AU2001295749A1 - Segmented wafer polishing pad - Google Patents

Segmented wafer polishing pad

Info

Publication number: AU2001295749A1
Authority: AU; Australia
Prior art keywords: polishing pad; wafer polishing; segmented wafer; segmented; pad
Prior art date: 2000-10-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2001295749A

Inventor

John Edmund Leigh Kruger

Stephen Victor Middleton

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

H K FOUNDERS Ltd

Original Assignee

H K FOUNDERS Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-10-20

Filing date

2001-10-19

Publication date

2002-04-29

2001-10-19 Application filed by H K FOUNDERS Ltd filed Critical H K FOUNDERS Ltd

2002-04-29 Publication of AU2001295749A1 publication Critical patent/AU2001295749A1/en

Status Abandoned legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Packaging Frangible Articles (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)

AU2001295749A 2000-10-20 2001-10-19 Segmented wafer polishing pad Abandoned AU2001295749A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
GBGB0025745.1A GB0025745D0 (en)	2000-10-20	2000-10-20	Semiconductor wafer manufacturing equipment
GB0025745		2000-10-20
PCT/GB2001/004654 WO2002032624A1 (en)	2000-10-20	2001-10-19	Segmented wafer polishing pad

Publications (1)

Publication Number	Publication Date
AU2001295749A1 true AU2001295749A1 (en)	2002-04-29

Family

ID=9901684

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2001295749A Abandoned AU2001295749A1 (en)	2000-10-20	2001-10-19	Segmented wafer polishing pad

Country Status (5)

Country	Link
US (1)	US20040029501A1 (en)
EP (1)	EP1328377A1 (en)
AU (1)	AU2001295749A1 (en)
GB (1)	GB0025745D0 (en)
WO (1)	WO2002032624A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101034506B1 (en) *	2008-11-28	2011-05-17	세메스 주식회사	Polishing unit, substrate polishing apparatus having same, and substrate polishing method using same
JP7158813B2 (en) *	2018-06-28	2022-10-24	株式会社ディスコ	grinding wheel

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4037367A (en) *	1975-12-22	1977-07-26	Kruse James A	Grinding tool
JPS60242975A (en) *	1984-05-14	1985-12-02	Kanebo Ltd	Surface grinding device
US4996798A (en) *	1989-05-31	1991-03-05	Moore Steven C	Ultra-precision lapping apparatus
US5076024A (en) *	1990-08-24	1991-12-31	Intelmatec Corporation	Disk polisher assembly
JP2985490B2 (en) *	1992-02-28	1999-11-29	信越半導体株式会社	Heat removal method of polishing machine
AU654901B2 (en) *	1992-03-16	1994-11-24	De Beers Industrial Diamond Division (Proprietary) Limited	Polishing pad
US5243790A (en) *	1992-06-25	1993-09-14	Abrasifs Vega, Inc.	Abrasive member
US6019672A (en) *	1994-09-08	2000-02-01	Struers A/S	Grinding/polishing cover sheet for placing on a rotatable grinding/polishing disc
WO1998017438A1 (en) *	1996-10-18	1998-04-30	Kanebo Limited	Surface polishing apparatus
US5873772A (en) *	1997-04-10	1999-02-23	Komatsu Electronic Metals Co., Ltd.	Method for polishing the top and bottom of a semiconductor wafer simultaneously
US5888121A (en) *	1997-09-23	1999-03-30	Lsi Logic Corporation	Controlling groove dimensions for enhanced slurry flow
GB2345255B (en) *	1998-12-29	2000-12-27	United Microelectronics Corp	Chemical-Mechanical Polishing Pad
JP2000326235A (en) *	1999-05-17	2000-11-28	Inst Of Physical & Chemical Res	ELID grinding wheel and ELID surface grinding device using the same

2000
- 2000-10-20 GB GBGB0025745.1A patent/GB0025745D0/en not_active Ceased
2001
- 2001-10-19 EP EP01976480A patent/EP1328377A1/en not_active Withdrawn
- 2001-10-19 WO PCT/GB2001/004654 patent/WO2002032624A1/en not_active Ceased
- 2001-10-19 US US10/399,949 patent/US20040029501A1/en not_active Abandoned
- 2001-10-19 AU AU2001295749A patent/AU2001295749A1/en not_active Abandoned

Also Published As

Publication number	Publication date
US20040029501A1 (en)	2004-02-12
WO2002032624A1 (en)	2002-04-25
GB0025745D0 (en)	2000-12-06
EP1328377A1 (en)	2003-07-23

Similar Documents

Publication	Publication Date	Title
AU2002360661A1 (en)	2003-07-09	Polishing pad
AU8453298A (en)	1999-02-22	Polishing semiconductor wafers
AU2001251318A1 (en)	2001-10-23	Integrated chemical-mechanical polishing
EP1295680A3 (en)	2003-09-10	Polishing pad for semiconductor wafer
AU2001247107A1 (en)	2002-06-18	Sanding sponge
AU2001227775A1 (en)	2001-07-31	Polishing pad with release layer
AU2003228036A1 (en)	2003-12-12	Microporous polishing pad
SG90227A1 (en)	2002-07-23	Polishing slurry
AU2001253180A1 (en)	2001-12-03	A chemical-mechanical polishing system for the manufacture of semiconductor devices
AU2002225654A1 (en)	2002-06-03	Improved cleaning pad
AU2001249533A1 (en)	2001-10-15	Wafer carrier head assembly
AU2003225999A1 (en)	2003-10-13	Smooth pads for cmp and polishing substrates
AUPQ777500A0 (en)	2000-06-22	Grinding apparatus
AU2002342182A1 (en)	2003-05-12	Pads for cmp and polishing substrates
AU2002334406A1 (en)	2003-03-18	Polishing composition
AU2001288930A1 (en)	2002-04-08	Wafer carrier for cmp system
GB2361447B (en)	2002-05-15	Wafer polishing apparatus
AU1784001A (en)	2001-07-09	Abrasives for chemical mechanical polishing
AU2001278101A1 (en)	2002-02-13	Abrasive pad
GB2361448B (en)	2002-05-29	Wafer polishing apparatus
AU2002350031A1 (en)	2003-05-12	Polishing pads and manufacturing methods
AUPQ652300A0 (en)	2000-04-20	Surface finishing pad
GB2366755B (en)	2004-11-10	Wafer polishing apparatus
AU2001295749A1 (en)	2002-04-29	Segmented wafer polishing pad
AUPR135000A0 (en)	2000-11-30	Sander