-04-17 2011-12-29 Ampt Llc Methods and apparatus for adaptive operation of solar power systems
WO2011049985A1 (fr) 2009-10-19 2011-04-28 Ampt, Llc Topologie novatrice de convertisseur de chaîne de panneau solaire
US9397497B2 (en) 2013-03-15 2016-07-19 Ampt, Llc High efficiency interleaved solar power supply system
CN106663673A (zh) * 2013-08-28 2017-05-10 坤佰康有限责任公司 半导体晶片和封装拼板式基台
CN108565251A (zh) * 2018-05-15 2018-09-21 华为技术有限公司 系统级封装模块及其封装方法、终端设备
CN115767885A (zh) * 2021-11-11 2023-03-07 台达电子工业股份有限公司 电子模块组装结构

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4398235A (en) * 1980-09-11 1983-08-09 General Motors Corporation Vertical integrated circuit package integration
US4632293A (en) * 1985-09-03 1986-12-30 Feinstein Dov Y Method of upgrading memory boards
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5652462A (en) * 1993-04-05 1997-07-29 Matsushita Electric Industrial Co., Ltd. Multilevel semiconductor integrated circuit device
KR0147259B1 (ko) * 1994-10-27 1998-08-01 김광호 적층형 패키지 및 그 제조방법
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
JPH09214097A (ja) * 1996-02-06 1997-08-15 Toshiba Corp プリント回路基板
JPH1197619A (ja) * 1997-07-25 1999-04-09 Oki Electric Ind Co Ltd 半導体装置及びその製造方法と実装方法
KR100266693B1 (ko) * 1998-05-30 2000-09-15 김영환 적층가능한 비지에이 반도체 칩 패키지 및 그 제조방법
GB2364440B (en) * 1999-05-07 2004-05-26 Seagate Technology Llc Surface mount ic stacking method and device
US6545868B1 (en) * 2000-03-13 2003-04-08 Legacy Electronics, Inc. Electronic module having canopy-type carriers

Also Published As

Publication number Publication date
KR100628286B1 (ko) 2006-09-27
US6545868B1 (en) 2003-04-08
HK1057645A1 (en) 2004-04-08
DE60138205D1 (de) 2009-05-14
JP2004235606A (ja) 2004-08-19
EP1327265A2 (fr) 2003-07-16
KR20030071763A (ko) 2003-09-06
WO2002033752A2 (fr) 2002-04-25
EP1327265B1 (fr) 2009-04-01
ATE427561T1 (de) 2009-04-15
JP2004523882A (ja) 2004-08-05
CN1685508A (zh) 2005-10-19
US20030137808A1 (en) 2003-07-24
WO2002033752A3 (fr) 2003-03-13
CN1685508B (zh) 2010-06-16

Similar Documents

Publication Publication Date Title
AU2002213295A1 (en) Electronic module having canopy-type carriers
AU2001249169A1 (en) Electronic module having a three dimensional array of carrier-mounted integratedcircuit packages
WO2002034021A3 (fr) Module electronique a support
SE9604690D0 (sv) A Packaging structure fjor intergrated ciruits
US5869889A (en) Thin power tape ball grid array package
TW200611389A (en) Integrated circuit package device and method for manufacturing the same
US7608923B2 (en) Electronic device with flexible heat spreader
EP1427016A3 (fr) Dispositif semiconducteur et carte à circuit imprimé ainsi équipée
MY134479A (en) Method and apparatus for packaging integrated circuit devices
TW373280B (en) Multi-chip module with accessible test pads and test fixture
WO2005059995A3 (fr) Ameliorations apportees a des conditionnements electroniques
SE9702923D0 (sv) Power transistor module packaging structure
TW200514212A (en) Method and apparatus for packaging integrated circuit devices
WO2004015771A3 (fr) Dispositif a semi-conducteurs et son procede de fabrication
TW200507204A (en) Electrical package and process thereof
TW200511534A (en) Tape circuit substrate and semiconductor chip package using the same
TW200719776A (en) Circuit board with optical component embedded therein
US20010004135A1 (en) Flip-chip bonded semiconductor device
JP2611671B2 (ja) 半導体装置
TW200516732A (en) Semiconductor package
US20090161319A1 (en) Electronic Circuit Arrangement and Method for Producing an Electronic Circuit Arrangement
TW200601536A (en) Multilayer leadframe module with embedded passive components and method of producing the same
EP1515366A3 (fr) Technique d'arrangement de plots de contact sur des puces à circuit intégrés
SG66397A1 (en) Plastic pin grid array package
FR2837983B1 (fr) Circuit integre en hyperfrequences comprenant une pastille semiconductrice