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AU2001222261A1 - Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit - Google Patents

Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit

Info

Publication number
AU2001222261A1
AU2001222261A1 AU2001222261A AU2226101A AU2001222261A1 AU 2001222261 A1 AU2001222261 A1 AU 2001222261A1 AU 2001222261 A AU2001222261 A AU 2001222261A AU 2226101 A AU2226101 A AU 2226101A AU 2001222261 A1 AU2001222261 A1 AU 2001222261A1
Authority
AU
Australia
Prior art keywords
fabricating circuit
semiconductor
laminated plate
metal laminated
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001222261A
Inventor
Shinji Ohsawa
Hiroaki Okamoto
Kinji Saijo
Kazuo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Publication of AU2001222261A1 publication Critical patent/AU2001222261A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10D64/011—
    • H10W20/031—
    • H10W72/012—
    • H10W70/656—
    • H10W72/019—
    • H10W72/251—
    • H10W72/9223—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/942—
AU2001222261A 2000-01-12 2000-12-26 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit Abandoned AU2001222261A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000004041A JP2001196381A (en) 2000-01-12 2000-01-12 Semiconductor device, metal laminate used for circuit formation on semiconductor, and circuit formation method
JP2000-4041 2000-01-12
PCT/JP2000/009255 WO2001052322A1 (en) 2000-01-12 2000-12-26 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit

Publications (1)

Publication Number Publication Date
AU2001222261A1 true AU2001222261A1 (en) 2001-07-24

Family

ID=18532874

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001222261A Abandoned AU2001222261A1 (en) 2000-01-12 2000-12-26 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit

Country Status (8)

Country Link
US (1) US6841877B2 (en)
EP (1) EP1255295A4 (en)
JP (1) JP2001196381A (en)
KR (1) KR100722729B1 (en)
CN (1) CN1433571A (en)
AU (1) AU2001222261A1 (en)
TW (1) TW522773B (en)
WO (1) WO2001052322A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308092A (en) * 2000-04-18 2001-11-02 Toyo Kohan Co Ltd Multilayered metal plate used for forming interconnection on semiconductor wafer, and method for forming the interconnection on semiconductor wafer
JP2001308095A (en) * 2000-04-19 2001-11-02 Toyo Kohan Co Ltd Semiconductor device and method of manufacture
KR100598259B1 (en) * 2003-07-31 2006-07-07 동부일렉트로닉스 주식회사 Hybrid layer wiring formation method of semiconductor
US7495179B2 (en) 2003-10-06 2009-02-24 Tessera, Inc. Components with posts and pads
KR100702805B1 (en) * 2005-12-28 2007-04-03 동부일렉트로닉스 주식회사 Metal wiring formation method of semiconductor device
JP5080067B2 (en) * 2006-11-24 2012-11-21 新光電気工業株式会社 Manufacturing method of semiconductor device
JP5629580B2 (en) 2007-09-28 2014-11-19 テッセラ，インコーポレイテッド Flip chip interconnect with double posts
US8003512B2 (en) * 2009-02-03 2011-08-23 International Business Machines Corporation Structure of UBM and solder bumps and methods of fabrication
US8330272B2 (en) * 2010-07-08 2012-12-11 Tessera, Inc. Microelectronic packages with dual or multiple-etched flip-chip connectors
US8580607B2 (en) 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
US20120139095A1 (en) * 2010-12-03 2012-06-07 Manusharow Mathew J Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
US8853558B2 (en) 2010-12-10 2014-10-07 Tessera, Inc. Interconnect structure
US9269681B2 (en) * 2012-11-16 2016-02-23 Qualcomm Incorporated Surface finish on trace for a thermal compression flip chip (TCFC)
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
CN105253854B (en) * 2015-11-12 2017-05-24 中国工程物理研究院电子工程研究所 Method for protecting metal electrode during SOI MEMS sacrificial layer etching
CN106378583B (en) * 2016-09-14 2018-11-30 厦门大学 A kind of High-temperature Packaging is cold-pressed the preparation method of prefabricated film with Sn/Cu/Sn
TWI892323B (en) 2016-10-27 2025-08-01 美商艾德亞半導體科技有限責任公司 Structures and methods for low temperature bonding
WO2020263014A1 (en) * 2019-06-28 2020-12-30 주식회사 아모그린텍 Thin film foil and method for manufacturing thin film foil
JP7783896B2 (en) 2020-12-30 2025-12-10 アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド Structures with conductive features and methods of forming same - Patents.com

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DE2428373C2 (en) * 1974-06-12 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Method for the production of solderable connection contacts on a semiconductor arrangement
JPH0710030B2 (en) * 1990-05-18 1995-02-01 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン Method for manufacturing multilayer wiring board
JPH085664A (en) 1994-06-22 1996-01-12 Hitachi Chem Co Ltd Inspection board for semiconductor device and its production
JP3356921B2 (en) * 1995-03-24 2002-12-16 新光電気工業株式会社 Semiconductor device and method of manufacturing the same
KR100218996B1 (en) * 1995-03-24 1999-09-01 모기 쥰이찌 Semiconductor device
DE69635397T2 (en) * 1995-03-24 2006-05-24 Shinko Electric Industries Co., Ltd. Semiconductor device with chip dimensions and manufacturing method
JP3569585B2 (en) * 1995-03-24 2004-09-22 新光電気工業株式会社 Semiconductor device
US5851911A (en) * 1996-03-07 1998-12-22 Micron Technology, Inc. Mask repattern process
JPH09246274A (en) * 1996-03-11 1997-09-19 Ricoh Co Ltd Semiconductor device
US5904859A (en) * 1997-04-02 1999-05-18 Lucent Technologies Inc. Flip chip metallization
JP3925752B2 (en) 1997-08-08 2007-06-06 日立化成工業株式会社 Bumped wiring board and manufacturing method of semiconductor package
JPH11204576A (en) * 1998-01-19 1999-07-30 Citizen Watch Co Ltd Structure of semiconductor wiring
TW450861B (en) 1998-05-13 2001-08-21 Toyo Kohan Co Ltd Manufacturing method of a combination material of metal foil and ceramic, and metal foil laminated ceramic substrate
JPH11354563A (en) * 1998-06-11 1999-12-24 Citizen Watch Co Ltd Structure of semiconductor wiring
AU5104600A (en) * 1999-06-03 2000-12-28 Toyo Kohan Co. Ltd. Process for producing printed wiring board, ic card and printed wiring substrate
TW495436B (en) * 1999-06-10 2002-07-21 Toyo Kohan Co Ltd Clad plate of interposer formation for semiconductor device, interposer for semiconductor device, and their manufacturing methods
TW495438B (en) * 1999-06-16 2002-07-21 Toyo Kohan Co Ltd Material for mounting, circuit for mounting using that material, printed circuit board using that circuit

Also Published As

Publication number Publication date
KR20020093788A (en) 2002-12-16
WO2001052322A1 (en) 2001-07-19
EP1255295A4 (en) 2005-03-02
CN1433571A (en) 2003-07-30
EP1255295A1 (en) 2002-11-06
JP2001196381A (en) 2001-07-19
TW522773B (en) 2003-03-01
US6841877B2 (en) 2005-01-11
KR100722729B1 (en) 2007-05-29
US20030134497A1 (en) 2003-07-17

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