AU2001298108A1 - Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor - Google Patents
Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method thereforInfo
- Publication number
- AU2001298108A1 AU2001298108A1 AU2001298108A AU2001298108A AU2001298108A1 AU 2001298108 A1 AU2001298108 A1 AU 2001298108A1 AU 2001298108 A AU2001298108 A AU 2001298108A AU 2001298108 A AU2001298108 A AU 2001298108A AU 2001298108 A1 AU2001298108 A1 AU 2001298108A1
- Authority
- AU
- Australia
- Prior art keywords
- polishing
- semiconductor wafer
- method therefor
- carrier including
- volume diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/541,753 US6447379B1 (en) | 2000-03-31 | 2000-03-31 | Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
| US09/541,753 | 2000-03-31 | ||
| PCT/US2001/007685 WO2004017386A2 (en) | 2000-03-31 | 2001-03-27 | Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001298108A1 true AU2001298108A1 (en) | 2004-03-03 |
Family
ID=33435307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001298108A Abandoned AU2001298108A1 (en) | 2000-03-31 | 2001-03-27 | Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005520357A (en) |
| AU (1) | AU2001298108A1 (en) |
| GB (1) | GB2402263A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11945073B2 (en) * | 2019-08-22 | 2024-04-02 | Applied Materials, Inc. | Dual membrane carrier head for chemical mechanical polishing |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158934B2 (en) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | Wafer polishing equipment |
| US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
| EP0881039B1 (en) * | 1997-05-28 | 2003-04-16 | Tokyo Seimitsu Co.,Ltd. | Wafer polishing apparatus with retainer ring |
| JPH11226865A (en) * | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | Carrier and CMP equipment |
-
2001
- 2001-03-27 AU AU2001298108A patent/AU2001298108A1/en not_active Abandoned
- 2001-03-27 GB GB0222175A patent/GB2402263A/en not_active Withdrawn
- 2001-03-27 JP JP2004529013A patent/JP2005520357A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB0222175D0 (en) | 2002-10-30 |
| GB2402263A8 (en) | 2004-12-21 |
| JP2005520357A (en) | 2005-07-07 |
| GB2402263A (en) | 2004-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |