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AU2001296527A1 - Resist stripping process - Google Patents

Resist stripping process

Info

Publication number
AU2001296527A1
AU2001296527A1 AU2001296527A AU9652701A AU2001296527A1 AU 2001296527 A1 AU2001296527 A1 AU 2001296527A1 AU 2001296527 A AU2001296527 A AU 2001296527A AU 9652701 A AU9652701 A AU 9652701A AU 2001296527 A1 AU2001296527 A1 AU 2001296527A1
Authority
AU
Australia
Prior art keywords
stripping process
resist stripping
resist
stripping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296527A
Inventor
Eric Yakobson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of AU2001296527A1 publication Critical patent/AU2001296527A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU2001296527A 2000-10-03 2001-10-03 Resist stripping process Abandoned AU2001296527A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09678465 2000-10-03
US09/678,465 US6440647B1 (en) 1998-02-26 2000-10-03 Resist stripping process
PCT/US2001/030923 WO2002029496A1 (en) 2000-10-03 2001-10-03 Resist stripping process

Publications (1)

Publication Number Publication Date
AU2001296527A1 true AU2001296527A1 (en) 2002-04-15

Family

ID=24722898

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001296527A Abandoned AU2001296527A1 (en) 2000-10-03 2001-10-03 Resist stripping process

Country Status (3)

Country Link
US (1) US6440647B1 (en)
AU (1) AU2001296527A1 (en)
WO (1) WO2002029496A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7276454B2 (en) * 2002-11-02 2007-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US7632756B2 (en) * 2004-08-26 2009-12-15 Applied Materials, Inc. Semiconductor processing using energized hydrogen gas and in combination with wet cleaning
US7235479B2 (en) * 2004-08-26 2007-06-26 Applied Materials, Inc. Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials
JP4846301B2 (en) * 2004-08-30 2011-12-28 サムスン エレクトロニクス カンパニー リミテッド Thin film transistor substrate manufacturing method and stripping composition
JP4695679B2 (en) * 2008-08-21 2011-06-08 株式会社東芝 Template cleaning method and pattern forming method
KR20110018775A (en) * 2009-08-18 2011-02-24 삼성전자주식회사 Composition for peeling color filter and method for reproducing color filter using same
TWI410758B (en) * 2010-11-11 2013-10-01 Kanto Ppc Inc A barrier removal fluid composition, and a method of removing the barrier layer
US8975008B2 (en) * 2012-05-24 2015-03-10 Rohm And Haas Electronic Materials Llc Method of removing negative acting photoresists
CN107833660A (en) * 2017-08-02 2018-03-23 乐星红旗电缆(湖北)有限公司 A kind of guide cable

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE143920C (en)
US3980587A (en) 1974-08-16 1976-09-14 G. T. Schjeldahl Company Stripper composition
GB1573206A (en) 1975-11-26 1980-08-20 Tokyo Shibaura Electric Co Method of trating surfaces of intermediate products obtained in the manufacture of semiconductor devices
US4078102A (en) 1976-10-29 1978-03-07 International Business Machines Corporation Process for stripping resist layers from substrates
US4867799A (en) 1985-06-13 1989-09-19 Purusar Corporation Ammonium vapor phase stripping of wafers
DE3530282A1 (en) * 1985-08-24 1987-03-05 Hoechst Ag METHOD FOR DE-COATING LIGHT-CURED PHOTORESIS LAYERS
WO1988005813A1 (en) * 1987-02-05 1988-08-11 Macdermid, Incorporated Photoresist stripper composition
JP2591644B2 (en) 1987-03-11 1997-03-19 東京応化工業株式会社 Photoresist stripper
JP2553872B2 (en) 1987-07-21 1996-11-13 東京応化工業株式会社 Stripping solution for photoresist
US5902718A (en) 1990-04-27 1999-05-11 Mitsubishi Denki Kabushiki Kaisha Methods and developer for developing a positive photoresist
US5200031A (en) * 1991-08-26 1993-04-06 Applied Materials, Inc. Method for removal of photoresist over metal which also removes or inactivates corrosion-forming materials remaining from one or more previous metal etch steps
DE4141403A1 (en) 1991-12-16 1993-06-17 Hoechst Ag METHOD FOR DE-COATING LIGHT-CROSS-LINKED PHOTORESIS STENCILS
US5407788A (en) * 1993-06-24 1995-04-18 At&T Corp. Photoresist stripping method
US5545353A (en) 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
KR0147659B1 (en) 1995-08-18 1998-08-17 김광호 Cleaning solution for semiconductor device and cleaning method using the same
US5814588A (en) 1996-03-19 1998-09-29 Church & Dwight Co., Inc. Aqueous alkali cleaning compositions
US5759973A (en) 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
JPH10239865A (en) * 1997-02-24 1998-09-11 Jsr Corp Stripper composition for negative photoresist

Also Published As

Publication number Publication date
WO2002029496A1 (en) 2002-04-11
US6440647B1 (en) 2002-08-27

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