WO2025058320A1 - Semiconductor substrate polishing apparatus - Google Patents

Abstract

A substrate attaching/detaching position and a substrate polishing position are arranged on the upper portion of a polishing platen to which a polishing pad is attached to provide a polishing surface for polishing a substrate. A polishing head alternately reciprocates between the substrate attaching/detaching position and the substrate polishing position. At the substrate polishing position, the polishing head polishes the substrate on the polishing pad, and at the substrate attaching/detaching position, the polishing head exchanges the substrate with a substrate attaching/detaching device. A pad conditioner arm conditions the polishing pad under the substrate attaching/detaching device. A substrate transport means enters a space between the polishing head and the substrate attaching/detaching device and exchanges the substrate with the substrate attaching/detaching device above the polishing platen.

Description

{POLISHING APPARATUS FOR POLISHING SEMICONDUCTOR WAFERS}

This application claims the benefit of Korean Patent Application Nos. 10-2023-0120760 and 10-2023-0120761 filed on September 12, 2023, Korean Patent Application Nos. 10-2023-0124412 filed on September 18, 2023, Korean Patent Application Nos. 10-2023-0133909 and 10-2023-0133914 filed on October 9, 2023, Korean Patent Application No. 10-2023-0141588 filed on October 21, 2023, Korean Patent Application No. 10-2023-0141615 filed on October 22, 2023, and Korean Patent Application No. 10-2023-0154891, Korean Patent Application No. 10-2024-0030990, filed March 4, 2024, Korean Patent Application No. 10-2024-0032396, filed March 7, 2024, Korean Patent Application No. 10-2024-0038805, filed March 21, 2024, Korean Patent Application No. 10-2024-0089299, filed July 6, 2024, and Korean Patent Application No. 10-2024-0110148, filed August 17, 2024, which are hereby incorporated by reference herein.

The present invention relates to a device and method for polishing a substrate used in the manufacture of semiconductor devices.

Since the substrate polishing equipment that polishes semiconductor substrates is installed in a clean room that requires expensive construction and operating costs, a space-efficient design is required to reduce the equipment area (footprint). To this end, it is important to space-efficiently arrange the components of the substrate polishing equipment, such as the polishing platen, polishing head, substrate attachment/detachment device, pad conditioner arm, and polishing agent arm, and design them so that they do not collide with each other in a limited space and operate smoothly. It is also important to consider accessibility so that the operator can easily maintain the components, and to design them so that the polishing pad can be protected from contaminants. In addition, since the substrate polishing equipment is an expensive piece of equipment that costs several billion won per unit, a design that can reduce the manufacturing cost is also important.

The problem that the present invention seeks to solve is to reduce the footprint of a substrate polishing device.

The problem to be solved by the present invention is to provide a substrate polishing device in which components operate smoothly without colliding with each other in a limited space.

The problem to be solved by the present invention is to provide a substrate polishing device in which a pad conditioner arm and an abrasive supply arm are positioned in a location that is easy to maintain.

The problem that the present invention seeks to solve is to reduce the manufacturing cost of a substrate polishing device.

The problem to be solved by the present invention is to provide a means for protecting a polishing pad from contaminants.

A substrate polishing device according to an embodiment of the present invention comprises a substrate polishing unit and a substrate transfer means for transferring a substrate to the substrate polishing unit, wherein the substrate polishing unit comprises: at least one polishing head, a polishing platen rotating about a first rotational axis, a substrate polishing position where the at least one polishing head polishes a substrate on a polishing pad attached to the polishing platen, a substrate attachment/detachment position disposed above the polishing platen, a substrate attachment/detachment device disposed above the polishing platen for transferring a substrate with the polishing head at the substrate attachment/detachment position, and a pad conditioner arm moving between the substrate attachment/detachment device and the polishing pad and conditioning the polishing pad.

The at least one polishing head moves between the substrate polishing position and the substrate attachment/detachment position, polishes the substrate on the polishing pad at the substrate polishing position, and transfers the substrate to/from the substrate attachment/detachment device at the substrate attachment/detachment location. The substrate handler of the substrate transport means enters the space between the at least one polishing head and the substrate attachment/detachment device and transfers the substrate to/from the substrate attachment/detachment device on top of the polishing platen.

In the above embodiment, the at least one polishing head can be configured to move linearly along a linear guide rail to reciprocate between the substrate detachment position and the substrate polishing position.

In the above embodiment, the at least one polishing head can move the substrate polishing position and the substrate detachment position by rotating around the second rotation axis. The first rotation axis and the second rotation axis can be configured to coincide. The distance between the first rotation axis and the second rotation axis can be configured to be less than 1/2 of the distance between the edge of the polishing plate and the fence arranged along the perimeter of the polishing plate.

In the above embodiment, the substrate detachment device includes a sidewall extending upward from the base, and an opening through which a substrate handler can enter is arranged in the sidewall.

In the above embodiment, the pivot rotation axis of the pad conditioner arm may be disposed between a virtual plane A that includes the substrate polishing position and the substrate attachment/detachment position outside the polishing platen and is perpendicular to the virtual plane C that includes the substrate polishing position, and a virtual plane D that is closer to the plane C among virtual planes that are parallel to the plane C and contact the polishing platen. The end of the pad conditioner arm may be disposed between a virtual plane G that includes the substrate attachment/detachment position and is perpendicular to the plane A, and a virtual plane F that is closer to the plane G among virtual planes that are parallel to the plane G and contact the polishing platen.

In the above embodiment, the pivot rotation axis of the abrasive supply arm can be disposed outside the abrasive platen between the surfaces A and C, opposite the rotation axis of the pad conditioner arm with the surface A therebetween. The pivot rotation axis of the abrasive supply arm can be disposed between a surface E located midway between the surfaces C and D and an imaginary surface K parallel to and adjacent to the surface D. An end of the abrasive supply arm is disposed between the surface B and the surface C.

In the above embodiment, the rotation axis of the pad conditioner arm and the rotation axis of the abrasive supply arm are arranged opposite each other with the surface A between the surface C and the surface K.

According to another embodiment, the substrate detachment device includes the polishing plate inside and is positioned closest to a first surface of a circumscribed tetrahedron that contacts the polishing plate, and the substrate transfer means can transfer a substrate to and from the substrate detachment device through the first surface.

In the above embodiment, at least a portion of the vertical shaft of the substrate detachment device may be positioned in the space between the circumscribed tetrahedron and the polishing platen near the first edge adjacent to the first face of the circumscribed tetrahedron.

In the above embodiment, at least a portion of the vertical shaft of the pad conditioner arm can be positioned in the space between the circumscribed tetrahedron and the polishing platen near a second edge adjacent to the first face of the circumscribed tetrahedron.

In the above embodiment, at least a portion of the vertical shaft of the abrasive supply arm may be disposed in the space between the circumscribed tetrahedron and the abrasive platen near a fourth edge located opposite the second edge with the rotational axis of the abrasive platen therebetween.

In the above embodiment, the substrate polishing unit includes a pad conditioner cleaning station, and a vertical shaft of the pad conditioner cleaning station can be disposed in a space between the circumscribed tetrahedron and the polishing platen near a third edge located opposite the first edge with the rotational axis of the polishing platen therebetween.

According to another embodiment, the substrate transfer means transfers the substrate to and from the substrate attachment/detachment device through a first surface of an imaginary tetrahedron around the polishing platen, the pad conditioner arm is disposed between a second surface of the imaginary tetrahedron sharing an edge with the first surface and the polishing platen, the rotational axis of the pad conditioner arm is perpendicular to a virtual surface A including the substrate polishing position and the substrate attachment/detachment position and is disposed between a virtual surface C including the substrate polishing position and a virtual surface B including the rotational axis of the polishing platen, and the pad conditioner arm has an end at a parking position disposed between a virtual surface G including the first surface and the imaginary surface A and including the substrate polishing position.

In the above embodiment, the pivot rotation axis of the abrasive supply arm is disposed in a space between a third surface positioned opposite the first surface, a fourth surface positioned opposite the second surface, surface A, surface C, and the abrasive platen, and an end of the abrasive supply arm is disposed between surface B, surface C, the fourth surface opposite the second surface, and the abrasive platen at a parking position.

In the above embodiment, the substrate transfer means transfers the substrate to and from the substrate detachment device through the fourth face of an imaginary tetrahedron around the polishing platen; the rotational axis of the pad conditioner arm is disposed at a location closer to the first face than to the face B in the space between the first face sharing an edge with the fourth face, the second face arranged opposite the fourth face, the face A, the face B, and the polishing platen; and the rotational axis of the abrasive supply arm is disposed at a location closer to the third face than to the face B and closer to the face A than to the second face in the space between the second face, the third face arranged opposite the first face, the face B, the face A, and the polishing platen.

A substrate polishing device according to an embodiment of the present invention performs first and second polishing modes. In the first polishing mode, a first polishing head polishes a substrate on a polishing pad, the second polishing head receives a substrate from a substrate attachment/detachment device disposed on top of the polishing pad, a substrate handler of a substrate transfer device enters a space between the second polishing head and the substrate attachment/detachment device to receive a substrate from/to the substrate attachment/detachment device, and a pad conditioner arm conditions the polishing pad under the substrate attachment/detachment device. In the second polishing mode, the second polishing head polishes a substrate on a polishing pad, the first polishing head receives a substrate from a substrate attachment/detachment device disposed on top of the polishing pad, a substrate handler of the substrate transfer device enters a space between the first polishing head and the substrate attachment/detachment device to receive a substrate from/to the substrate attachment/detachment device, and the pad conditioner arm conditions the polishing pad under the substrate attachment/detachment device. The transition from the first polishing mode to the second polishing mode is performed by vertically moving the first polishing head to a position higher than the height of the pad conditioner arm plus the height of the substrate detachment device, and then horizontally moving it above the substrate detachment device.

A substrate polishing unit according to an embodiment of the present invention includes: a polishing platen having a polishing pad attached thereto to provide a polishing surface on which a substrate is polished; a polishing head for polishing a substrate on the polishing pad; a substrate attaching/detaching device disposed above the polishing surface and moving vertically to exchange contact between the polishing head and the substrate; and a polishing head cleaning unit disposed around the substrate attaching/detaching device for cleaning the polishing head. The substrate attaching/detaching device is characterized in that it moves vertically relative to the polishing head cleaning unit.

A substrate polishing unit according to an embodiment of the present invention includes: a polishing platen having a polishing pad attached thereto to provide a polishing surface on which a substrate is polished; a substrate polishing position disposed on the polishing surface; a substrate attachment/detachment device disposed above the polishing surface; a pad conditioner arm conditioning the polishing pad below the substrate attachment/detachment means; and a polishing head attaching a substrate from the substrate attachment/detachment device, moving horizontally, and then descending vertically to polish the substrate at the polishing position. The distance by which the polishing head descends is characterized in that it is greater than a distance obtained by adding the height of the pad conditioner arm and the height of the substrate attachment/detachment device.

A substrate polishing unit according to an embodiment of the present invention comprises: a polishing platen having a polishing pad attached thereto to provide a polishing surface on which a substrate is polished; a housing disposed on an upper portion of the polishing surface; a polishing head assembly supported by the housing; a substrate attachment/detachment device disposed between the housing and the polishing surface; and a pad conditioner arm having a pad conditioner disposed between the substrate attachment/detachment device and the polishing surface to condition the polishing pad. The polishing head assembly comprises a polishing head vertical shaft, a rotary union supplying fluid to the polishing head vertical shaft, a polishing head rotation driving device rotating the polishing head vertical shaft, and a polishing head coupled to a lower end of the polishing head vertical shaft. The height of the housing is characterized in that it is greater than the sum of the lengths of the rotary union, the vertical shaft of the polishing head, the height of the substrate attachment/detachment means, and the height of the pad conditioner arm.

A substrate polishing unit according to an embodiment of the present invention includes a housing that rotates around a first rotational axis, at least one through hole disposed on a bottom surface of the housing, and at least one polishing head assembly disposed inside the housing. The at least one polishing head assembly includes at least one vertical shaft that protrudes downward from the housing through the at least one through hole, and at least one polishing head that is fastened to a lower end of the at least one vertical shaft. The housing includes an upper housing, a lower housing that is arranged to be reduced from the upper housing so as to be closer to the first rotational axis, and a step portion that is arranged so as to face the ground at a boundary between the upper housing and the lower housing. The step portion is fixed to a rotational portion of a turntable bearing and supported so as to be rotatable around the first rotational axis.

A substrate polishing unit according to an embodiment of the present invention includes: a polishing platen having a polishing pad attached thereto to provide a polishing surface on which a substrate is polished; a substrate polishing position disposed on the polishing surface; a substrate attachment/detachment device disposed above the polishing surface; at least one polishing head configured to attach a substrate from the substrate attachment/detachment device and move it to the polishing position, and to move the substrate back to the substrate attachment/detachment device to be detached after polishing the substrate on the polishing surface; and a blocking plate disposed between the substrate attachment/detachment device and the polishing pad and configured to block particles or washing water falling from the substrate attachment/detachment device to the polishing pad.

In the above embodiment, the blocking plate may include a first blocking plate and a vertical blocking plate extending upward from the first blocking plate. The vertical blocking plate is positioned to at least partially shield a space between the substrate detachment device and the substrate polishing position.

In the above embodiment, the blocking plate may include a second blocking plate extending toward the upper portion of the polishing position. The first blocking plate is disposed in a space between the substrate detachment device and the polishing platen, the second blocking plate is disposed above the polishing position at a higher position than the first blocking plate, and the vertical blocking plate shields the space between the first and second blocking plates. A through hole is disposed in the second blocking plate, and the polishing head rises from the polishing position through the through hole through the upper space of the second blocking plate and then moves to the substrate detachment device through the upper space of the blocking plate.

In the above embodiment, filtered clean air can be supplied to the space between the second blocking plate and the polishing pad.

A substrate polishing unit according to an embodiment of the present invention includes: a polishing platen having a polishing pad attached thereto to provide a polishing surface on which a substrate is polished; a substrate attachment/detachment device reciprocating between first and second substrate attachment/detachment positions; a first polishing head which vertically moves between a first polishing position and the first substrate attachment/detachment position, polishes a substrate on the polishing surface at the first polishing position, and transfers a substrate to/from the substrate attachment/detachment device at the first substrate attachment/detachment position; a second polishing head which vertically moves between a second polishing position and the second substrate attachment/detachment position, polishes a substrate on the polishing surface at the second polishing position, and transfers a substrate to/from the substrate attachment/detachment device at the second substrate attachment/detachment position; and a pad conditioner arm which conditions the polishing pads under the substrate attachment/detachment device.

The above substrate attachment/detachment device reciprocates by rotating between the first and second substrate attachment/detachment positions about a rotation axis. The rotation axis may be coincident with the polishing plate.

The above substrate detachment device includes a nozzle for spraying washing water toward the polishing head and a drain for draining the washing water, and the drain is configured to move together with the substrate detachment device and to inject washing water into a space between the polishing plate and a fence arranged around the polishing plate.

The substrate polishing unit includes an abrasive supply arm for supplying abrasive to first and second abrasive supply positions, the abrasive supply arm being positioned opposite the pad conditioner arm with an imaginary plane including the first and second substrate polishing positions interposed therebetween.

The above abrasive supply arm is composed of first and second abrasive supply arms which are arranged on opposite sides with an imaginary plane including a rotation axis of the pad conditioner arm and a rotation axis of the polishing platen therebetween, the first abrasive supply arm supplies the abrasive to a first abrasive supply location around the first polishing head, and the second abrasive supply arm supplies the abrasive to a second abrasive supply location around the second polishing head.

The rotational axis of the pad conditioner arm can be configured to move along the linear guide rail to first and second conditioning positions. The pad conditioner arm conditions the polishing pad beneath the first polishing head and the substrate detachment device in the first conditioning position, and conditions the polishing pad beneath the second polishing head and the substrate detachment device in the second conditioning position.

In the above embodiment, the pad conditioner cleaning station is arranged near the guide rail, and the rotational axis of the pad conditioner arm is moved near the first conditioning position, and then the pad conditioner arm is rotated to move the pad conditioner hanging at its end to the pad conditioner cleaning station.

The substrate polishing unit performs first and second polishing modes. In the first polishing mode, the first polishing head receives the substrate from the base of the substrate attachment/detachment device at the first substrate attachment/detachment position, the second polishing head polishes the substrate at the second polishing position, the pad conditioner arm conditions the polishing pad under the first polishing head and the substrate attachment/detachment device base, and the abrasive supply arm supplies the abrasive to the second abrasive supply position. In the second polishing mode, the second polishing head receives the substrate from the base of the substrate attachment/detachment device at the second substrate attachment/detachment position, the first polishing head polishes the substrate at the first polishing position, and the pad conditioner arm polishes the substrate at the second polishing position.

The polishing pad is conditioned beneath the head and the substrate detachment device base, and the abrasive supply arm supplies abrasive to a first abrasive supply position.

In the above embodiment, the abrasive supply arm is composed of first and second abrasive supply arms, wherein the first abrasive supply arm supplies the abrasive to the first abrasive supply position, and the second abrasive supply arm supplies the abrasive to the second abrasive supply position.

In the above embodiment, the polishing platen rotates in the first direction in the first polishing mode, and rotates in the opposite direction to the first direction in the second polishing mode.

In the above embodiment, the pad conditioner arm may be composed of first and second pad conditioner arms. The rotational axis of the first pad conditioner arm is disposed outside the polishing platen near the first polishing head near an imaginary plane A including the first and second substrate attachment/detachment positions, and the rotational axis of the second pad conditioner arm is disposed outside the polishing platen near the second polishing head near the plane A. The first pad conditioner arm pivotally rotates underneath the substrate attachment/detachment device about the rotational axis of the first pad conditioner arm to condition the polishing pad while the first polishing head is disposed on the substrate attachment/detachment device and the second polishing head polishes the substrate. The second pad conditioner arm pivotally rotates below the substrate detachment device about the rotational axis of the second pad conditioner arm to condition the polishing pad while the second polishing head is positioned on the substrate detachment device and the first polishing head polishes the substrate.

In the above embodiment, the substrate polishing unit may include first and second abrasive supply arms, wherein the first abrasive supply arm supplies abrasive to a first abrasive supply position while the first polishing head polishes the substrate, and the second abrasive supply arm supplies abrasive to a second abrasive supply position while the second polishing head polishes the substrate. The first and second abrasive supply positions are arranged opposite each other with the rotational axis of the polishing platen interposed therebetween. The rotational axis of the first abrasive supply arm may be arranged near the rotational axis of the first pad conditioner arm, and the rotational axis of the second abrasive supply arm may be arranged near the rotational axis of the second pad conditioner arm.

The present invention provides a semiconductor substrate polishing device with a reduced footprint.

The present invention provides a substrate polishing device in which a pad conditioner arm and an abrasive supply arm are positioned in a position that is easy to maintain.

The present invention can reduce the manufacturing cost of a substrate polishing device by arranging multiple identical substrate polishing units by only changing their orientations.

The present invention provides a means for protecting a polishing pad from contaminants.

The present invention provides a substrate polishing device in which components operate smoothly without colliding with each other in a limited space.

FIG. 1 is a side view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining the configuration and operation of the substrate polishing unit.

FIGS. 2(a) and 2(b) are side views of a substrate polishing unit according to an embodiment of the present invention, and are drawings for explaining first and second polishing modes of the substrate polishing unit.

FIG. 3 is a side view of a substrate polishing device according to an embodiment of the present invention, and is a drawing for explaining how a substrate transfer means transfers a substrate to a substrate detachment device.

FIG. 4 is a plan view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining a substrate attachment/detachment position.

FIG. 5 is a plan view of a substrate polishing unit according to an embodiment of the invention, illustrating the positions of a pad conditioner arm and an abrasive supply arm.

FIG. 6 is a side view of a substrate polishing module according to an embodiment of the present invention, and is a drawing for explaining the configuration of the substrate polishing module.

Figures 7(a) to 7(c) are plan views sequentially showing the operation of a substrate polishing module according to an embodiment of the present invention.

FIG. 8 is a plan view of a substrate polishing module having a blocking plate according to an embodiment of the present invention.

FIG. 9(a) is a plan view of a substrate polishing unit according to an embodiment of the present invention, and FIG. 9(b) is a side view thereof.

FIG. 10(a) is a cross-sectional view of a polishing head assembly according to an embodiment of the present invention, and FIG. 10(b) is a three-dimensional view of the substrate attachment/detachment device illustrated in FIG. 10(a).

FIG. 11 is a plan view of a substrate polishing unit according to an embodiment of the present invention.

FIG. 12 is a side view of a substrate polishing unit according to an embodiment of the present invention.

FIG. 13 is a plan view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining the positions of a pad conditioner arm and an abrasive supply arm that are positioned at different positions from those in FIG. 5.

FIG. 14(a) is a vertical cross-sectional view of a substrate detachment/attachment device according to an embodiment of the present invention, and FIG. 14(b) is a planar cut-away view of the substrate detachment/attachment device.

FIGS. 15(a) to 15(f) are side cross-sectional views sequentially showing a process of attaching a substrate to a polishing head by a substrate detachment/attachment device according to an embodiment of the present invention.

FIG. 16 is a plan view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining a substrate attachment/detachment device.

Fig. 17 is a side view of the substrate polishing unit of Fig. 16.

FIG. 18 is a plan view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining the positions of a pad conditioner arm, a substrate detachment device, and an abrasive supply arm.

FIG. 19 is a plan view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining the positions of a pad conditioner arm, a substrate detachment device, and an abrasive supply arm that are arranged at different positions from those in FIG. 5.

Fig. 20 is a side view of the substrate polishing unit of Fig. 19.

Figure 21 is a plan view of a substrate polishing device according to an embodiment of the present invention.

FIG. 22 is a plan view of a substrate polishing unit according to an embodiment of the present invention, and is a drawing for explaining the positions of a pad conditioner arm, a substrate detachment device, and an abrasive supply arm that are arranged at different positions from those in FIG. 19.

Figure 23 is a side view of the substrate polishing unit of Figure 22.

FIG. 24 is a side cross-sectional view of a substrate polishing unit according to an embodiment of the present invention.

Figure 25 is a three-dimensional drawing of the substrate polishing unit of Figure 24.

FIG. 26 is a plan view of a substrate polishing unit having a blocking plate according to an embodiment of the present invention.

Figure 27 is a side cross-sectional view of the substrate polishing unit of Figure 26.

FIG. 28 is a side cross-sectional view of a substrate polishing unit according to an embodiment of the present invention.

FIG. 29 is a side cross-sectional view of a substrate polishing unit according to an embodiment of the present invention.

FIGS. 30(a) and 30(b) are plan views of a substrate polishing unit according to an embodiment of the present invention.

Figures 31(a) and 31(b) are plan views of a substrate polishing unit according to an embodiment of the present invention.

FIG. 32 is a plan view of a substrate polishing unit according to an embodiment of the present invention.

The following examples primarily refer to Korean patent applications No. 10-2023-0120760, which claims priority to this application, but may also refer to other Korean patent applications.

Referring to FIG. 1, a substrate polishing unit (500) according to an embodiment of the present invention will be described. FIG. 1 is a side view of the substrate polishing unit (500) including a cross-sectional view. The substrate polishing unit (500) includes a frame (140), a polishing head driving unit (1), a substrate attachment/detachment device (50), and a polishing platen (10). The substrate polishing unit (500) includes a substrate attachment/detachment position (30) and a substrate polishing position (32). The substrate attachment/detachment position (30) is a position where the polishing heads (20a, 20b) and the substrate attachment/detachment device (50) give/receive a substrate. The substrate polishing position (32) is a position of the polishing heads (20a, 20b) when the polishing heads (20a, 20b) polish a substrate (W) on a polishing pad (11).

The polishing head drive unit (1) includes a housing (100) and at least one polishing head assembly, i.e., first and second polishing head assemblies (110a, 110b). The housing (100) is a structure that supports the first and second polishing head assemblies (110a, 110b). The housing (100) rotates about a rotation axis (2).

The substrate attachment/detachment device (50) is a device that attaches a substrate (W) to a polishing head (20a, 20b) and receives a substrate (W) detached from the polishing head (20a, 20b), and is located between the lower portion of the housing (100) and the polishing plate (10). The polishing plate (10) rotates around a vertical rotation axis (12), and a polishing pad (11) is attached to the upper surface thereof to provide a polishing surface on which the substrate is polished.

The substrate (W) is placed on a base (54) of a substrate attachment/detachment device (50), and the base (54) is connected to a vertical driving device (53) via a vertical shaft (52). The vertical driving device (53) moves the vertical shaft (52) in a vertical direction so that the substrate (W) on the substrate attachment/detachment device base (54) can be attached to the polishing head (20a, 20b). The vertical shaft (52) of the substrate attachment/detachment device (50) can be placed in a space between a polishing platen (10) and a fence (14) arranged around it. The fence (14) is a mechanism arranged around the polishing platen (10) to prevent an abrasive from splashing out of the fence (14) from the polishing platen (10).

Inside the housing (100), first and second polishing head assemblies (110a, 110b) are arranged. The polishing head assemblies (110a, 110b) include polishing heads (20a, 20b), polishing head shafts (21a, 21b), and rotary driving devices (22a, 22b). The rotary driving devices (22a, 22b) rotate the polishing head shafts (21a, 21b), thereby rotating the polishing heads (20a, 20b) about a vertical rotation axis (27a, 27b). Two through holes (104a, 104b) are arranged at the lower portion of the housing (100). The polishing head shafts (21a, 21b) of the first and second polishing head assemblies (110a, 110b) extend below the housing (100) through respective through holes (104a, 104b). Each polishing head (20a, 20b) is fastened to the lower end of the polishing head shafts (21a, 21b).

The polishing head drive unit (1) is configured to reciprocate the polishing heads (20a, 20b) between the substrate attachment/detachment position (30) and the substrate polishing position (32). This reciprocating movement is performed by horizontal rotation (20h) and vertical movement (20v) of the polishing heads (20a, 20b). A housing (100) rotation drive device (114) is used for the horizontal rotation movement (20h) of the polishing heads (20a, 20b). A housing support (112) is connected to the upper surface of the housing (100). The rotation drive device (114) rotates the housing support (112) around the housing rotation axis (2), thereby allowing the first and second polishing heads (20a, 20b) supported by the housing (100) to horizontally move around the housing rotation axis (2).

For vertical (20v) movement of the polishing head (20a, 20b), the substrate polishing unit (500) includes a servo motor (23a, 23b), a ball screw (24a, 24b), and a nut screw (25a, 25b). The nut screw (25a, 25b) is fixed to a rotation driving device (22a, 22b) of the polishing head assembly (110a, 110b), and when the servo motor (23a, 23b) is driven, the ball screw (24a, 24b) rotates, thereby vertically moving (20v) the polishing head assembly (110 a, 110b) coupled to the nut screw (25a, 25b).

The polishing head (20a, 20b) can be designed to enable a horizontal linear reciprocating (20s, oscillation) motion while polishing the substrate at the substrate polishing position (32). The lower end of the ball screw (24a, 24b) is fixed (26a, 26b) to a horizontal plate (18a, 18b), and the horizontal plate (18a, 18b) is connected via a guide block (17) to enable horizontal movement on a linear guide rail (19a, 19b) located below. The upper end of the ball screw (24a, 24b) is connected via a guide block (17) to a linear guide rail (16a, 16b) fixed to the upper part of the housing (100) to enable horizontal movement. The polishing head shaft (21a, 21b) is fastened to the horizontal plate (18a, 18b) to enable vertical movement and rotational movement. By linearly reciprocating the horizontal plate (18a, 18b) with the linear driving device (28a, 28b), the polishing head (20a, 20b) can be linearly reciprocated.

The substrate polishing unit (500) includes a pad conditioner arm (70) that conditions a polishing pad (11) between the substrate detachment device (50) and the polishing platen (10). The pad conditioner arm (70) reciprocates over the polishing pad (11) and conditions the polishing pad (11) with a pad conditioner (74) hanging from the end.

In Fig. 1, a first polishing head (20a) is placed at a substrate attachment/detachment position (30), and a second polishing head (20b) is placed at a substrate polishing position (32). The substrate attachment/detachment position (30) is placed on the rotation axis (27a) of the first polishing head (20a) between the polishing platen (10) and the housing (100). The substrate polishing position (32) is placed on the rotation axis (27b) of the second polishing head (20b) adjacent to the polishing pad (11). This state corresponds to the first mode of Fig. 2(a).

Referring to FIG. 2, the first and second mode polishing processes according to the embodiment of the present invention will be described. FIG. 2(a) and 2(b) are side cross-sectional views showing the first mode and the second mode of the substrate polishing unit (500), respectively. In the first mode of FIG. 2(a), the first polishing head (20a) is disposed at the substrate attachment/detachment position (30) so that the first polishing head (20a) transfers the substrate (W) to and from the base (54) of the substrate attachment/detachment device (50), and the second polishing head (20b) is disposed at the substrate polishing position (32) so as to polish the substrate (W). The rotational axis (27a) of the first polishing head (20a) passes through the substrate attachment/detachment position (30), and the rotational axis (27b) of the second polishing head (20b) passes through the polishing position (32). The pad conditioner arm (70) conditions the polishing pad (11) beneath the substrate detachment device (50).

In the second mode of Fig. 2(b), the second polishing head (20b) is positioned at the substrate attachment/detachment position (30) to transfer the substrate (W) between the second polishing head (20b) and the base (54) of the substrate attachment/detachment device (50), and the first polishing head (20a) is positioned at the substrate polishing position (32) to polish the substrate (W). The rotational axis (27b) of the second polishing head (20b) is positioned to penetrate the substrate attachment/detachment position (30), and the rotational axis (27a) of the first polishing head (20a) is positioned to penetrate the polishing position (32). The pad conditioner arm (70) conditions the polishing pad (11) under the substrate attachment/detachment device (50).

A change from the first mode to the second mode can be performed by lifting the second polishing head (20b) from the polishing position (32) to at least the height of the substrate attachment/detachment position (30), rotating the first and second polishing heads (20a, 20b) 180 degrees around the housing rotation axis (2), and then lowering the first polishing head (20a) to the substrate polishing position (32).

During the first and second mode polishing processes, the pad conditioner (74) can condition the surface of the polishing pad (11) attached on the polishing plate (10) at the bottom of the base (54) of the substrate detachment device (50).

FIG. 3 is another side cross-sectional view of the substrate polishing unit (500). Referring to FIG. 3, when the substrate handler (42) of the substrate transport means (40) transfers the substrate (W) to and from the base (54) of the substrate detachment device (50), the polishing head (20a) may be raised to a substrate exchange position (30') higher than the substrate detachment position (30). The substrate handler (42) transfers the base (54) and the substrate between the polishing head (20a) located at the substrate exchange position (30') and the base (54) of the substrate detachment device (50). Instead of the polishing head (20a) being raised to the substrate exchange position (30'), the base (54) of the substrate detachment device (50) may be lowered to provide a space for the substrate handler (42) to enter and exit between the polishing head (20a) and the base (54) of the substrate detachment device (50).

Referring to FIG. 1, the substrate polishing unit (500) may further include a polishing head cleaning unit (60). The polishing head cleaning unit (60) is configured to surround the base (54) of the substrate detachment device (50). The polishing head cleaning unit (60) includes a side wall (62) extending upward from an edge of the base (61). A drain (66) is arranged on the bottom surface of the base (61) of the polishing head cleaning unit (60). The drain (66) is arranged to face the space between the fence (14) and the polishing platen (10). A vertical shaft (52) of the substrate detachment device (50) may be arranged inside the drain (66). The base (61) of the polishing head cleaning unit (60) may also be fixed by being connected (65) to a frame (140) outside the polishing platen (10). The base (54) of the substrate detachment device (50) moves vertically independently of the polishing head cleaning unit (60) and transfers the substrate to and from the polishing head (20a, 20b).

The polishing head cleaning unit (60) further includes a side wall (62) extending around the polishing head (20a, 20b). An ultra-pure water supply nozzle (64) is arranged on the side wall (62). The polishing head (20) can be cleaned by spraying ultra-pure water through the ultra-pure water supply nozzle (64) while the polishing head (20) remains on the substrate detachment device (50).

Referring to FIG. 4, the substrate attachment/detachment position (30) and the substrate polishing position (32) according to an embodiment of the present invention are described. FIG. 4 shows the position of the substrate (W) when the first and second polishing heads (20a, 20b) are placed at the substrate polishing position (32) and the substrate detachment position (30), respectively. As described with reference to FIGS. 1 and 2, the substrate polishing position (32) and the substrate detachment position (30) are located where the rotation axes (27a, 27b) of the polishing heads (20a, 20b) pass through. The center of the substrate (W) attached to the polishing heads (20a, 20b) is also located on the rotation axes (27a, 27b).

In the plan view of FIG. 4, the substrate polishing position (32) and the substrate attachment/detachment position (30) are arranged to face each other with the rotation axis (12) of the polishing platen (10) interposed therebetween. The rotation axis (27a) of the first polishing head (20a), the rotation axis (12) of the polishing platen (10), the rotation axis (2) of the housing (100, not shown in FIG. 4), and the rotation axis (27b) of the second polishing head (20b) may be arranged in the listed order. According to one embodiment, the rotation axis (2) of the housing (100) may be arranged to coincide with the rotation axis (12) of the polishing platen (10). According to another embodiment, the rotation axis (2) of the housing (100) may be arranged around the rotation axis (12) of the polishing platen (10) so that the distance from the rotation axis (12) of the polishing platen (10) is x/2 or less. The rotation axis (2) of the housing (100) may be placed within a circle (38) having a radius of x/2. Here, x is the shortest distance between the polishing platen (10) and the fence (14). x may be the shortest distance between the polishing platen (10) and the fence (14) at a point closest to the substrate attachment/detachment position (30).

According to one embodiment, the substrate attachment/detachment location (30) may be positioned so that the substrate (W) does not fall out of the fence (14) when positioned at the substrate attachment/detachment location (30). Additionally, the substrate (W) may be positioned so that the center (27b) of the substrate (W) is positioned inside the polishing platen (10) when positioned at the substrate attachment/detachment location (30).

Referring to FIG. 5, the arrangement of the pad conditioner arm (70) and the abrasive supply arm (80, slurry supply arm) of the substrate polishing unit (500) according to an embodiment of the present invention will be described using virtual planes A, B, C, D, E, F, G, and K. In the plane drawing of FIG. 5, planes A, B, C, D, E, F, G, and K are represented as straight lines, and the pad conditioner arm (70) and the abrasive supply arm (80) are arranged at their respective parking positions.

Surface A includes a substrate attachment/detachment position (30), a substrate polishing position (32), and a rotation axis (12) of the polishing platen (10), and is a surface perpendicular to the polishing platen (10). Surfaces B, C, D, E, F, G, and K are all perpendicular to surface A, and surface B is a plane passing through the rotation axis (12) of the polishing platen (10), surface C is a plane passing through the substrate polishing position (32), and surface G is a plane passing through the substrate attachment/detachment position (30). Surface D is a plane including a tangent line close to the substrate polishing position (32) among two tangent lines of the polishing platen (10), and surface F is a plane including a tangent line close to the substrate attachment/detachment position (30). Surface E is a plane located in the middle of surfaces C and D. Surface K is a surface located opposite surface C with surface D interposed therebetween.

The pad conditioner arm (70) and the abrasive supply arm (80) are positioned opposite each other with surface A between them. The rotational axis (72) of the pad conditioner arm (70) and the rotational axis (82) of the abrasive supply arm (80) are positioned opposite each other with surface A between surface C and surface K. The rotational axis (72) of the pad conditioner arm (70) is positioned outside the polishing platen (10) between surface C and surface D. The rotational axis (82) of the abrasive supply arm (80) can be positioned between surface E and surface K or between surface E and surface D. The opposite end (70') of the pad conditioner arm (70) is positioned between surface F and surface G, and the opposite end (80') of the abrasive supply arm (80) is positioned between surface C and surface B.

Referring to FIGS. 6 and 7, a substrate polishing module (600) according to an embodiment of the present invention is described. FIG. 6 is a side cross-sectional view of the substrate polishing module (600), and FIG. 7 is a plan view sequentially showing a process of processing a substrate in the substrate polishing module (600).

Referring to FIG. 6, the substrate polishing module (600) includes two substrate polishing units (500a, 500b), but the two substrate polishing units (500a, 500b) share one substrate attachment/detachment device (50). The substrate attachment/detachment device (50) is horizontally movably fastened (51) to a linear guide rail (152). The linear guide rail (152) is arranged parallel to a straight line connecting a substrate attachment/detachment position (30) of a first substrate polishing unit (500a) and a substrate attachment/detachment position (30) of a second substrate polishing unit (500b).

The substrate attachment/detachment device (50) includes a substrate support plate (156) disposed on a base (54) of the substrate attachment/detachment device (50), and a fluid chamber (158) is provided between the base (54) of the substrate attachment/detachment device (50) and the substrate support plate (156). When a fluid such as a gas or liquid is injected into the fluid chamber (158), the substrate support plate (156) rises, and conversely, when a fluid is removed from the fluid chamber (158), the substrate support plate (156) descends. When attaching a substrate to a polishing head (20a, 20b), the substrate support plate (156) can be lifted by injecting a fluid into the fluid chamber (158) to transfer the substrate into the retainer ring (29) of the polishing head (20a, 20b).

Referring to FIG. 7(a), the substrate handler (42) can transfer the substrate (W) to the substrate detachment device (50) when the substrate detachment device (50) is positioned between the substrate detachment positions (30) of the substrate polishing units (500a, 500b). The substrate detachment device (50), which has received the substrate from the substrate handler (42) in FIG. 7(a), moves to the substrate detachment position (30) of the first polishing unit (500a) as in FIG. 7(b) and transfers the substrate to the first polishing head (20a). The first polishing head (20a), which has received the substrate, rotates horizontally about the housing rotation axis (2) to move to the substrate polishing position (32), and then descends toward the polishing pad (11) to polish the substrate (W) on the polishing pad (11). While the first polishing head (20a) polishes the substrate, the second polishing head (20b) receives a new substrate from the substrate attachment/detachment device (50) at the substrate attachment/detachment position (30).

In Fig. 7(a), the substrate detachment device (50) that receives the substrate from the substrate handler (42) may move to the substrate detachment position (30) of the second polishing unit (500b) as in Fig. 7(c) and transfer the substrate to the first polishing head (20a). The first polishing head (20a) that receives the substrate rotates horizontally around the housing rotation axis (2) to move to the substrate polishing position (32), and then descends toward the polishing pad (11) to polish the substrate (W) on the polishing pad (11). While the first polishing head (20a) is polishing the substrate, the second polishing head (20b) receives a new substrate from the substrate detachment device (50) at the substrate detachment position (30).

Referring to FIG. 8, a shield plate (220) may be installed between the substrate detachment device (50) and the polishing plates (10) of the first and second polishing units (500a, 500b). FIG. 8 is a plan view of a substrate polishing module (600) including a shield plate (220). The shield plate (220) is positioned to spatially separate the lower portion of the polishing head (20a, 20b) positioned at the substrate detachment position (30) and the polishing plate (10). The shield plate (220) is positioned so as not to invade the lower portion of the polishing head (20a, 20b) positioned at the substrate polishing position (32). For reference, the term 'blocking plate (220)' was used in Korean Patent Application No. 10-2023-0133909, which claims priority in the present application, as a 'fence (220)', and in Korean Patent Application No. 10-2024-0110148, as a 'shielding plate (30)'. In this application, the terms were unified and replaced with 'blocking plate (220)' to avoid confusion in terms.

The substrate exchange between the polishing head (20a, 20b) and the substrate detachment device (50) is performed on the upper part of the blocking plate (220). The horizontal movement of the substrate detachment device (50) is performed on the upper part of the blocking plate (220). The blocking plate (220) is used to block abrasive residue or particles, etc., from falling onto the polishing plate (10) from the substrate detachment device (50) and the polishing head (20a or 20b) disposed at the substrate detachment position (30). The linear guide rail (152) may also be disposed on the upper part of the blocking plate (220).

The following examples primarily refer to Korean patent applications No. 10-2023-0133909, which claims priority to this application, but may also refer to other Korean patent applications.

Referring to FIGS. 9(a) and 9(b), a substrate polishing unit (500) according to an embodiment of the present invention will be described. FIG. 9(a) is a plan view of the substrate polishing unit (500), and FIG. 9(b) is a side view. Referring to FIG. 9(a), the substrate polishing unit (500) includes a polishing platen (10), at least one polishing head, i.e., first and second polishing heads (20a, 20b), a substrate detachment/attachment device (50), a pad conditioner arm (70), and an abrasive supply means (180, abrasive supply arm).

Referring to Fig. 9(b), a substrate attachment/detachment position (30), a substrate attachment/detachment standby position (30"), a polishing position (32), and a polishing standby position (32") are arranged above a polishing platen (10). The polishing position (32) is a position where the polishing heads (20a, 20b) polish the substrate on a polishing pad (11) attached to the polishing platen (10), and the polishing standby position (32") is a position arranged above the polishing position (32). The substrate attachment/detachment position (30) is a position where the first and second polishing heads (20a, 20b) exchange substrates with the substrate attachment/detachment device (50), and the substrate attachment/detachment standby position (30") is a position arranged above the substrate attachment/detachment position (30).

The substrate detachment standby position (30") and the polishing standby position (32") are arranged on opposite sides with respect to the housing rotation axis (2) disposed between the first and second polishing heads (20a, 20b). The first and second polishing heads (20a, 20b) can pivotally rotate about the housing rotation axis (2) to move between the substrate detachment standby position (30") and the polishing standby position (32"). The first and second polishing heads (20a, 20b) reciprocate between the substrate detachment standby position (30), the polishing standby position (30"), and the polishing position (32), and at the substrate detachment position (30), the substrate is transferred to and from the substrate detachment device (50), and at the polishing position (32), the substrate is polished on the polishing pad (11).

Referring to FIG. 9(a), the substrate handler (42) of the substrate transport means enters the space between the polishing head (20a or 20b) and the substrate detachment device (50) arranged at the substrate detachment standby position (30") to transfer the substrate to and from the substrate detachment device (50). The pad conditioner arm (70) conditions the polishing pad (11) attached on the polishing platen (10) while pivotally rotating (79) at the bottom of the substrate detachment device (50) about the pivot rotation axis (72).

The abrasive supply means (180) is suspended and supported from the substrate detachment device (50) and supplies the abrasive around the polishing head (20a or 20b) positioned at the polishing position (32). The abrasive supply means (180) may be configured in an arc shape that surrounds the circumference of the polishing head (20a, 20b). The abrasive supply means (180) is positioned so as to face the opposite side of the pad conditioner arm (70) from the substrate detachment device (50) so as not to interfere with the pad conditioner arm (70) that pivotally rotates (79).

Referring to FIGS. 10(a) and 10(b), a process in which a substrate handler (42) transfers a substrate (W) to a substrate detachment device (50) will be described. FIG. 10(a) is a vertical cross-sectional view of a first polishing head assembly (110a) and a substrate detachment device (50), and FIG. 10(b) is a three-dimensional view of the substrate detachment device (50). FIG. 10(a) illustrates a state in which a polishing head (20a) is positioned at a substrate detachment standby position (30") and a substrate detachment device (50) is positioned underneath the polishing head (20a), and FIG. 10(b) illustrates a state in which a substrate handler (42) transfers a substrate (W) to the substrate detachment device (50).

The substrate attachment/detachment device (50) includes an upwardly extended sidewall (62). An opening (69) is arranged in the sidewall (62) through which a substrate handler (42) can enter. The width of the opening (69) is configured to be larger than the width of the substrate handler (42), and may also be configured to be larger than the diameter of the substrate (W). The substrate handler (42) and the substrate (W) can enter and exit the substrate attachment/detachment device (50) through the opening (69).

The following examples primarily refer to Korean patent applications claiming priority from this application, including application numbers 10-2023-0133909 and 10-2023-0124412, although other Korean patent applications may also be referenced.

Referring to FIGS. 11 and 12, a substrate polishing unit (500) according to an embodiment of the present invention will be described. FIG. 11 is a plan view of the substrate polishing unit (500). The first and second polishing head assemblies (110a, 110b) are rotatably fastened to the annular track (130) via respective guide blocks (414a, 414b). The first and second polishing head assemblies (110a, 110b) can change their respective positions by rotating along the housing rotation axis (2) of the annular track (130) while being suspended from the annular track (130).

FIG. 12 is a side view of the substrate polishing unit (500) of FIG. 11 as viewed from the opposite side of the pad conditioner arm (70). Referring to FIG. 12, the first and second polishing head assemblies (110a, 110b) are fastened to the upper support plate (168), and the upper support plate (168) is fastened to a circular track (130) fixed to the upper frame (140) through respective guide blocks (414a, 414b). On the underside of the upper frame (140), a magnet array (452) is arranged along the periphery of the annular track (130), and an electromagnet (450, 450") is arranged on the upper surface of the upper support plate (168). By controlling the alternating current supplied to the electromagnets (450, 450"), the first and second polishing head assemblies (110a, 110b) suspended from the upper support plate (168) can be rotated along the annular track (130).

In another embodiment, the first and second polishing head assemblies (110a, 110b) may be fastened to the annular track (130) via respective guide blocks (414a, 414b) without the upper support plate (168). In this embodiment, the first and second polishing head assemblies (110a, 110b) may be configured to independently pivot on the annular track (130) by respective electromagnets (450, 450").

Referring to FIG. 12, the abrasive supply channel (184) can penetrate the interior of the substrate detachment device (50) and be connected to the abrasive supply means (180). The substrate detachment standby position (30") is arranged above the substrate detachment device (50), and the substrate detachment device (50) is arranged above the pad conditioner arm (70). Accordingly, the distance (30h) from the abrasive pad (11) to the substrate detachment standby position (30") is set to be greater than the sum of the height (70h) of the pad conditioner arm and the height (50h) of the substrate detachment device.

Referring to FIG. 13, the arrangement of the pad conditioner arm (70) according to an embodiment of the present invention will be described. FIG. 13 is a plan view of the substrate polishing unit (500). The pivot rotation axis (72) of the pad conditioner arm (70) is arranged adjacent to the polishing platen (10) between planes B and C. Plane B is a virtual plane that is perpendicular to plane A, which includes the substrate polishing position (32) and the substrate attachment/detachment position (30), and includes the center (12) of the polishing platen (10). Plane C is a plane that is parallel to plane B and includes the polishing position (32).

A pad conditioner (74) is hung at the end of the pad conditioner arm (70). The pad conditioner arm (70) pivotally rotates (79) around the center (12) of the polishing platen (10) and the edge of the polishing platen (10), while the pad conditioner (74) conditions the polishing pad (11). A pad conditioner cleaning station (76) for cleaning the pad conditioner (74) is arranged around the polishing platen (10). The pad conditioner cleaning station (76) is arranged adjacent to the polishing platen (10) between the plane F and the plane G. The plane G is a plane that is parallel to the plane B and includes the substrate attachment/detachment location (30), and the plane F is a plane that is parallel to the plane B and closer to the plane G among the planes that contact the edge of the polishing platen (10).

The abrasive supply means (180) described with reference to FIG. 11 may be replaced with the abrasive supply arm (80) with reference to FIG. 13. The pivot rotation axis (82) of the abrasive supply arm (80) is disposed opposite the pad conditioner arm (70) with the abrasive platen (10) therebetween. The abrasive supply arm (80) is connected to a vertical shaft (86) and can rotate about the rotation axis (82). The pivot rotation axis (82) is disposed near the abrasive platen (10) near surface B. The vertical shaft (86) of the abrasive supply arm (80) may be disposed to span surface B. While not supplying the abrasive, the end of the abrasive supply arm (80) extends out of the abrasive platen (10) and moves to a parking position (80P) disposed near surface D. Surface D is a surface that is parallel to surface B and closer to surface C among the surfaces that contact the edge of the polishing platen (10). When the abrasive supply arm (80) is positioned at the parking position (80P), the end (80') of the abrasive supply arm (80) is positioned near surface D. When the abrasive supply arm (80) moves to the parking position (80P), the polishing head (20a) moves upward from the substrate polishing position (32), and the abrasive supply arm (80) passes under the polishing head (20a) and moves to the parking position (80P).

Referring to FIGS. 14(a) and 14(b), an embodiment of a substrate detachment device (50) is described. FIG. 14(a), which is a side cross-sectional view of the substrate detachment device (50), and FIG. 14(b), which is a planar cut view, show a state in which a substrate (W) and polishing heads (20a, 20b) are placed on the substrate detachment device (50).

Referring to FIG. 14(a), the substrate detachment/attachment device (50) may include a substrate support plate (156) and a first fluid chamber (158). The first fluid chamber (158) is provided between the base (54) and the substrate support plate (156). When a fluid such as a gas or a liquid is injected into the first fluid chamber (158), the substrate support plate (156) rises upward, and when the fluid is removed from the first fluid chamber (158), the substrate support plate (156) descends. When attaching the substrate to the polishing head (20a, 20b), the substrate can be transferred into the retainer ring (29) of the polishing head (20a or 20b) by pushing the substrate support plate (156) upward by injecting the fluid into the first fluid chamber (158).

Referring to FIGS. 14(a) and 14(b), the substrate detachment/attachment device (50) may include a substrate alignment means (160). The substrate alignment means (160) is annular and has an arc shape with a portion open (191, FIG. 14(b)). Pins (192a, 192b) are fixedly arranged to face each other at both ends of the open portion (191). A shaft (196) is fixed to the first pin (192a), a through hole is arranged in the second pin (192b), and the shaft (196) is connected to the linear driving device (190) through the through hole. The second pin (192b) is fixed to the base (54). A stop plate (194) is fixedly arranged to the base (54) near the first pin (192a). The stop plate (194) serves to limit the movement of the first pin (192a). When the linear driving device (190) extends the shaft (196), the first pin (192a) moves toward the stop plate (194) to spread the substrate alignment means (160), and conversely, when the shaft (196) is retracted, the first pin moves toward the second pin (192b) to retract the substrate alignment means (160).

Referring to FIG. 14(a), the substrate alignment means (160) includes an upper vertical surface (161) that contacts an outer peripheral surface of a retainer ring (29) of a polishing head (20a, 20b), an upper horizontal surface (162) that contacts an underside of the retainer ring (29), a lower vertical surface (163) that contacts an outer peripheral surface of a substrate (W), and a lower horizontal surface (164) that contacts an underside of the substrate (W). The substrate detachment/attachment device (50) may include an annular support plate (170) that supports the substrate alignment means (160). The substrate alignment means (160) may be freely deformed on the support plate (170) while being opened and closed by a linear driving device (190). An annular second fluid chamber (155) may be provided between the support plate (170) and the base (54). By injecting a fluid such as gas or liquid into the second fluid chamber (155), the substrate alignment means (160) on the support plate (170) can be moved vertically.

Referring to FIGS. 15(a) to 15(f), a method of attaching a substrate (W) to a polishing head (20a) using a substrate attaching/detaching device (50) is described. FIGS. 15(a) to 15(f) are side cross-sectional views of a substrate attaching/detaching device sequentially showing the process of attaching a substrate to a polishing head (20a) by the substrate attaching/detaching device (50).

In the step illustrated in Fig. 15(a), the substrate support plate (156) is raised while the substrate alignment means (160) is spread apart, and the substrate handler (42, not illustrated) of the substrate transfer means transfers the substrate (W) to be polished to the substrate support plate (156). In the step illustrated in Fig. 15(b), the substrate support plate (156) is lowered to place the substrate (W) on the lower horizontal surface (164) of the substrate alignment means (160). In the step illustrated in Fig. 15(c), the polishing head (20a) is lowered or the substrate attachment/detachment device (50) is raised so that the retainer ring (29) of the polishing head (20a) is placed inside the substrate alignment means (160). In the step illustrated in Fig. 15(d), the substrate alignment means (160) is folded so that the upper vertical surface (161) of the substrate alignment means (160) comes into contact with the retainer ring (29) of the polishing head (20a). At this time, the substrate (W) is automatically aligned to the inside of the retainer ring (29) by the lower vertical surface (163) of the substrate alignment means (160). In the step illustrated in Fig. 15(e), the substrate support plate (156) is raised so that the substrate (W) is attached to the bottom surface of the polishing head (20a) inside the retainer ring (29). In the step illustrated in Fig. 15(f), the substrate support plate (156) is lowered and the substrate alignment means (160) is spread. The polishing head (20a) is raised and comes out of the substrate attachment/detachment device (50).

The following examples primarily refer to Korean patent applications No. 10-2023-0141615, which claims priority to this application, but may also refer to other Korean patent applications.

Referring to FIGS. 16 and 17, a substrate polishing unit (500) according to an embodiment of the present invention will be described. FIG. 16 is a plan view of the substrate polishing unit (500), and FIG. 17 is a side cross-sectional view. The substrate polishing unit (500) includes a polishing platen (10), first and second polishing heads (20a, 20b), a substrate detachment device (50), a polishing head cleaning unit (60), a pad conditioner arm (70), and an abrasive supply arm (80). In FIG. 16, the first polishing head (20a) and the substrate (W) placed thereunder are partially cut away and illustrated.

Referring to Fig. 16, a substrate handler (42) of a substrate transfer means is arranged under the first polishing head (20a), and a substrate (W), a substrate detachment device base (54), a polishing head cleaning unit (60), a pad conditioner arm (70), and a polishing pad (11) are positioned in that order below the substrate. The substrate detachment device base (54) has a ring shape, and a pin (57) on which a substrate is placed is arranged on its upper surface. The substrate detachment device base (54) is connected to a vertical shaft (52) through an arm (261, arm), and the vertical shaft (52) moves vertically along a central axis (56).

Referring to FIGS. 16 and 17, the polishing head cleaning unit (60) is composed of first and second side walls (62, 68) erected upward from the cleaning base (61). The first side wall (62) is arranged toward the rotation axis (12) of the polishing platen (10), and the second side wall (68) is arranged toward the substrate handler (42). The first and second side walls (62, 68) have an arc shape, and the height of the second side wall (68) is designed to be lower than that of the first side wall (62). An ultrapure water injection port (64) is arranged in the first side wall (62) to spray ultrapure water toward the polishing heads (20a, 20b). The cleaning base (61) is provided with a drainage channel (265) extending along the lower portion of the arm (261) of the substrate detachment device (50) into the space between the polishing platen (10) and the fence (14). The cleaning water discharged from the polishing head cleaning unit (60) along the drain (265) is discharged into the space between the polishing plate (10) and the fence (14). The cleaning base (61) and the drain (265) are provided in a form that is inclined toward the fence (14) to ensure smooth drainage.

An abrasive supply means (180, abrasive supply arm) is connected to the polishing head cleaning unit (60). The abrasive supply means (180) extends from the polishing head cleaning unit (60) toward the polishing position (32) and is arranged to extend along the circumference of the polishing head (20a or 20b) being polished at the polishing position (32). The pad conditioner arm (70) pivotally rotates about a rotation axis (72) and conditions the polishing pad (11) under the polishing head cleaning unit (60) using a pad conditioner (not shown) suspended at the end.

The substrate attachment/detachment device base (54) is connected to a vertical movement driving means (53) through a vertical shaft (52) and moves vertically above the polishing head cleaning unit (60) to receive a substrate attached to or detached from the polishing head (20a, 20b). The substrate handler (42) passes through the upper part of the second side wall (68) of the polishing head cleaning unit (60) and enters the space between the polishing head (20a, 20b) and the substrate attachment/detachment device (50) to transfer the substrate to and from the substrate attachment/detachment device base (54).

When the substrate handler (42) transfers the substrate (W) to the substrate detachment device base (54), the substrate detachment device base (54) descends to receive the substrate (W), and when transferring the substrate (W) to the polishing head (20a), the substrate detachment device base (54) rises to attach the substrate (W) to the bottom of the polishing head (20a).

In Fig. 17, the first polishing head (20a) is positioned at the substrate detachment position (30) and the second polishing head (20b) is positioned at the substrate polishing position (32). When the first polishing head (20a) and the second polishing head (20b) change positions, the first and second polishing heads (20a, 20b) move by rotating along the annular track (130) while being raised higher than the first side wall (62) of the polishing head cleaning unit (60).

The following examples primarily refer to Korean patent applications Nos. 10-2023-0141588 and 10-2023-0154891, which claim priority in this application, but may also refer to other Korean patent applications.

FIG. 18 is a plan view of a substrate polishing unit (500) according to an embodiment of the present invention. The substrate detachment/attachment device (50) is positioned closer to the first surface (120A) among the four surfaces (120A, 120B, 120C, 120D) of the circumscribed tetrahedron (120) of the polishing platen (10). The circumscribed tetrahedron (120) of the polishing platen (10) is a virtual tetrahedron that includes the polishing platen (10) within it and is composed of four surfaces (120A, 120B, 120C, 120D) that contact the periphery of the polishing platen (10). The central axis of the tetrahedron is parallel to the rotation axis (12) of the polishing platen (10).

Hereinafter, the expression “space between the circumscribed tetrahedron (120) and the polishing platen (10)” means the space between an imaginary cylinder extending vertically from the surface of the polishing platen (10) and the circumscribed tetrahedron (120) composed of four faces (120A, 120B, 120C, 120D). In other words, it means the space between the polishing platen (10) indicated by a solid line and the circumscribed tetrahedron (120) indicated by a dotted line.

The substrate handler (42) approaches the substrate attachment/detachment device (50) through the first face (120A) of the virtual circumscribed tetrahedron (120) to transfer the substrate to/from the substrate attachment/detachment device (50). The first face (120A) is perpendicular to face A (described with reference to FIG. 13). The angle between the first face (120a) and face A can be 80 to 100 degrees.

The central axis (56) of the vertical shaft (52) of the substrate attachment/detachment device (50) is disposed near the first edge (121) between the first face (120A) and the second face (120B) adjacent to the first face (120A) among the four edges (121, 122, 123, 124) of the circumscribed tetrahedron (120). The vertical shaft (52) of the substrate attachment/detachment device (50) may be disposed at least partially in the space between the circumscribed tetrahedron (120) and the polishing platen (10) near the first edge (121). The central axis (56) of the vertical shaft (52) of the substrate attachment/detachment device (50) may be disposed in the space between the circumscribed tetrahedron (120) and the polishing platen (10) near the first edge (121).

The rotation axis (72) of the pad conditioner arm (70) is disposed near the second edge (122). The second edge (122) is an edge between the first surface (120A) and the fourth surface (120D). The fourth surface (120C) is a surface facing the second surface (120B). The vertical shaft (75) of the pad conditioner arm (70) can be disposed between the circumscribed tetrahedron (120) and the polishing platen (10) at least partly near the second edge (122). The rotation axis (72) of the vertical shaft (75) of the pad conditioner arm (70) can be disposed between the circumscribed tetrahedron (120) and the polishing platen (10) near the second edge (122).

The substrate polishing unit (500) may include a pad conditioner cleaning station (76) disposed above the polishing platen (10). The pad conditioner cleaning station (270) is disposed at least partially above the polishing platen (10). The pad conditioner cleaning station (76) is connected to an arm (274) and is fastened to a vertical shaft (276). The vertical shaft (276) is connected to a vertical driving means (278) and configured to vertically move along a vertical axis (272) between a first position (76a of FIG. 18) and a second position (not shown) higher therefrom. While the pad conditioner (74) is being cleaned at the pad conditioner cleaning station (76), the pad conditioner cleaning station (76) is positioned at the first position (76a), and while the pad conditioner (74) conditions the pad, the pad conditioner cleaning station (76) is raised and positioned at the second position to avoid collision with the pad conditioner arm (70). The pad conditioner arm (70) passes under the pad conditioner cleaning station (76) raised to the second position and conditions the polishing pad (11). The vertical shaft (276) of the pad conditioner cleaning station (76) is connected to a pivot rotation means (278) and pivotally rotates outside the polishing platen (10) about the vertical axis (272), thereby avoiding collision with the pad conditioner arm (70).

The vertical axis (272) of the pad conditioner cleaning station is disposed near the third edge (123) of the circumscribed tetrahedron (120). The third edge (123) is an edge that is disposed opposite the first edge (121) with the rotational axis (12) of the polishing platen (10) interposed therebetween. The vertical shaft (276) of the pad conditioner cleaning station (76) may be disposed at least partially in the space between the circumscribed tetrahedron (120) and the polishing platen (10) near the third edge (123). The vertical axis (272) of the vertical shaft (276) of the pad conditioner cleaning station (76) may also be disposed in the space between the circumscribed tetrahedron (120) and the polishing platen (10) near the third edge (123).

The process of moving the pad conditioner (74) to the pad conditioner cleaning station (76) is as follows. The pad conditioner arm (70) is placed (70a) between the first polishing head (20a) and the pad conditioner cleaning station (76), then raised vertically and rotated around the rotation axis (72) to the upper part of the pad conditioner cleaning station (76) at the first position (76a), and then lowered to place the pad conditioner (74) on the pad conditioner cleaning station (76).

The substrate polishing unit (500) may include an abrasive supply arm (80). One end of the abrasive supply arm (80) is connected to a vertical shaft (86) configured to pivotally rotate about a rotation axis (82), and an abrasive discharge port is disposed at the opposite end. The rotation axis (82) of the abrasive supply arm (80) is disposed near a fourth edge (124). The fourth edge (124) is a edge that is disposed opposite the second edge (122) with the rotation axis (12) of the polishing platen (10) interposed therebetween. At least a portion of the vertical shaft (86) of the abrasive supply arm (80) may be disposed in a space between the polishing platen (10) and the circumscribed tetrahedron (120) near the fourth edge (124). The rotation axis (82) of the vertical shaft (86) of the abrasive supply arm (80) may be placed in the space between the outer tetrahedron (120) and the abrasive plate (10).

As described above, in this embodiment, the pad conditioner cleaning station (76) is positioned on the polishing plate (10) while providing a means to prevent collision with the pad conditioner arm (70) and the polishing head (20a, 20b), thereby reducing the footprint of the substrate polishing unit (500).

As described above, in the present invention, the vertical shaft (52) of the substrate detachment device (50), the rotational axis (72) of the pad conditioner arm, the vertical shaft (276) of the pad conditioner cleaning station (76), and the rotational axis (82) of the abrasive supply arm (80) are arranged near the four corners of the outer tetrahedron (120), thereby efficiently using space and reducing the footprint of the substrate polishing unit (500).

The following examples primarily refer to Korean patent applications No. 10-2024-0030990, which claims priority to this application, but may also refer to other Korean patent applications.

Referring to FIGS. 19 and 20, a substrate polishing unit (500) according to an embodiment of the present invention is described. FIG. 19 is a plan view of the substrate polishing unit (500), and FIG. 20 is a side view of the substrate polishing unit (500).

Referring to FIG. 19, components of the substrate polishing unit (500) and their arrangements will be described using four vertical planes (260a to 260d) of a virtual tetrahedron (260) arranged around the substrate polishing unit (500). The first to fourth planes (260a to 260d) are virtual vertical planes that are perpendicular to each other. The first to fourth edges (262a to 262d) are edges therebetween. A frame structure (140) that supports components of the substrate polishing unit (500) may be arranged on the first to fourth planes (260a to 260d). The angle between the first plane (260a) and plane A (described with reference to FIG. 13) may be 80 to 100 degrees.

The substrate handler (42) approaches the substrate detachment device (50) across the first surface (260a). The first surface (260a) is positioned between the polishing platen (10) and the substrate handler (42). The first surface (260a) is the surface closest to the substrate detachment device (50) and the substrate handler (42) among the first to fourth surfaces (260a to 260d).

The pad conditioner arm (70) and its pivot rotation axis (72) and the parking position (70P) are arranged in a space between the second surface (260b) and the polishing platen (10). The second surface (260b) is a surface that shares a first edge (262a) with the first surface (260a). When the pad conditioner arm (70) is placed in the parking position (70P), the pad conditioner arm (70) is arranged between the polishing platen (10) and the second surface (260b), and the pad conditioner (74) attached to the end of the pad conditioner arm (70) is arranged in the pad conditioner parking position (74P). The pad conditioner parking position (74P) is located in the space between the surface G (described with reference to FIG. 13), the first surface (260a) and the polishing plate (10) near the first edge (262a).

The rotation axis (72) of the pad conditioner arm (70) is positioned in the space between the second surface (260b), the polishing platen (10), and the surface B and surface C described with reference to FIG. 13. The pad conditioner arm (70) pivotally rotates (79) about the pivot rotation axis (72) from the parking position (70P) toward the bottom of the substrate detachment device (50), and the pad conditioner (74) conditions the polishing pad (11) by reciprocating (79) between the center (12) of the polishing pad (11) and the edge of the polishing pad (11) adjacent to the first edge (262a).

The pivot rotation axis (82) of the abrasive arm (80) is positioned closer to the fourth surface (260d) than to the second surface (260b) in the space between the third surface (260c) and the abrasive platen (10). The third surface (260c) is positioned opposite the first surface (260a), and the fourth surface (260d) is positioned opposite the second surface (260b). The abrasive supply arm (80) is positioned opposite the pad conditioner arm (70) with the abrasive platen (10) interposed therebetween. The rotation axis (82) of the abrasive supply arm (80) and the pad conditioner parking position (74P) are positioned opposite to each other across the rotation axis (12) of the abrasive platen (10).

The rotation axis (82) of the abrasive supply arm (80) is arranged in the space between surface A, surface C, the third surface (260c), the fourth surface (260d) and the polishing platen (10). In the parking position, the end (80') of the abrasive supply arm (80) is arranged closer to the third surface (260c) than to the first surface (260a) between the polishing platen (10) and the fourth surface (260d). In the parking position, the end (80') of the abrasive supply arm (80) is arranged in the space between surface B, surface C, the fourth surface (260d) and the polishing platen (10).

The substrate attachment/detachment device (50) is supported by being attached to the support plate (136), and the support plate (136) can be vertically moved and connected (138) to a frame (140) disposed on at least one of the second and fourth surfaces (260b, 260d). The substrate attachment/detachment device (50) can be configured to attach the substrate to the first and second polishing heads (20a, 20b) while moving vertically.

The operator can easily access the third side (260c) to replace the polishing pad (11) or maintain the pad conditioner arm (70) and the polishing arm (80).

Referring to FIG. 20, the polishing platen (10) can be configured to vibrate (oscillate) along a first direction (106) by a linear driving means (252). The pad conditioner arm (70) and the abrasive supply arm (80) can also be configured to vibrate along the first direction (106) together with the polishing platen (10). To this end, the vertical shaft (108) and the rotational driving means (105) of the polishing platen (10), the vertical shaft (75) and the pivotal rotational driving means (77) of the pad conditioner arm (70), and the vertical shaft (not shown) and the pivotal rotational driving means (not shown) of the abrasive supply arm (80) are fixed together and arranged on a polishing platen base (250). The polishing platen base (250) vibrates along the first direction (106) by the linear driving means (252). Referring to Fig. 19, the first direction (106) is a direction parallel to the polishing surface of the polishing pad (11) on surface A.

Referring to FIG. 21, a substrate polishing device (1000) according to an embodiment of the present invention is arranged so that substrate polishing units (500, 500') of the same design face each other with a substrate transfer means (40, substrate transfer robot) therebetween. The substrate transfer means (40) moves in a substrate transfer space (44) and transfers substrates to and from substrate attachment/detachment devices (50) of the substrate polishing units (500, 500').

The second substrate polishing unit (500') is a form in which the first substrate polishing unit (500) is rotated 180 degrees, and has the same design as the first substrate polishing unit (500). Symbols 6a and 6b are symbols showing the orientation states of the first and second substrate polishing units (500, 500'), respectively, and show that the first and second substrate polishing units (500, 500') are oriented in a form in which they are rotated 180 degrees with respect to each other. Symbol 6a shows that the substrate polishing unit (500) is oriented in the 12 o'clock direction, and symbol 6b shows that the substrate polishing unit (500) is oriented in the 6 o'clock direction.

The substrate polishing device (1000) according to an embodiment of the present invention can reduce the size of the substrate polishing device (1000) by efficiently arranging components of the substrate polishing unit (500), such as the polishing heads (20a, 20b), the substrate detachment device (50), the pad conditioner arm (70), and the abrasive supply arm (80), near the polishing platen (10). It also provides ease of maintenance by allowing an operator to easily access and maintain the components of the substrate polishing units (500, 500') through the third surface (260c) of each polishing unit (500, 500'). In addition, by arranging the same substrate polishing units (500) by 180 degrees, there is no need to separately design the substrate polishing units (500) arranged on the left and right sides of the substrate transfer means (40), so that the manufacturing cost can be reduced.

Referring to FIGS. 22 and 23, a substrate polishing unit (500a) according to an embodiment of the present invention will be described. FIG. 22 is a plan view of the substrate polishing unit (500a), and FIG. 23 is a side view of the substrate polishing unit (500a) of FIG. 22 as viewed from the second surface (260b).

The differences between the substrate polishing unit (500a) of FIG. 22 and the substrate polishing unit (500) illustrated in FIG. 19 are as follows. In the substrate polishing unit (500) of FIG. 19, the substrate handler (42) approaches the substrate attaching/detaching device (50) through the first surface (260a of FIG. 19) closest to the substrate attaching/detaching device (50), but in the substrate polishing unit (500a) illustrated in FIG. 22, the substrate handler (42) approaches the substrate attaching/detaching device (50) through the fourth surface (260d) that is adjacent to the first surface (260a) closest to the substrate attaching/detaching device (50) and shares the fourth edge (262d).

The pivot rotation axis (72) and the parking position (70P) of the pad conditioner arm (70) are arranged in the space between the second surface (260b) and the polishing platen (10). When the pad conditioner arm (70) is placed in the parking position (70P), the pad conditioner arm (70) is arranged in the space between the second surface (260b) and the polishing platen (10). The pivot rotation axis (72) of the pad conditioner arm (70) is arranged adjacent to the first edge (262a) shared by the first surface (260a) and the second surface (260b).

A pad conditioner (74) attached to the end of the pad conditioner arm (70) is disposed at a pad conditioner parking position (74P) between the second surface (260b) and the polishing platen (10). The pad conditioner parking position (74P) is disposed closer to the third surface (260c) than to the first surface (260a) between the polishing platen (10) and the second surface (260b). The pad conditioner parking position (74) may be disposed closer to surface B (260b) between surface A, surface B, the polishing platen (10), and the second edge (262b). The pad conditioner arm (70) reciprocates (79) from the center (12) of the polishing plate (10) toward the second surface (260b) around the pivot rotation axis (72) to the edge of the polishing plate (10), while the pad conditioner (74) conditions the polishing pad (11).

The pivot rotation axis (82) of the abrasive supply arm (80) is positioned closer to the second surface (260b) than to the fourth surface (260d) in the space between the third surface (260c) and the polishing platen (10). When the abrasive supply arm (80) is positioned at the parking position (80P), the end (80') of the abrasive supply arm (80) is positioned closer to the third surface (260c) than to the first surface (260a) between the polishing platen (10) and the second surface (260b). The abrasive supply arm (80) rotates (89) about the pivot rotation axis (82) to move near the center of the polishing platen (10) and then supplies the abrasive onto the polishing pad (11). The parking position (80P) of the abrasive supply arm (80) is arranged between surface A, surface B, the second surface (260b), the third surface (260c), and the abrasive platen (10).

When the pad conditioner arm (70) and the abrasive supply arm (80) move from their respective parking positions (70P, 80P) onto the polishing pad (11), the pad conditioner arm (70) moves first and then the abrasive supply arm (80) moves to avoid interference between the pad conditioner arm (70) and the abrasive supply arm (80). Conversely, when the pad conditioner arm (70) and the abrasive supply arm (80) return from the polishing pad (11) to their respective parking positions (70P, 80P), the abrasive supply arm (80) moves first and then the pad conditioner arm (70) moves.

As described above, the pad conditioner arm (70) and the abrasive supply arm (80) are positioned in the space between the second surface (260b) and the abrasive platen (10) at each of the parking positions (70P, 80P). When the abrasive supply arm (80) is positioned at the parking position (80P), the end (80') of the abrasive supply arm (80) is positioned adjacent to the parking position (74P) of the pad conditioner (74). When the worker replaces the pad conditioner (74) or maintains the abrasive supply arm (80), the worker can easily access it through the second surface (260b).

Referring to FIGS. 22 and 23, the substrate detachment device (50) is connected to and supported by a support plate (136), and the support plate (136) can be vertically moved and connected (138) to a frame (140) disposed on the first surface (260a). The substrate detachment device (50) can be configured to attach a substrate to the first and second polishing heads (20a, 20b) while moving vertically.

The substrate polishing device (500) may also be configured to horizontally reciprocate (59) the substrate detachment device (50) from the substrate detachment position (30) to the substrate replacement position (58). The substrate replacement position (58) is positioned between the substrate detachment position (30) and the fourth surface (260d) in the entry direction of the substrate handler (42). In this embodiment, after the substrate detachment device (50) receives the substrate from the polishing heads (20a, 20b) at the substrate detachment position (30), it moves to the substrate replacement position (58), and then the substrate handler (42) can take out the substrate from the substrate detachment device (50), so that the length and stroke of the arm of the substrate handler (42) can be reduced. When the substrate handler (42) removes the substrate from the substrate detachment device (50) at the substrate replacement location (58) and transfers a new substrate, the substrate detachment device (50) returns to the substrate detachment location (30) and transfers the substrate to the polishing head (20a, 20b).

The substrate polishing unit (500a) of Fig. 22 can be oriented in the same way as the substrate polishing unit (500) of Fig. 19 is arranged in a 180-degree rotated form in the substrate polishing device (1000) of Fig. 21 to form the substrate polishing device (1000).

The following examples primarily refer to Korean patent applications No. 10-2024-0089299, which claims priority to this application, but may also refer to other Korean patent applications.

Referring to FIGS. 24 and 25, a substrate polishing unit (500) according to an embodiment of the present invention will be described. FIG. 24 is a side cross-sectional view of the substrate polishing unit (500), and FIG. 25 is a three-dimensional view of the substrate polishing unit (500). The substrate polishing unit (500) includes a housing (100) configured to rotate around a housing rotation axis (2). The housing (100) may be a panel that seals at least a portion of an internal space surrounded by the housing (100), or may be a frame structure configured to hang and support polishing heads (21a, 21b).

The housing (100) is composed of an upper surface (100A), a lower surface (100B), an upper side surface (100C), a lower side surface (100D), and a step portion (100E) between the upper side surface (100C) and the lower side surface (100D). The upper side surface (100C) constitutes the upper housing (100C), and the lower side surface (100D) constitutes the lower housing (100D). The lower side surface (100D) is arranged to have a reduced size in the direction of the housing rotation axis (2) compared to the upper side surface (100C). Therefore, the step portion (100E) is arranged to face the ground. The housing (100) is arranged so that the step portion (100E) is seated on the rotating portion (322) of the turn table bearing (320) fixed to the frame structure (140) of the substrate polishing unit (500). The housing (100) is supported by a turn table bearing (320) and can rotate about a housing rotation axis (2). First and second polishing head assemblies (110a, 100b) are arranged inside the housing (100). Each polishing head assembly (110a, 110b) includes a rotary union (123a, 123b) that transmits fluid to the polishing head (20a, 20b) through a rotating vertical shaft (21a, 21b).

The height (100h) of the housing (100) is designed to be greater than the combined value of the height of the rotary union (123a), the height of the rotary drive device (22a) of the polishing head, the length of the vertical shaft (21a) of the polishing head, the height of the substrate attachment/detachment device (50), and the height of the pad conditioner arm (70) including the pad conditioner (74). When the rotary drive device (22a) is not on the same axis as the vertical shaft (21a) of the polishing head but is arranged next to the vertical shaft (21a), the rotary union (123a) is directly connected to the vertical shaft (21a). In this embodiment, the height (100h) of the housing (100) is designed to be greater than the combined height of the rotary union (123a), the length of the polishing head vertical shaft (21a), the height of the substrate detachment device (50), and the height of the pad conditioner arm (70) including the pad conditioner (74).

Since the polishing head (20a, 20b) moves vertically a distance (d) greater than the height of the substrate attachment/detachment device (50) plus the height of the pad conditioner arm (70), the length of the polishing head vertical shaft (21a, 21b) is designed to be greater than this distance (d). Since the turn table bearing (320) on which the housing (100) is mounted catches the oscillation of the housing (100), the oscillation of the polishing head vertical shaft (21a, 21b) supported by the housing (100) is improved or prevented. If, unlike the present embodiment, the bottom surface (100B) of the housing (100) is fixed on the turn table bearing (320) instead of the step portion (100E), a problem may occur in which the vertically moving polishing head (20a, 20b) interferes (collides) with the turn table bearing (320).

The following examples primarily refer to Korean patent applications No. 10-2024-0110148 and Korean patent application No. 10-2023-0133914, which claim priority to this application, but may also refer to other Korean patent applications.

Referring to FIGS. 26 to 28, an embodiment of the blocking plate (220) described with reference to FIG. 8 will be described. FIG. 26 is a plan view of the substrate polishing unit (500), and FIGS. 27 and 28 are side cross-sectional views cut along plane A of FIG. 26.

Referring to FIGS. 26 and 27, the blocking plate (220) is positioned to extend from the edge of the polishing plate (10) across the lower space of the substrate detachment device (50) toward the substrate polishing position (32). The blocking plate (220) is positioned to be larger than the area of the substrate detachment device (50) so that the substrate detachment device (50) is not obscured by the blocking plate (220) when viewed vertically from the polishing pad (11). The blocking plate (220) can prevent particles generated from the polishing head (21a) or the substrate detachment device (50) or cleaning water sprayed from the substrate detachment device (50) to the polishing head (21a) from falling onto the polishing pad (11), thereby preventing the polishing pad (11) from being contaminated by the particles or cleaning water.

The blocking plate (220) may be composed of a first blocking plate (230) positioned below the substrate detachment device (50) and a vertical blocking plate (232) extending perpendicularly or obliquely upward from the first blocking plate (230). The vertical blocking plate (232) is positioned to block at least a portion of the space between the polishing position (32) and the substrate detachment device (50) in order to prevent particles or cleaning water from flying toward the polishing position (32). The blocking plate (220) may further include a second blocking plate (234). The first and second blocking plates (230, 234) are positioned on the polishing plate (10) in a direction parallel to the polishing plate (10). The second blocking plate (234) is positioned higher than the first blocking plate (230), and the vertical blocking plate (232) is positioned between the first blocking plate (230) and the second blocking plate (234) to shield the space between the first and second blocking plates (230, 234). The area of the first and second blocking plates (230, 234) may be configured to be larger than the area of the polishing pad (11).

Referring to FIG. 27, the first blocking plate (230) is arranged in a space between the substrate detachment device (50) and the polishing plate (10), and the second blocking plate (234) is arranged above the polishing position (32). The substrate detachment device (50) is isolated from the polishing pad (11) by the vertical blocking plate (232) and the first blocking plate (230). The first blocking plate (230) may be arranged in a form attached to the bottom surface of the substrate detachment device (50). A through hole (237) is arranged in the second blocking plate (234), and the polishing head (20a) can move vertically (238) through the through hole (237). The size of the through hole (237) is configured to be larger than the bottom surface of the polishing head (20a). When the polishing head (20a) moves from the polishing position (32) to the substrate detachment device (50), it is lifted vertically (238) above the second blocking plate (234) through the through hole (237) and then moves horizontally (214) onto the substrate detachment device (50). The horizontal movement (214) may be performed by moving the polishing head (20a) in a straight line on the surface A (see FIG. 26) including the substrate detachment position (30) and the substrate polishing position (32) or by rotating around the rotation axis (2).

Referring to FIG. 26, the first blocking plate (230) and the second blocking plate (234) are placed on the first and second holders (240, 242) respectively, which are arranged on the upper side of the polishing plate (10). The operator can place the first and second blocking plates (230, 234) on the respective holders (240, 242) from the third side (260c) or remove them from the respective holders (240, 242). A washing water spray means (not shown) configured to wash the upper surface of the blocking plate (220) can be arranged on the upper side of the blocking plate (220), and the used washing water can be drained through a drain hole arranged around the periphery of the polishing plate (10) through a drain hole on the blocking plate (220). In one embodiment, the blocking plate (220) may be extended such that the first blocking plate (230) passes over the top of the substrate polishing location (32) and the through hole (37), without the second blocking plate (234) and the vertical blocking plate (232).

Referring to FIG. 27, a pad conditioner (74) for conditioning the polishing pad (11) may be placed between the blocking plate (220) and the polishing pad (11). The pad conditioner (74) is configured to condition the polishing pad (11) while horizontally reciprocating under the blocking plate (220). Clean air filtered of particles may be provided into the space (239) between the second blocking plate (234) and the polishing pad (11).

Referring to FIG. 28, a substrate polishing unit (800) according to an embodiment of the present invention will be described. In the substrate polishing unit (800), a polishing head assembly (110) is fastened to a linear guide rail (116) via a guide block (118) so as to enable linear movement (241, see FIG. 27). The linear guide rail (116) is arranged in a direction parallel to a virtual plane A including a substrate polishing position (32) and a substrate detachment position (30). The substrate detachment position (30) and the substrate detachment device (50) are arranged on the upper part of the polishing platen (10). A first blocking plate (230) is arranged between the pad conditioner arm (70) and the substrate detachment device (50). A second blocking plate (234) including a through hole (237) is arranged on the upper part of the polishing position (30). The polishing head (20) is lifted upward from the substrate polishing position (32) through the through hole (237) and then moves horizontally (241) along the linear guide rail (116) to the substrate detachment position (30). A pad conditioner arm (70) is arranged below the substrate detachment device (50) to condition the polishing pad (11). Components indicated by reference numbers 20, 21, 22, 23, 24, and 110 in FIG. 28 perform the same function as components indicated by reference numbers 20a, 21a, 22a, 23a, 24a, and 110a used in FIG. 1, respectively.

The following examples primarily refer to Korean patent applications claiming priority from this application, namely, application numbers 10-2023-0120761, 10-2023-0124412, 10-2023-0133914, 10-2024-0032396 and 10-2024-0038805, but may also refer to other Korean patent applications.

The first and second substrate attachment/detachment positions (20a', 20b') and the first and second substrate polishing positions (20a", 20b") of the first and second polishing heads (20a, 20b) used in the following specification correspond to the positions of the centers of the first and second polishing heads (20a, 20b), respectively. The first and second polishing heads (20a, 20b) polish the respective substrates on the polishing pad (11) at the first and second substrate polishing positions (20a", 20b"), respectively, and transfer the substrates to and from the base (54) of the substrate attachment/detachment device (50) at the first and second substrate attachment/detachment positions (20a', 20b').

What is meant by the base (54) of the substrate detachment device (50) being positioned at the first and second substrate detachment positions (20a', 20b') is that the base (54) of the substrate detachment device (50) is positioned at a position for exchanging substrates with the first and second polishing heads (20a, 20b) below the first and second polishing heads (29a, 20b) that are positioned at the first and second substrate detachment positions (20a', 20b').

Referring to FIG. 29, a substrate polishing unit (900) according to an embodiment of the present invention will be described. The substrate polishing unit (900) is different from the substrate polishing unit (500) described with reference to FIG. 1 in that the first and second polishing head assemblies (110a, 110b) do not rotate around the rotation axis (2), and instead, the substrate detachment/attachment device (50) rotates around the rotation axis (2). In addition, the polishing platen (10) may be configured to rotate around the rotation axis (12) in a first direction (10a) and a second direction (10b). The first direction (10a) and the second direction (10b) are opposite directions.

The substrate polishing unit (900) includes first and second substrate detachment positions (20a', 20b') and first and second substrate polishing positions (20a", 20b"). The first substrate attachment/detachment position (20a') is positioned above the polishing platen (10) on the rotation axis (27a) of the first polishing head (20a), and the first substrate polishing position (20a") is positioned below the first substrate attachment/detachment position (20a') on the rotation axis (27a) of the first polishing head (20a). The second substrate attachment/detachment position (20b') is positioned above the polishing platen (10) on the rotation axis (27b) of the second polishing head (20b), and the second substrate polishing position (20b") is positioned below the second substrate attachment/detachment position (20b') on the rotation axis (27b) of the second polishing head (20b). A first vertical driving device (23a) vertically moves the first polishing head (20a) along the ball screw (24a) between a first polishing position (20a") and a first substrate attachment/detachment position (20'a). Similarly, a second vertical driving device (23b) vertically moves the second polishing head (20b) along the ball screw (24b) between a second polishing position (20b") and a second substrate attachment/detachment position (20b').

The base (54) of the substrate detachment device (50) is connected to a pivot rotation driving device (253) through a vertical shaft (252). The vertical shaft (252) extends downward from the frame (140a) through a linear ball bearing (268) arranged in the frame (140a), and is fixed to the frame (140a) so as to be vertically moved and rotated by the linear ball bearing (268). The pivot rotation driving device (253) can move the base (54) to the vicinity of the first and second substrate detachment positions (20a', 20b') by pivotally rotating the vertical shaft (252).

The height of the base (54) of the substrate attachment/detachment device can be adjusted between first and second positions (H1, H2) by vertically moving the vertical shaft (252) of the substrate attachment/detachment device (50) by a vertical driving device (256) fixed to the frame (140). The base (54) can be raised from the first position (H1) to the second position (H2) to attach the substrate (W) placed on the base (54) to the bottom surface of the polishing head (20a, 20b).

The substrate detachment device (50) may include a side wall (62) arranged to surround the periphery of the polishing head (20a, 20b) on the base (54), an ultra-pure water spray nozzle (64) arranged inside the side wall, and a drain port (66) arranged on the bottom surface of the base (54). An ultra-pure water supply pipe (269) is arranged on the vertical shaft (252) of the substrate detachment device (50). Ultra-pure water supplied through the ultra-pure water supply pipe (269) is supplied to the ultra-pure water spray nozzle (64) through a fluid passage inside the vertical shaft (252). The polishing head (20a, 20b) can be washed by spraying ultra-pure water through the ultra-pure water spray nozzle (64) while the polishing head (20a, 20b) remains on the base (54) of the substrate detachment device. A drain port (66) is arranged on the base (54). The drain (66) is positioned so as to face the space between the fence (14) and the polishing plate (10). The drain (66) moves along the space between the fence (14) and the polishing plate (10) when the base (54) of the substrate detachment device pivots along the rotation axis (2) and discharges the washing by-products into the space therebetween.

In the first polishing mode, as shown in FIG. 29, the first polishing head (20a) detaches the polished substrate (W1) from the first substrate detachment position (20a') to the base (54) of the substrate detachment device, and the second polishing head (20b) polishes the substrate (W2) at the second substrate polishing position (20b"). The polishing platen (10) rotates in the first rotational direction (10a). The substrate (W1) detached from the base (54) of the substrate detachment device is removed by the substrate handler (42, not shown). When the substrate handler (42) transfers a new substrate (W3, not shown) to the base (54) of the substrate detachment device, the first polishing head (20a) attaches the new substrate (W3) from the base (54). The pad conditioner arm (70) is positioned at the first substrate detachment position (20a') to the base (54) of the substrate detachment device. Move from below and condition the polishing pad (11).

In the second polishing mode, the second polishing head (20b) detaches the substrate (W2) from the base (54) at the second substrate detachment position (20b') and the first polishing head (20a) polishes the substrate (W3) at the first substrate polishing position (20a"). The substrate (W2) detached to the base (54) of the substrate detachment device is removed by the substrate handler (42, not shown). When the substrate handler (42) transfers a new substrate (W4, not shown) to the base (54) of the substrate detachment device, the second polishing head (20b) attaches the new substrate (W4) from the base (54). The polishing platen (10) can rotate in the first or second rotational direction (10a, 10b). The pad conditioner arm (70) moves under the base (54) of the substrate detachment device located at the second substrate detachment position (20b') and polishes. Condition the pad (11).

The transition from the first polishing mode to the second polishing mode is performed by lifting the second polishing head (20b) from the substrate polishing position (20b") to the substrate detachment position (20b'), rotating the base (54) of the substrate detachment device around the rotation axis (2) to move it below the second polishing head (20b), and lowering the first polishing head (20a) to the substrate polishing position (20a").

Referring to FIGS. 30(a) and 30(b), an embodiment of a substrate polishing unit (900) will be described. FIG. 30(a) shows a first polishing mode of the substrate polishing unit (900), and FIG. 30(b) shows a second polishing mode. A pad conditioner arm (70) and an abrasive supply arm (80) are arranged opposite each other with a polishing platen (10) therebetween. The substrate polishing unit (900) includes first and second abrasive supply positions (84a, 84b) on the polishing pad (11). The first abrasive supply position (84a) is arranged near the central axis (12) of the first polishing head (20a) and the polishing platen (10). The second abrasive supply position (84b) is arranged near the central axis (12) of the second polishing head (20b) and the polishing platen (10). The abrasive supply arm (80) rotates around the pivot rotation axis (82) to move to the first and second abrasive supply positions (84a, 84b).

In the first polishing mode of FIG. 30(a), the second polishing head (20b) polishes the substrate, and the first polishing head (20a) is placed on the base (54) of the substrate detachment/attachment device. The pad conditioner arm (70) pivotally rotates (74a) below the base (54) placed below the first polishing head (20a) to condition the polishing pad (11). The abrasive supply arm (80) moves to the second abrasive supply position (84b) to supply the abrasive. The polishing platen (10) rotates in the second direction (10b). The second direction (10b) is the direction in which the abrasive flows from the second abrasive supply position (84b) toward the second polishing head (20b). The substrate handler (42) enters between the first polishing head (20a) and the base (54) to take out or transfer the substrate.

In the second polishing mode of Fig. 30(b), the first polishing head (20a) polishes the substrate, and the second polishing head (20b) is placed on the base (54) of the substrate detachment/attachment device. The base (54) moves from the lower portion of the first polishing head (20a) to the lower portion of the second polishing head (20b). The pad conditioner arm (70) pivotally rotates (74b) below the base (54) placed below the second polishing head (20b) to condition the polishing pad (11). The abrasive supply arm (80) moves to the first abrasive supply position (84a) to supply the abrasive. The first direction (10a) is the direction in which the abrasive flows from the first abrasive supply position (84a) toward the first polishing head (20a). The substrate handler (42) enters between the second polishing head (20b) and the base (54) of the substrate detachment device to take out or transfer the substrate.

The pad conditioner arm (70) is connected to the linear guide rail (270) and can reciprocate between the first conditioning position (272) and the second conditioning position (274). The first and second conditioning positions (72, 274) are located on opposite sides of the linear guide rail (270). In the first polishing mode, the rotational axis (72) of the pad conditioner arm (70) is moved to the first conditioning position (272) to condition the polishing pad (11) under the first polishing head (20a) and the substrate detachment device (50), and in the second polishing mode, the rotational axis (72) of the pad conditioner arm (70) is moved to the second conditioning position (274) to condition the polishing pad (11) under the second polishing head (20b) and the substrate detachment device (50).

The pad conditioner cleaning station (76) is positioned near the linear guide rail (270), and the rotational axis (72) of the pad conditioner arm (70) is moved near the first conditioning position (272), and then the pad conditioner arm (70) is rotated so that a pad conditioner (74, not shown) hanging from the end of the pad conditioner arm (70) can be positioned at the pad conditioner cleaning station (76).

Referring to FIG. 31, the substrate polishing unit (900) may include a pad conditioner arm (70) and first and second abrasive supply arms (80a, 80b). The first and second abrasive supply arms (80a, 80b) are disposed opposite the pad conditioner arm (70) with a plane A therebetween. A rotational axis (72) of the pad conditioner arm (70) is disposed near the plane A. The plane A includes the rotational axes (27a, 27b) of the first and second polishing heads (20a, 20b) and is a plane perpendicular to the polishing platen (10). The first and second abrasive supply arms (80a, 80b) are disposed oppositely with a plane B therebetween. The plane B is a plane perpendicular to the plane A and includes the rotational axis (12) of the polishing platen (10).

In the first polishing mode of Fig. 31(a), the second polishing head (20b) polishes the substrate (W) and the second abrasive supply arm (80b) moves to the second abrasive supply position (84b) to supply the abrasive. The polishing platen (10) rotates in the second direction (10b). The pad conditioner arm (70) conditions the polishing pad (11) while pivotally rotating (74a) under the base (54) of the substrate detachment/attachment device positioned under the first polishing head (20a).

In the second polishing mode of Fig. 31(b), the first polishing head (20a) polishes the substrate (W) and the first abrasive supply arm (80a) moves to the first abrasive supply position (84a) to supply the abrasive. The polishing platen (10) rotates in the first direction (10a). The pad conditioner arm (70) conditions the polishing pad (11) while pivotally rotating (74b) under the base (54) of the substrate detachment/attachment device positioned under the second polishing head (20b).

Referring to FIG. 32, a substrate polishing device (900) according to an embodiment of the present invention is described. The substrate polishing device (900) includes two pad conditioner arms (70a, 70b). FIG. 32 shows a state in which they are arranged in their respective parking positions. The substrate handler (42) transfers a substrate to and from a substrate detachment device (50) across a first surface (260a) parallel to surface A. The substrate detachment device (50) is arranged below the first polishing head (20a).

The pivot rotation axis (72a) of the first pad conditioner arm (70a) is positioned between the first polishing head (20a) and the second face (260b) of the tetrahedron (260) near the face A, and the end (70a') of the first pad conditioner arm (70a) is positioned near the edge between the second face (260b) and the third face (260c) or the edge between the first face (260a) and the second face (260b). The first pad conditioner arm (70a) moves toward the first substrate detachment position (20a') and then conditions the polishing pad (11) while pivotally rotating (79a) in the space below the first polishing head (20a).

The pivot rotation axis (72b) of the second pad conditioner arm (70b) is positioned between the second polishing head (20b) and the third face (260c) of the tetrahedron (260) near face A, and the end (70b') of the second pad conditioner arm (70b) is positioned near the edge between the fourth face (260d) and the first face (260a) or the edge between the third face (260c) and the fourth face (260d). The second pad conditioner arm (70b) moves toward the second substrate attachment/detachment position (20b') and then conditions the polishing pad (11) while pivotally rotating (79b) in the space below the second polishing head (20b).

The substrate polishing unit (900) performs the first and second polishing modes alternately. In the first polishing mode, as shown in FIG. 32, the first polishing head (20a) transfers the substrate (W) to and from the substrate detachment device (50) above the substrate detachment device (50), and the second polishing head (20b) polishes the substrate (W) on the polishing pad (11). The first pad conditioner arm (70a) pivotally rotates (79a) below the substrate detachment device (50) and conditions the polishing pad (11). The second pad conditioner arm (70b) waits at a parking position outside the polishing platen (10).

When the first polishing mode is terminated, the second polishing head (20b) rises to the substrate detachment position (20b'), and the substrate detachment device (50) moves below the second polishing head (20b). The first pad conditioner arm (70a) moves to the parking position outside the polishing platen (10). Then, in the second polishing mode, the second polishing head (20b) transfers the substrate (W) to and from the substrate detachment device (50) above the substrate detachment device (50), and the first polishing head (20a) polishes the substrate (W) on the polishing pad (11). The second pad conditioner arm (70b) pivotally rotates (79b) below the substrate detachment device (50) and conditions the polishing pad (11). The first pad conditioner arm (70a) waits at the parking position outside the polishing platen (10).

The substrate polishing unit (900) may include two abrasive supply arms (80a, 80b). FIG. 32 shows a state where they are arranged in a parking position outside the polishing platen (10). In the parking position, the first abrasive supply arm (80a) has a rotational axis (82a) arranged near the rotational axis (72a) of the first pad conditioner arm (70a), and an end (80a') thereof is arranged between the first surface (260a) and the surface B. The second abrasive supply arm (80b) has a rotational axis (82b) arranged near the rotational axis (72b) of the second pad conditioner arm (70b), and an end (80b') thereof is arranged between the third surface (260c) and the surface B. The rotation axes (82a, 82b) of the first and second abrasive supply arms are arranged on opposite sides with the rotation axis (12) of the abrasive plate (10) interposed therebetween.

The first abrasive supply arm (80a) rotates (89a) about the rotation axis (82a) in the second polishing mode in which the first polishing head (20a) polishes the substrate, and supplies the abrasive to the first abrasive supply position (84a). The second abrasive supply arm (80b) rotates (89b) about the rotation axis (82b) in the first polishing mode in which the second polishing head (20b) polishes the substrate, and supplies the abrasive to the second abrasive supply position (84b). The first and second abrasive supply positions (84a, 84b) are arranged on opposite sides with the rotation axis (12) of the polishing platen (10) interposed therebetween. In the first and second polishing modes, the polishing platen (10) rotates in the same direction (10a).

According to an embodiment of the present invention as described above, in a substrate polishing device in which two polishing heads (20a, 20b) alternately polish a substrate on one polishing surface (11), two conditioning arms (70a, 70b) can alternately condition a polishing pad. In addition, two abrasive supply arms (80a, 80b) can alternately be used to supply abrasive onto the polishing pad (11).

This application is an application that integrates 13 previously filed Korean patent applications. In some cases, different reference numbers were used for the same components in the previously filed patent applications. In this application, the same reference numbers were used for the same components. In addition, some reference numbers for components used in the previously filed patent applications were changed and used.

Although the present invention has been exemplified through preferred embodiments above, the scope of the rights of the present invention is not limited to these specific embodiments, and various modifications, changes, or improvements within the technical ideas presented in the present invention, particularly those described in the claims, are also included within the scope of the rights of the present invention.

A substrate polishing device according to the present invention can be used in a manufacturing process of a semiconductor device.

Claims (10)

A substrate polishing device comprising a substrate polishing unit and a substrate transport means for transferring a substrate to the substrate polishing unit, The above substrate polishing unit, A polishing platen having a polishing pad attached thereto and providing a polishing surface for polishing a substrate and rotating around a first rotational axis; A substrate polishing position arranged near the polishing surface on top of the polishing surface; A polishing head for polishing a substrate at the substrate polishing position; A substrate attachment/detachment position arranged on the upper side of the above polishing plate; and A substrate attachment/detachment device is disposed on the upper side of the above polishing plate and exchanges the polishing head and the substrate at the substrate attachment/detachment position; The above polishing head reciprocates between the substrate polishing position and the substrate detachment device, polishes the substrate on the polishing pad at the substrate polishing position, and exchanges the substrate with the substrate detachment device at the substrate detachment position. A substrate polishing device characterized in that the substrate transfer means enters between the polishing head and the substrate detachment device and transfers the substrate to and from the substrate detachment device at the top of the polishing plate. In paragraph 1, A substrate polishing device in which the polishing head reciprocates between the substrate polishing position and the substrate detachment position along a linear guide rail. In the first paragraph, A substrate polishing device in which the polishing head rotates around a second rotation axis between the substrate attachment/detachment position and the substrate polishing position, thereby reciprocating the substrate polishing position and the substrate detachment device. In the third paragraph, A substrate polishing device wherein the distance between the first rotation axis and the second rotation axis is less than half the distance between the edge of the polishing plate and a fence installed around the periphery of the polishing plate. In the first paragraph, A substrate polishing device comprising a pad conditioner arm that moves below the substrate detachment device and conditions the polishing pad. In the first paragraph, A substrate polishing device in which the polishing head is connected to a vertical shaft protruding downward from the inside of the housing, the housing includes a stepped portion facing the ground, and the stepped portion is supported by being seated on a turn table bearing. In the first paragraph, A substrate polishing device comprising a blocking plate disposed between the lower portion of the substrate attaching/detaching device and the polishing plate, wherein substrate exchange between the polishing head and the substrate attaching/detaching device is performed on the upper portion of the blocking plate. In Article 7, A substrate polishing device in which the above-mentioned blocking plate extends above the above-mentioned substrate polishing position. In Article 7, A substrate polishing device wherein the pad conditioner arm conditions the polishing pad under the blocking plate. In clause 5, A substrate polishing device in which the polishing head moves vertically a distance greater than the sum of the height of the substrate detachment device and the height of the pad conditioner arm positioned below the substrate polishing device, and then moves to the substrate detachment position.

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