AU2001232890A1 - Isolation technique for pressure sensing structure - Google Patents
Isolation technique for pressure sensing structureInfo
- Publication number
- AU2001232890A1 AU2001232890A1 AU2001232890A AU3289001A AU2001232890A1 AU 2001232890 A1 AU2001232890 A1 AU 2001232890A1 AU 2001232890 A AU2001232890 A AU 2001232890A AU 3289001 A AU3289001 A AU 3289001A AU 2001232890 A1 AU2001232890 A1 AU 2001232890A1
- Authority
- AU
- Australia
- Prior art keywords
- pressure sensing
- sensing structure
- isolation technique
- isolation
- technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/145—Housings with stress relieving means
- G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- H10W70/681—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/753—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Child & Adolescent Psychology (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/489,560 | 2000-01-19 | ||
| US09/489,560 US6550337B1 (en) | 2000-01-19 | 2000-01-19 | Isolation technique for pressure sensing structure |
| PCT/US2001/001962 WO2001053789A1 (en) | 2000-01-19 | 2001-01-19 | Isolation technique for pressure sensing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001232890A1 true AU2001232890A1 (en) | 2001-07-31 |
Family
ID=23944355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001232890A Abandoned AU2001232890A1 (en) | 2000-01-19 | 2001-01-19 | Isolation technique for pressure sensing structure |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US6550337B1 (en) |
| AU (1) | AU2001232890A1 (en) |
| WO (1) | WO2001053789A1 (en) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550337B1 (en) * | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
| JP3845615B2 (en) * | 2002-03-12 | 2006-11-15 | アドバンス電気工業株式会社 | Flow sensor |
| JP2003315193A (en) * | 2002-04-24 | 2003-11-06 | Denso Corp | Pressure sensor |
| DE10228000A1 (en) * | 2002-06-22 | 2004-01-08 | Robert Bosch Gmbh | Pressure measuring device |
| JP3969228B2 (en) * | 2002-07-19 | 2007-09-05 | 松下電工株式会社 | Mechanical deformation detection sensor, acceleration sensor using the same, and pressure sensor |
| JP4166528B2 (en) * | 2002-08-07 | 2008-10-15 | 株式会社デンソー | Capacitive mechanical quantity sensor |
| US6907787B2 (en) * | 2003-04-30 | 2005-06-21 | Honeywell International Inc. | Surface acoustic wave pressure sensor with microstructure sensing elements |
| US7037805B2 (en) * | 2003-05-07 | 2006-05-02 | Honeywell International Inc. | Methods and apparatus for attaching a die to a substrate |
| US6927098B2 (en) * | 2003-05-07 | 2005-08-09 | Honeywell International Inc. | Methods and apparatus for attaching MEMS devices to housing |
| JP2004361308A (en) * | 2003-06-06 | 2004-12-24 | Fuji Electric Device Technology Co Ltd | Physical quantity detection device and physical quantity detection means storage case |
| US7082835B2 (en) * | 2003-06-18 | 2006-08-01 | Honeywell International Inc. | Pressure sensor apparatus and method |
| US6923068B2 (en) * | 2003-06-19 | 2005-08-02 | Dynisco, Inc. | Pressure transducer |
| CN1864054B (en) * | 2003-08-11 | 2012-08-22 | 美国亚德诺半导体公司 | Capacitive sensor |
| US8162839B2 (en) * | 2003-08-27 | 2012-04-24 | Microtech Medical Technologies Ltd. | Protected passive resonating sensors |
| US7415883B2 (en) * | 2004-06-28 | 2008-08-26 | Zuli Holdings Ltd | Method for protecting resonating sensors and open protected resonating sensors |
| US8529724B2 (en) * | 2003-10-01 | 2013-09-10 | The Charles Stark Draper Laboratory, Inc. | Anodic bonding of silicon carbide to glass |
| US7024937B2 (en) * | 2003-12-03 | 2006-04-11 | Honeywell International Inc. | Isolated pressure transducer |
| US7000298B2 (en) * | 2004-04-20 | 2006-02-21 | Honeywell International Inc. | Method a quartz sensor |
| JP4260678B2 (en) * | 2004-05-20 | 2009-04-30 | 日本炭酸瓦斯株式会社 | Method for sealing a container containing high-pressure gas having combustion support or flammability |
| JP4185477B2 (en) * | 2004-07-23 | 2008-11-26 | 長野計器株式会社 | Pressure sensor |
| US7205701B2 (en) * | 2004-09-03 | 2007-04-17 | Honeywell International Inc. | Passive wireless acoustic wave chemical sensor |
| US7165455B2 (en) * | 2004-12-18 | 2007-01-23 | Honeywell International Inc. | Surface acoustic wave sensor methods and systems |
| KR100772039B1 (en) * | 2004-12-24 | 2007-10-31 | 엘지전자 주식회사 | Scanning micromirror package and manufacturing method thereof, and optical scanning device using same |
| DE102005053861A1 (en) * | 2005-11-11 | 2007-05-16 | Bosch Gmbh Robert | Sensor arrangement and method for producing a sensor arrangement |
| US20070114643A1 (en) * | 2005-11-22 | 2007-05-24 | Honeywell International Inc. | Mems flip-chip packaging |
| US7491567B2 (en) * | 2005-11-22 | 2009-02-17 | Honeywell International Inc. | MEMS device packaging methods |
| EP1837303A1 (en) * | 2006-03-24 | 2007-09-26 | Infineon Technologies SensoNor AS | Integrated pedestal mount for mems structure |
| US20080222884A1 (en) * | 2007-03-14 | 2008-09-18 | Honeywell International Inc. | Packaging for chip-on-board pressure sensor |
| US20080277747A1 (en) * | 2007-05-08 | 2008-11-13 | Nazir Ahmad | MEMS device support structure for sensor packaging |
| US7798010B2 (en) * | 2007-10-11 | 2010-09-21 | Honeywell International Inc. | Sensor geometry for improved package stress isolation |
| US8643127B2 (en) * | 2008-08-21 | 2014-02-04 | S3C, Inc. | Sensor device packaging |
| DE102008043644A1 (en) * | 2008-11-11 | 2010-05-12 | Robert Bosch Gmbh | pressure sensor |
| US7775119B1 (en) | 2009-03-03 | 2010-08-17 | S3C, Inc. | Media-compatible electrically isolated pressure sensor for high temperature applications |
| US8037771B2 (en) * | 2009-05-13 | 2011-10-18 | Lsi Corporation | Electronic pressure-sensing device |
| IT1394791B1 (en) * | 2009-05-20 | 2012-07-13 | Metallux Sa | PRESSURE SENSOR |
| US8371175B2 (en) * | 2009-10-01 | 2013-02-12 | Rosemount Inc. | Pressure transmitter with pressure sensor mount |
| CN102125760B (en) * | 2010-01-14 | 2014-04-30 | 鸿富锦精密工业(深圳)有限公司 | Game drum |
| US7997141B1 (en) * | 2010-01-24 | 2011-08-16 | Jui-Yang Lo | Oil pressure sensor |
| US8809974B2 (en) * | 2010-02-26 | 2014-08-19 | Ubotic Intellectual Property Company Limited | Semiconductor package for MEMS device and method of manufacturing same |
| DE102011075698A1 (en) * | 2010-05-12 | 2011-11-17 | Ifm Electronic Gmbh | Arrangement for connecting a measuring device with a container containing the medium to be measured |
| US8371176B2 (en) * | 2011-01-06 | 2013-02-12 | Honeywell International Inc. | Media isolated pressure sensor |
| US8171800B1 (en) * | 2011-01-25 | 2012-05-08 | Continental Automotive Systems, Inc. | Differential pressure sensor using dual backside absolute pressure sensing |
| DE102011102837A1 (en) * | 2011-05-30 | 2012-12-06 | Epcos Ag | Pressure sensor and method for producing a pressure sensor |
| ITTO20110577A1 (en) * | 2011-06-30 | 2012-12-31 | Stmicroelectronics Malta Ltd | ENCAPSULATION FOR A MEMS SENSOR AND ITS MANUFACTURING PROCEDURE |
| US8516897B1 (en) | 2012-02-21 | 2013-08-27 | Honeywell International Inc. | Pressure sensor |
| US9027410B2 (en) * | 2012-09-14 | 2015-05-12 | Sensata Technologies, Inc. | Hermetically glass sealed pressure sensor |
| US9689769B2 (en) * | 2013-07-19 | 2017-06-27 | Rosemount Inc. | Pressure transmitter having an isolation assembly with a two-piece isolator plug |
| US9261425B2 (en) * | 2014-01-02 | 2016-02-16 | Rosemount Aerospace Inc. | High temperature pressure sensor |
| US9593995B2 (en) | 2014-02-28 | 2017-03-14 | Measurement Specialties, Inc. | Package for a differential pressure sensing die |
| US9316552B2 (en) * | 2014-02-28 | 2016-04-19 | Measurement Specialties, Inc. | Differential pressure sensing die |
| US9310267B2 (en) | 2014-02-28 | 2016-04-12 | Measurement Specialities, Inc. | Differential pressure sensor |
| US9655262B2 (en) * | 2014-04-18 | 2017-05-16 | Rosemount Aerospace Inc. | Header sub-assemblies |
| CN104259630B (en) * | 2014-09-16 | 2017-02-08 | 中国电子科技集团公司第二十研究所 | Welding method and welding system of angle measuring antenna |
| US9915577B2 (en) * | 2014-12-02 | 2018-03-13 | Sensata Technologies, Inc. | Case isolated oil filled MEMS pressure sensor |
| DE102015104410B4 (en) * | 2015-03-24 | 2018-09-13 | Tdk-Micronas Gmbh | pressure sensor |
| US9663357B2 (en) * | 2015-07-15 | 2017-05-30 | Texas Instruments Incorporated | Open cavity package using chip-embedding technology |
| US10101234B2 (en) * | 2016-02-11 | 2018-10-16 | Rosemount Aerospace, Inc. | Open diaphragm harsh environment pressure sensor |
| CN107290099B (en) | 2016-04-11 | 2021-06-08 | 森萨塔科技公司 | Pressure sensor, plug for a pressure sensor and method for producing a plug |
| EP3236226B1 (en) | 2016-04-20 | 2019-07-24 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
| US9945747B1 (en) * | 2016-10-13 | 2018-04-17 | Honeywell International Inc. | Gel filled port pressure sensor for robust media sealing |
| US9878904B1 (en) * | 2016-10-25 | 2018-01-30 | Rosemount Aerospace Inc. | MEMS sensor with electronics integration |
| CN106430085A (en) * | 2016-12-09 | 2017-02-22 | 苏州美仑凯力电子有限公司 | Protection method for MEMS pressure sensor packaging |
| US10551261B2 (en) | 2017-02-28 | 2020-02-04 | Rosemount Inc. | Joint for brittle materials |
| US10036676B1 (en) * | 2017-03-15 | 2018-07-31 | Honeywell International Inc. | Microelectromechanical systems (MEMS) force die with buried cavity vented to the edges |
| US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| US10544040B2 (en) * | 2017-05-05 | 2020-01-28 | Dunan Microstaq, Inc. | Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment |
| US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
| US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
| DE102017212422B4 (en) | 2017-07-20 | 2024-06-27 | Robert Bosch Gmbh | Pressure sensor arrangement and method for its manufacture |
| DE102017212838B4 (en) | 2017-07-26 | 2024-08-22 | Robert Bosch Gmbh | Pressure sensor arrangement, measuring device and method for its manufacture |
| DE102017212866A1 (en) | 2017-07-26 | 2019-01-31 | Robert Bosch Gmbh | Pressure sensor arrangement, measuring device and method for the production thereof |
| DE102017213354A1 (en) * | 2017-08-02 | 2019-02-07 | Robert Bosch Gmbh | Micromechanical pressure sensor device and corresponding manufacturing method |
| US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
| CN107907262A (en) * | 2017-12-20 | 2018-04-13 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducers for negative pressure measurement |
| CN108267259A (en) * | 2018-03-19 | 2018-07-10 | 深圳瑞德感知科技有限公司 | Ceramic MEMS pressure sensor |
| CN208721114U (en) * | 2018-09-21 | 2019-04-09 | 罗伯特·博世有限公司 | A kind of sensor device |
| US11460363B2 (en) | 2019-03-29 | 2022-10-04 | Honeywell International Inc. | Pressure sensors and methods of manufacturing a pressure sensor |
| JP7319181B2 (en) * | 2019-12-05 | 2023-08-01 | アズビル株式会社 | Encapsulation structure and manufacturing method thereof |
| US11573145B2 (en) | 2020-03-31 | 2023-02-07 | Rosemount Aerospace Inc. | Capacitive MEMS pressure sensor and method of manufacture |
| EP4500135A1 (en) * | 2022-03-29 | 2025-02-05 | ZF CV Systems Europe BV | A modular pressure sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1138401A (en) | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
| US3697917A (en) | 1971-08-02 | 1972-10-10 | Gen Electric | Semiconductor strain gage pressure transducer |
| US4006640A (en) * | 1976-02-06 | 1977-02-08 | Honeywell Inc. | Seal for process pressure to current transmitter |
| US4454440A (en) | 1978-12-22 | 1984-06-12 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
| US4222277A (en) | 1979-08-13 | 1980-09-16 | Kulite Semiconductor Products, Inc. | Media compatible pressure transducer |
| US4322980A (en) | 1979-11-08 | 1982-04-06 | Hitachi, Ltd. | Semiconductor pressure sensor having plural pressure sensitive diaphragms and method |
| US4406993A (en) | 1981-08-28 | 1983-09-27 | Kulite Semiconductor Products, Inc. | Oil filled pressure transducers |
| JPS58146827A (en) * | 1982-02-25 | 1983-09-01 | Fuji Electric Co Ltd | Semiconductor pressure sensor |
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| US4716492A (en) * | 1986-05-05 | 1987-12-29 | Texas Instruments Incorporated | Pressure sensor with improved capacitive pressure transducer |
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| CH679700A5 (en) | 1989-09-27 | 1992-03-31 | Siemens Ag Albis | Thick or thin film pressure sensor - has grooved ceramics substrate acting as flexure membrane with attached piezo-resistors |
| JP2595829B2 (en) | 1991-04-22 | 1997-04-02 | 株式会社日立製作所 | Differential pressure sensor and multifunction differential pressure sensor |
| IL106790A (en) * | 1992-09-01 | 1996-08-04 | Rosemount Inc | Pedestal mount capacitive pressure sensor and a process of manufacturing same |
| US5461922A (en) | 1993-07-27 | 1995-10-31 | Lucas-Novasensor | Pressure sensor isolated within housing having integral diaphragm and method of making same |
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| US6323550B1 (en) * | 1995-06-06 | 2001-11-27 | Analog Devices, Inc. | Package for sealing an integrated circuit die |
| JPH09222372A (en) * | 1996-02-19 | 1997-08-26 | Mitsubishi Electric Corp | Semiconductor type sensor |
| US5824910A (en) | 1997-04-16 | 1998-10-20 | The United States Of America As Represented By The Secretary Of The Navy | Miniature hydrostat fabricated using multiple microelectromechanical processes |
| JPH11201846A (en) * | 1998-01-12 | 1999-07-30 | Mitsubishi Electric Corp | Semiconductor pressure detector |
| US6232150B1 (en) * | 1998-12-03 | 2001-05-15 | The Regents Of The University Of Michigan | Process for making microstructures and microstructures made thereby |
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| US6452238B1 (en) * | 1999-10-04 | 2002-09-17 | Texas Instruments Incorporated | MEMS wafer level package |
| US6550337B1 (en) * | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
| US6272928B1 (en) * | 2000-01-24 | 2001-08-14 | Kulite Semiconductor Products | Hermetically sealed absolute and differential pressure transducer |
| US6401545B1 (en) * | 2000-01-25 | 2002-06-11 | Motorola, Inc. | Micro electro-mechanical system sensor with selective encapsulation and method therefor |
| US6441481B1 (en) * | 2000-04-10 | 2002-08-27 | Analog Devices, Inc. | Hermetically sealed microstructure package |
| US6448109B1 (en) * | 2000-11-15 | 2002-09-10 | Analog Devices, Inc. | Wafer level method of capping multiple MEMS elements |
| US6608370B1 (en) * | 2002-01-28 | 2003-08-19 | Motorola, Inc. | Semiconductor wafer having a thin die and tethers and methods of making the same |
-
2000
- 2000-01-19 US US09/489,560 patent/US6550337B1/en not_active Expired - Lifetime
-
2001
- 2001-01-19 AU AU2001232890A patent/AU2001232890A1/en not_active Abandoned
- 2001-01-19 WO PCT/US2001/001962 patent/WO2001053789A1/en not_active Ceased
-
2003
- 2003-02-20 US US10/371,509 patent/US6938490B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6938490B2 (en) | 2005-09-06 |
| WO2001053789A1 (en) | 2001-07-26 |
| WO2001053789A9 (en) | 2002-10-24 |
| US6550337B1 (en) | 2003-04-22 |
| US20030150275A1 (en) | 2003-08-14 |
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