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AU2002213011A1 - Method and apparatus for electrochemical planarization of a workpiece - Google Patents

Method and apparatus for electrochemical planarization of a workpiece

Info

Publication number
AU2002213011A1
AU2002213011A1 AU2002213011A AU1301102A AU2002213011A1 AU 2002213011 A1 AU2002213011 A1 AU 2002213011A1 AU 2002213011 A AU2002213011 A AU 2002213011A AU 1301102 A AU1301102 A AU 1301102A AU 2002213011 A1 AU2002213011 A1 AU 2002213011A1
Authority
AU
Australia
Prior art keywords
workpiece
electrochemical planarization
planarization
electrochemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002213011A
Inventor
Chris Barns
Saket Chadda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU2002213011A1 publication Critical patent/AU2002213011A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H10P52/203—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AU2002213011A 2000-10-04 2001-10-04 Method and apparatus for electrochemical planarization of a workpiece Abandoned AU2002213011A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/679,473 US6464855B1 (en) 2000-10-04 2000-10-04 Method and apparatus for electrochemical planarization of a workpiece
US09/679,473 2000-10-04
PCT/US2001/031034 WO2002029859A2 (en) 2000-10-04 2001-10-04 Method and apparatus for electrochemical planarization of a workpiece

Publications (1)

Publication Number Publication Date
AU2002213011A1 true AU2002213011A1 (en) 2002-04-15

Family

ID=24727037

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002213011A Abandoned AU2002213011A1 (en) 2000-10-04 2001-10-04 Method and apparatus for electrochemical planarization of a workpiece

Country Status (3)

Country Link
US (1) US6464855B1 (en)
AU (1) AU2002213011A1 (en)
WO (1) WO2002029859A2 (en)

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US7097755B2 (en) 1998-12-01 2006-08-29 Asm Nutool, Inc. Electrochemical mechanical processing with advancible sweeper
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US7220166B2 (en) 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7074113B1 (en) 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7078308B2 (en) 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7094131B2 (en) * 2000-08-30 2006-08-22 Micron Technology, Inc. Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US7112121B2 (en) 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7153195B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7153410B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US7160176B2 (en) 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7134934B2 (en) 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7192335B2 (en) * 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US6722950B1 (en) * 2000-11-07 2004-04-20 Planar Labs Corporation Method and apparatus for electrodialytic chemical mechanical polishing and deposition
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
JP2002254248A (en) * 2001-02-28 2002-09-10 Sony Corp Electrochemical processing equipment
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
US6706158B2 (en) * 2001-09-28 2004-03-16 Intel Corporation Electrochemical mechanical planarization
AU2002363479A1 (en) * 2001-11-02 2003-05-19 Nutool, Inc. Electrochemical mechanical processing with advancible sweeper
US6841057B2 (en) * 2002-03-13 2005-01-11 Applied Materials Inc. Method and apparatus for substrate polishing
US7112122B2 (en) 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7192260B2 (en) * 2003-10-09 2007-03-20 Lehr Precision, Inc. Progressive cavity pump/motor stator, and apparatus and method to manufacture same by electrochemical machining
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7906418B2 (en) * 2003-12-03 2011-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having substantially planar contacts and body
US7153744B2 (en) * 2003-12-03 2006-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming self-aligned poly for embedded flash
US7153777B2 (en) 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7097536B2 (en) * 2004-06-30 2006-08-29 Intel Corporation Electrically enhanced surface planarization
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US7205236B2 (en) * 2004-09-28 2007-04-17 Intel Corporation Semiconductor substrate polishing methods and equipment
US7651384B2 (en) * 2007-01-09 2010-01-26 Applied Materials, Inc. Method and system for point of use recycling of ECMP fluids
CN102051665B (en) * 2011-01-04 2014-02-26 安徽工业大学 A kind of polishing liquid for the electrochemical mechanical polishing of hard disk NiP
US9976227B2 (en) 2014-05-15 2018-05-22 Baker Hughes, A Ge Company, Llc Electrochemical machining method for rotors or stators for moineau pumps
ES2846299B2 (en) * 2021-05-18 2024-02-19 Drylyte Sl Device for electropolishing using a conductive surface
CN117984221A (en) 2022-11-03 2024-05-07 杭州众硅电子科技有限公司 Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrates
EP4364890B1 (en) * 2022-11-03 2025-07-02 Hangzhou Sizone Electronic Technology Inc. Electrochemical mechanical polishing and planarization equipment for processing conductive wafer substrate

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US2965556A (en) * 1959-04-15 1960-12-20 Struers Chemiske Lab H Apparatus for the electro-mechanical polishing of surfaces
US3959089A (en) * 1972-07-31 1976-05-25 Watts John Dawson Surface finishing and plating method
GB2069531A (en) 1980-02-13 1981-08-26 Production Eng Res Electro-chemical machining
JPS58137527A (en) * 1982-02-12 1983-08-16 Shindengen Electric Mfg Co Ltd Surface finishing method by electrolytic compound processing
JPS63288620A (en) * 1987-05-22 1988-11-25 Kobe Steel Ltd Electrolytic compound supermirror machining method for aluminum
US5256565A (en) 1989-05-08 1993-10-26 The United States Of America As Represented By The United States Department Of Energy Electrochemical planarization
US5562529A (en) * 1992-10-08 1996-10-08 Fujitsu Limited Apparatus and method for uniformly polishing a wafer
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5567300A (en) 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
US5863412A (en) 1995-10-17 1999-01-26 Canon Kabushiki Kaisha Etching method and process for producing a semiconductor element using said etching method
US5575706A (en) * 1996-01-11 1996-11-19 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) apparatus and polish method
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
JP3809237B2 (en) 1996-12-06 2006-08-16 キヤノン株式会社 Electrolytic pattern etching method
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US6017437A (en) 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate
WO1999026758A1 (en) * 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
US6056869A (en) 1998-06-04 2000-05-02 International Business Machines Corporation Wafer edge deplater for chemical mechanical polishing of substrates
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus

Also Published As

Publication number Publication date
WO2002029859A2 (en) 2002-04-11
US6464855B1 (en) 2002-10-15
WO2002029859A3 (en) 2003-09-25

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