AU2001296527A1 - Resist stripping process - Google Patents
Resist stripping processInfo
- Publication number
- AU2001296527A1 AU2001296527A1 AU2001296527A AU9652701A AU2001296527A1 AU 2001296527 A1 AU2001296527 A1 AU 2001296527A1 AU 2001296527 A AU2001296527 A AU 2001296527A AU 9652701 A AU9652701 A AU 9652701A AU 2001296527 A1 AU2001296527 A1 AU 2001296527A1
- Authority
- AU
- Australia
- Prior art keywords
- stripping process
- resist stripping
- resist
- stripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09678465 | 2000-10-03 | ||
| US09/678,465 US6440647B1 (en) | 1998-02-26 | 2000-10-03 | Resist stripping process |
| PCT/US2001/030923 WO2002029496A1 (en) | 2000-10-03 | 2001-10-03 | Resist stripping process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001296527A1 true AU2001296527A1 (en) | 2002-04-15 |
Family
ID=24722898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001296527A Abandoned AU2001296527A1 (en) | 2000-10-03 | 2001-10-03 | Resist stripping process |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6440647B1 (en) |
| AU (1) | AU2001296527A1 (en) |
| WO (1) | WO2002029496A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7276454B2 (en) * | 2002-11-02 | 2007-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
| US8338087B2 (en) * | 2004-03-03 | 2012-12-25 | Advanced Technology Materials, Inc | Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate |
| US7632756B2 (en) * | 2004-08-26 | 2009-12-15 | Applied Materials, Inc. | Semiconductor processing using energized hydrogen gas and in combination with wet cleaning |
| US7235479B2 (en) * | 2004-08-26 | 2007-06-26 | Applied Materials, Inc. | Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials |
| JP4846301B2 (en) * | 2004-08-30 | 2011-12-28 | サムスン エレクトロニクス カンパニー リミテッド | Thin film transistor substrate manufacturing method and stripping composition |
| JP4695679B2 (en) * | 2008-08-21 | 2011-06-08 | 株式会社東芝 | Template cleaning method and pattern forming method |
| KR20110018775A (en) * | 2009-08-18 | 2011-02-24 | 삼성전자주식회사 | Composition for peeling color filter and method for reproducing color filter using same |
| TWI410758B (en) * | 2010-11-11 | 2013-10-01 | Kanto Ppc Inc | A barrier removal fluid composition, and a method of removing the barrier layer |
| US8975008B2 (en) * | 2012-05-24 | 2015-03-10 | Rohm And Haas Electronic Materials Llc | Method of removing negative acting photoresists |
| CN107833660A (en) * | 2017-08-02 | 2018-03-23 | 乐星红旗电缆(湖北)有限公司 | A kind of guide cable |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE143920C (en) | ||||
| US3980587A (en) | 1974-08-16 | 1976-09-14 | G. T. Schjeldahl Company | Stripper composition |
| GB1573206A (en) | 1975-11-26 | 1980-08-20 | Tokyo Shibaura Electric Co | Method of trating surfaces of intermediate products obtained in the manufacture of semiconductor devices |
| US4078102A (en) | 1976-10-29 | 1978-03-07 | International Business Machines Corporation | Process for stripping resist layers from substrates |
| US4867799A (en) | 1985-06-13 | 1989-09-19 | Purusar Corporation | Ammonium vapor phase stripping of wafers |
| DE3530282A1 (en) * | 1985-08-24 | 1987-03-05 | Hoechst Ag | METHOD FOR DE-COATING LIGHT-CURED PHOTORESIS LAYERS |
| WO1988005813A1 (en) * | 1987-02-05 | 1988-08-11 | Macdermid, Incorporated | Photoresist stripper composition |
| JP2591644B2 (en) | 1987-03-11 | 1997-03-19 | 東京応化工業株式会社 | Photoresist stripper |
| JP2553872B2 (en) | 1987-07-21 | 1996-11-13 | 東京応化工業株式会社 | Stripping solution for photoresist |
| US5902718A (en) | 1990-04-27 | 1999-05-11 | Mitsubishi Denki Kabushiki Kaisha | Methods and developer for developing a positive photoresist |
| US5200031A (en) * | 1991-08-26 | 1993-04-06 | Applied Materials, Inc. | Method for removal of photoresist over metal which also removes or inactivates corrosion-forming materials remaining from one or more previous metal etch steps |
| DE4141403A1 (en) | 1991-12-16 | 1993-06-17 | Hoechst Ag | METHOD FOR DE-COATING LIGHT-CROSS-LINKED PHOTORESIS STENCILS |
| US5407788A (en) * | 1993-06-24 | 1995-04-18 | At&T Corp. | Photoresist stripping method |
| US5545353A (en) | 1995-05-08 | 1996-08-13 | Ocg Microelectronic Materials, Inc. | Non-corrosive photoresist stripper composition |
| KR0147659B1 (en) | 1995-08-18 | 1998-08-17 | 김광호 | Cleaning solution for semiconductor device and cleaning method using the same |
| US5814588A (en) | 1996-03-19 | 1998-09-29 | Church & Dwight Co., Inc. | Aqueous alkali cleaning compositions |
| US5759973A (en) | 1996-09-06 | 1998-06-02 | Olin Microelectronic Chemicals, Inc. | Photoresist stripping and cleaning compositions |
| JPH10239865A (en) * | 1997-02-24 | 1998-09-11 | Jsr Corp | Stripper composition for negative photoresist |
-
2000
- 2000-10-03 US US09/678,465 patent/US6440647B1/en not_active Expired - Fee Related
-
2001
- 2001-10-03 WO PCT/US2001/030923 patent/WO2002029496A1/en not_active Ceased
- 2001-10-03 AU AU2001296527A patent/AU2001296527A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002029496A1 (en) | 2002-04-11 |
| US6440647B1 (en) | 2002-08-27 |
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