[go: up one dir, main page]

AU2001229403A1 - System and method for controlled polishing and planarization of semiconductor wafers - Google Patents

System and method for controlled polishing and planarization of semiconductor wafers

Info

Publication number
AU2001229403A1
AU2001229403A1 AU2001229403A AU2940301A AU2001229403A1 AU 2001229403 A1 AU2001229403 A1 AU 2001229403A1 AU 2001229403 A AU2001229403 A AU 2001229403A AU 2940301 A AU2940301 A AU 2940301A AU 2001229403 A1 AU2001229403 A1 AU 2001229403A1
Authority
AU
Australia
Prior art keywords
planarization
semiconductor wafers
controlled polishing
polishing
controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001229403A
Inventor
Yehiel Gotkis
Rod Kistler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001229403A1 publication Critical patent/AU2001229403A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001229403A 2000-01-28 2001-01-12 System and method for controlled polishing and planarization of semiconductor wafers Abandoned AU2001229403A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/493,978 US6340326B1 (en) 2000-01-28 2000-01-28 System and method for controlled polishing and planarization of semiconductor wafers
US09493978 2000-01-28
PCT/US2001/001044 WO2001054862A1 (en) 2000-01-28 2001-01-12 System and method for controlled polishing and planarization of semiconductor wafers

Publications (1)

Publication Number Publication Date
AU2001229403A1 true AU2001229403A1 (en) 2001-08-07

Family

ID=23962506

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001229403A Abandoned AU2001229403A1 (en) 2000-01-28 2001-01-12 System and method for controlled polishing and planarization of semiconductor wafers

Country Status (8)

Country Link
US (2) US6340326B1 (en)
EP (1) EP1250215B1 (en)
JP (1) JP4831910B2 (en)
KR (1) KR100780977B1 (en)
AU (1) AU2001229403A1 (en)
DE (1) DE60102891T2 (en)
TW (1) TW471994B (en)
WO (1) WO2001054862A1 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6461226B1 (en) * 1998-11-25 2002-10-08 Promos Technologies, Inc. Chemical mechanical polishing of a metal layer using a composite polishing pad
US6450860B1 (en) * 1999-10-28 2002-09-17 Strasbaugh Pad transfer apparatus for chemical mechanical planarization
US6635512B1 (en) * 1999-11-04 2003-10-21 Rohm Co., Ltd. Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning
JP2001138233A (en) * 1999-11-19 2001-05-22 Sony Corp Polishing apparatus, polishing method and polishing tool cleaning method
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6585572B1 (en) * 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6503129B1 (en) * 2000-10-06 2003-01-07 Lam Research Corporation Activated slurry CMP system and methods for implementing the same
US20020100743A1 (en) * 2000-12-05 2002-08-01 Bonner Benjamin A. Multi-step polish process to control uniformity when using a selective slurry on patterned wafers
US6561881B2 (en) * 2001-03-15 2003-05-13 Oriol Inc. System and method for chemical mechanical polishing using multiple small polishing pads
US6509270B1 (en) * 2001-03-30 2003-01-21 Cypress Semiconductor Corp. Method for polishing a semiconductor topography
US6579157B1 (en) * 2001-03-30 2003-06-17 Lam Research Corporation Polishing pad ironing system and method for implementing the same
US6761619B1 (en) 2001-07-10 2004-07-13 Cypress Semiconductor Corp. Method and system for spatial uniform polishing
JP2003068823A (en) * 2001-08-28 2003-03-07 Mitsubishi Electric Corp Substrate carrier management system, substrate carrier management method, program, recording medium, and semiconductor device manufacturing method
TW559580B (en) * 2001-10-04 2003-11-01 Promos Technologies Inc Polishing device
AU2003218477A1 (en) * 2002-04-02 2003-10-20 Rodel Holdings, Inc. Composite conditioning tool
US7089782B2 (en) 2003-01-09 2006-08-15 Applied Materials, Inc. Polishing head test station
KR100501473B1 (en) * 2003-02-04 2005-07-18 동부아남반도체 주식회사 Apparatus and method for preventing over polishing of cmp system
JP2004288727A (en) * 2003-03-19 2004-10-14 Seiko Epson Corp CMP apparatus, CMP polishing method, semiconductor device and method for manufacturing the same
US20040192178A1 (en) * 2003-03-28 2004-09-30 Barak Yardeni Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US7066506B2 (en) * 2003-09-30 2006-06-27 Key Plastics, Llc System for preventing inadvertent locking of a vehicle door
CN101817162A (en) * 2004-01-26 2010-09-01 Tbw工业有限公司 Multi-step, in-situ pad conditioning system for chemical mechanical planarization
JP2005340328A (en) * 2004-05-25 2005-12-08 Fujitsu Ltd Manufacturing method of semiconductor device
US7040954B1 (en) 2004-09-28 2006-05-09 Lam Research Corporation Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing
CN100400233C (en) * 2006-05-26 2008-07-09 中国科学院上海技术物理研究所 Surface polishing method for protective side edge of group II-VI semiconductor material
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
JP2008229820A (en) * 2007-03-23 2008-10-02 Elpida Memory Inc Dresser for cmp processing, cmp processing device, and dressing treatment method of polishing pad for cmp processing
KR101042321B1 (en) * 2009-08-18 2011-06-17 세메스 주식회사 Substrate Polishing Apparatus and Method
KR101098367B1 (en) 2009-08-28 2011-12-26 세메스 주식회사 Substrate polishing apparatus and method for treating thereof
DE102013221319A1 (en) 2013-10-21 2015-04-23 Volkswagen Aktiengesellschaft Automatic change of grinding / polishing wheels for the treatment of body components
SG10201906815XA (en) 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
KR102666494B1 (en) * 2016-03-25 2024-05-17 어플라이드 머티어리얼스, 인코포레이티드 Polishing pad assemblies for local area polishing systems and polishing systems
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
WO2018164804A1 (en) * 2017-03-06 2018-09-13 Applied Materials, Inc. Spiral and concentric movement designed for cmp location specific polish (lsp)
JP7049801B2 (en) * 2017-10-12 2022-04-07 株式会社ディスコ Grinding method for workpieces
KR102113026B1 (en) * 2018-11-29 2020-05-20 한국생산기술연구원 Cmp apparatus for wafer and its sacrificial part position control method
CN111906694A (en) * 2020-08-13 2020-11-10 蚌埠中光电科技有限公司 Online trimming device of glass grinding pad
JP7530237B2 (en) * 2020-08-17 2024-08-07 キオクシア株式会社 Polishing apparatus and polishing method
WO2025058320A1 (en) * 2023-09-12 2025-03-20 정인권 Semiconductor substrate polishing apparatus
CN117415731A (en) * 2023-11-03 2024-01-19 北京中电科电子装备有限公司 A polishing disc online dressing device and method

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589078A (en) 1968-07-26 1971-06-29 Itek Corp Surface generating apparatus
US4128968A (en) 1976-09-22 1978-12-12 The Perkin-Elmer Corporation Optical surface polisher
US4232485A (en) 1977-08-13 1980-11-11 Dollond & Aitschison (Services) Limited Apparatus for polishing curved surfaces
US4144099A (en) 1977-10-31 1979-03-13 International Business Machines Corporation High performance silicon wafer and fabrication process
US4197676A (en) 1978-07-17 1980-04-15 Sauerland Franz L Apparatus for automatic lapping control
US4358338A (en) 1980-05-16 1982-11-09 Varian Associates, Inc. End point detection method for physical etching process
WO1982003038A1 (en) 1981-03-10 1982-09-16 Hatano Kouichi One-pass type automatic plane multi-head grinding polishing and cleaning machine
US4462860A (en) 1982-05-24 1984-07-31 At&T Bell Laboratories End point detection
JPS60109859U (en) 1983-12-28 1985-07-25 株式会社　デイスコ Semiconductor wafer surface grinding equipment
JPS60155358A (en) 1984-01-23 1985-08-15 Disco Abrasive Sys Ltd Method and device for grinding surface of semiconductor wafer
JPS61109656A (en) 1984-10-30 1986-05-28 Disco Abrasive Sys Ltd surface grinding equipment
DE3771857D1 (en) 1986-12-08 1991-09-05 Sumitomo Electric Industries SURFACE GRINDING MACHINE.
US4826563A (en) 1988-04-14 1989-05-02 Honeywell Inc. Chemical polishing process and apparatus
US5177908A (en) 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5245790A (en) 1992-02-14 1993-09-21 Lsi Logic Corporation Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers
JP3191273B2 (en) * 1992-05-25 2001-07-23 ソニー株式会社 Grinding wheel and its electrolytic dressing method
JPH0697132A (en) 1992-07-10 1994-04-08 Lsi Logic Corp Mechanochemical polishing apparatus of semiconductor wafer, mounting method of semiconductor-wafer polishing pad to platen of above apparatus and polishing composite pad of above apparatus
US5310455A (en) 1992-07-10 1994-05-10 Lsi Logic Corporation Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
US5265378A (en) 1992-07-10 1993-11-30 Lsi Logic Corporation Detecting the endpoint of chem-mech polishing and resulting semiconductor device
JP3370112B2 (en) * 1992-10-12 2003-01-27 不二越機械工業株式会社 Wafer polishing equipment
US5389194A (en) 1993-02-05 1995-02-14 Lsi Logic Corporation Methods of cleaning semiconductor substrates after polishing
US5508077A (en) 1993-07-30 1996-04-16 Hmt Technology Corporation Textured disc substrate and method
JPH07111256A (en) 1993-10-13 1995-04-25 Toshiba Corp Semiconductor manufacturing equipment
US5632873A (en) 1995-05-22 1997-05-27 Stevens; Joseph J. Two piece anti-stick clamp ring
US5667433A (en) 1995-06-07 1997-09-16 Lsi Logic Corporation Keyed end effector for CMP pad conditioner
US5895270A (en) 1995-06-26 1999-04-20 Texas Instruments Incorporated Chemical mechanical polishing method and apparatus
US5599423A (en) 1995-06-30 1997-02-04 Applied Materials, Inc. Apparatus and method for simulating and optimizing a chemical mechanical polishing system
JP3778594B2 (en) * 1995-07-18 2006-05-24 株式会社荏原製作所 Dressing method
US5672095A (en) 1995-09-29 1997-09-30 Intel Corporation Elimination of pad conditioning in a chemical mechanical polishing process
US5709593A (en) 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
KR970042941A (en) 1995-12-29 1997-07-26 베일리 웨인 피 Polishing Compounds for Mechanical and Chemical Polishing Processes
US6010538A (en) 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6075606A (en) * 1996-02-16 2000-06-13 Doan; Trung T. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
US5948697A (en) 1996-05-23 1999-09-07 Lsi Logic Corporation Catalytic acceleration and electrical bias control of CMP processing
JPH10551A (en) * 1996-06-07 1998-01-06 Canon Inc Chemical mechanical polishing equipment
JPH1034529A (en) 1996-07-18 1998-02-10 Speedfam Co Ltd Automatic sizing device
US5868608A (en) 1996-08-13 1999-02-09 Lsi Logic Corporation Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
US5645469A (en) 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5736427A (en) * 1996-10-08 1998-04-07 Micron Technology, Inc. Polishing pad contour indicator for mechanical or chemical-mechanical planarization
JPH10217112A (en) * 1997-02-06 1998-08-18 Speedfam Co Ltd CMP equipment
JP3705670B2 (en) * 1997-02-19 2005-10-12 株式会社荏原製作所 Polishing apparatus and method
JPH10230451A (en) 1997-02-20 1998-09-02 Speedfam Co Ltd Grinding device and work measuring method
JP3231659B2 (en) 1997-04-28 2001-11-26 日本電気株式会社 Automatic polishing equipment
US5975994A (en) * 1997-06-11 1999-11-02 Micron Technology, Inc. Method and apparatus for selectively conditioning a polished pad used in planarizng substrates
US6004193A (en) * 1997-07-17 1999-12-21 Lsi Logic Corporation Dual purpose retaining ring and polishing pad conditioner
US5882251A (en) 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
US5865666A (en) 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US5919082A (en) 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
US6168508B1 (en) 1997-08-25 2001-01-02 Lsi Logic Corporation Polishing pad surface for improved process control
US5893756A (en) 1997-08-26 1999-04-13 Lsi Logic Corporation Use of ethylene glycol as a corrosion inhibitor during cleaning after metal chemical mechanical polishing
JP4217001B2 (en) 1997-09-26 2009-01-28 シーメンス アクチエンゲゼルシヤフト Fluid machine housing
US5888120A (en) 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
JPH11114813A (en) 1997-10-07 1999-04-27 Speedfam Co Ltd Polishing system and control method for it
US5957757A (en) 1997-10-30 1999-09-28 Lsi Logic Corporation Conditioning CMP polishing pad using a high pressure fluid
US6102784A (en) 1997-11-05 2000-08-15 Speedfam-Ipec Corporation Method and apparatus for improved gear cleaning assembly in polishing machines
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US5964646A (en) 1997-11-17 1999-10-12 Strasbaugh Grinding process and apparatus for planarizing sawed wafers
US5975991A (en) 1997-11-26 1999-11-02 Speedfam-Ipec Corporation Method and apparatus for processing workpieces with multiple polishing elements
JPH11179646A (en) 1997-12-19 1999-07-06 Speedfam Co Ltd Cleaning equipment
JPH11204469A (en) * 1997-12-29 1999-07-30 Samsung Electron Co Ltd Pad cleaning system and cleaning method for semiconductor manufacturing equipment
US5972162A (en) 1998-01-06 1999-10-26 Speedfam Corporation Wafer polishing with improved end point detection
JPH11204468A (en) 1998-01-09 1999-07-30 Speedfam Co Ltd Semiconductor wafer surface flattening device
JPH11204615A (en) 1998-01-19 1999-07-30 Speedfam Co Ltd Wafer loading and unloading mechanism of loading robot
US5997390A (en) 1998-02-02 1999-12-07 Speedfam Corporation Polishing apparatus with improved alignment of polishing plates
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
JP3925580B2 (en) 1998-03-05 2007-06-06 スピードファム株式会社 Wafer processing apparatus and processing method
JPH11254314A (en) 1998-03-10 1999-09-21 Speedfam Co Ltd Work surface processing equipment
EP0992322A4 (en) 1998-04-06 2006-09-27 Ebara Corp POLISHING DEVICE
JPH11300607A (en) 1998-04-16 1999-11-02 Speedfam-Ipec Co Ltd Polishing equipment
US5897426A (en) 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
JP2000015557A (en) * 1998-04-27 2000-01-18 Ebara Corp Polishing device
US6106662A (en) 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6261157B1 (en) 1999-05-25 2001-07-17 Applied Materials, Inc. Selective damascene chemical mechanical polishing
US6083082A (en) 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
US6328632B1 (en) 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
US6431959B1 (en) 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers

Also Published As

Publication number Publication date
US6340326B1 (en) 2002-01-22
JP4831910B2 (en) 2011-12-07
WO2001054862A1 (en) 2001-08-02
EP1250215A1 (en) 2002-10-23
US6729943B2 (en) 2004-05-04
KR100780977B1 (en) 2007-11-29
JP2003521117A (en) 2003-07-08
EP1250215B1 (en) 2004-04-21
DE60102891D1 (en) 2004-05-27
DE60102891T2 (en) 2005-03-31
US20020137436A1 (en) 2002-09-26
TW471994B (en) 2002-01-11
KR20020077677A (en) 2002-10-12

Similar Documents

Publication Publication Date Title
AU2001229403A1 (en) System and method for controlled polishing and planarization of semiconductor wafers
AU2002241637A1 (en) System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
AU1683899A (en) Abrasive, method of polishing wafer, and method of producing semiconductor device
AU3893297A (en) Abrasive construction for semiconductor wafer modification
AU1909201A (en) Method and apparatus for personalization of semiconductor
AU8453298A (en) Polishing semiconductor wafers
AU2002326867A1 (en) Slurry distributor for chemical mechanical polishing apparatus and method of using the same
AU2001257584A1 (en) Wafer preparation systems and methods for preparing wafers
AU8070498A (en) Methods for treating semiconductor wafers
AU2002360612A1 (en) Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
SG60162A1 (en) Method and device for polishing semiconductor wafers
AU2001295060A1 (en) Methods and systems for semiconductor fabrication processes
SG100632A1 (en) Polishing slurry, polishing method and processes for fabricating semiconductor devices
AU6954300A (en) Method and system for in situ cleaning of semiconductor manufacturing equipment using combination chemistries
AU2001241190A1 (en) Semiconductor wafer cleaning agent and cleaning method
AU3308699A (en) Apparatus and method for cleaning semiconductor wafers
AU2002249848A1 (en) Slurry and method for chemical mechanical polishing of copper
EP1295680A3 (en) Polishing pad for semiconductor wafer
AU2001253180A1 (en) A chemical-mechanical polishing system for the manufacture of semiconductor devices
SG105536A1 (en) Wafer planarization apparatus and planarization method thereof
AU3872900A (en) System and method for controlling process temperatures for semi-conductor wafer
AU4458001A (en) Method of surface treatment of semiconductor
AU3903000A (en) Semiconductor wafer cleaning apparatus and method
AU2003202492A1 (en) Semiconductor wafer protective member and semiconductor wafer grinding method
AU4875601A (en) Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same