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AU2001251318A1 - Integrated chemical-mechanical polishing - Google Patents

Integrated chemical-mechanical polishing

Info

Publication number
AU2001251318A1
AU2001251318A1 AU2001251318A AU5131801A AU2001251318A1 AU 2001251318 A1 AU2001251318 A1 AU 2001251318A1 AU 2001251318 A AU2001251318 A AU 2001251318A AU 5131801 A AU5131801 A AU 5131801A AU 2001251318 A1 AU2001251318 A1 AU 2001251318A1
Authority
AU
Australia
Prior art keywords
mechanical polishing
integrated chemical
chemical
integrated
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251318A
Inventor
Gregory H. Bogush
Jeffrey P. Chamberlain
Paul M. Feeney
Steven K. Grumbine
Brian L Mueller
David J. Schroeder
Bradley J. Staley
Alicia F. Walters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of AU2001251318A1 publication Critical patent/AU2001251318A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H10P52/402—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001251318A 2000-04-07 2001-04-05 Integrated chemical-mechanical polishing Abandoned AU2001251318A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19574400P 2000-04-07 2000-04-07
US60195744 2000-04-07
PCT/US2001/011026 WO2001076819A1 (en) 2000-04-07 2001-04-05 Integrated chemical-mechanical polishing

Publications (1)

Publication Number Publication Date
AU2001251318A1 true AU2001251318A1 (en) 2001-10-23

Family

ID=22722606

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251318A Abandoned AU2001251318A1 (en) 2000-04-07 2001-04-05 Integrated chemical-mechanical polishing

Country Status (9)

Country Link
US (1) US20010037821A1 (en)
EP (1) EP1272311A1 (en)
JP (1) JP2003530227A (en)
KR (1) KR20020088428A (en)
CN (1) CN1422200A (en)
AU (1) AU2001251318A1 (en)
IL (1) IL151862A0 (en)
TW (1) TW555615B (en)
WO (1) WO2001076819A1 (en)

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KR100398141B1 (en) * 2000-10-12 2003-09-13 아남반도체 주식회사 Chemical mechanical polishing slurry composition and planarization method using same for semiconductor device
US6485355B1 (en) * 2001-06-22 2002-11-26 International Business Machines Corporation Method to increase removal rate of oxide using fixed-abrasive
WO2003020839A1 (en) * 2001-09-03 2003-03-13 Showa Denko K.K. Polishing composition
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US7077880B2 (en) * 2004-01-16 2006-07-18 Dupont Air Products Nanomaterials Llc Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
US7182882B2 (en) * 2002-01-02 2007-02-27 Intel Corporation Method of improving chemical mechanical polish endpoint signals by use of chemical additives
US7524346B2 (en) 2002-01-25 2009-04-28 Dupont Air Products Nanomaterials Llc Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
US7513920B2 (en) * 2002-02-11 2009-04-07 Dupont Air Products Nanomaterials Llc Free radical-forming activator attached to solid and used to enhance CMP formulations
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6732017B2 (en) * 2002-02-15 2004-05-04 Lam Research Corp. System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
US20040248415A1 (en) * 2002-02-20 2004-12-09 Yutaka Wada Polishing method and polishing liquid
KR100497608B1 (en) * 2002-08-05 2005-07-01 삼성전자주식회사 A slurry composition, a method for manufacturing the same and a method for polishing using the same
US20040074517A1 (en) * 2002-10-22 2004-04-22 Texas Instruments Incorporated Surfactants for chemical mechanical polishing
US6908366B2 (en) * 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
WO2004062849A1 (en) * 2003-01-10 2004-07-29 3M Innovative Properties Company Pad constructions for chemical mechanical planarization applications
JP4336550B2 (en) * 2003-09-09 2009-09-30 花王株式会社 Polishing liquid kit for magnetic disk
KR100630678B1 (en) 2003-10-09 2006-10-02 삼성전자주식회사 A slurry for chemical mechanical polishing of an aluminum film, a chemical mechanical polishing method using the slurry, and an aluminum wiring forming method using the method
US7344988B2 (en) * 2003-10-27 2008-03-18 Dupont Air Products Nanomaterials Llc Alumina abrasive for chemical mechanical polishing
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride
KR100554517B1 (en) * 2004-04-14 2006-03-03 삼성전자주식회사 Cleaning liquid of silicon germanium layer and cleaning method using the same
US20060021972A1 (en) * 2004-07-28 2006-02-02 Lane Sarah J Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
US7279424B2 (en) * 2004-08-27 2007-10-09 Hitachi Global Storage Technologies Netherlands B.V. Method for fabricating thin film magnetic heads using CMP with polishing stop layer
US20060191871A1 (en) * 2005-02-25 2006-08-31 Sheng-Yu Chen Cmp slurry delivery system and method of mixing slurry thereof
KR100827594B1 (en) * 2006-11-07 2008-05-07 제일모직주식회사 Polycrystalline Silicon Polishing CPM Slurry Composition And Method Of Making The Same
KR100643628B1 (en) * 2005-11-04 2006-11-10 제일모직주식회사 Polycrystalline Silicon Polishing CPM Slurry Composition And Method Of Making The Same
US7294576B1 (en) * 2006-06-29 2007-11-13 Cabot Microelectronics Corporation Tunable selectivity slurries in CMP applications
JP5060755B2 (en) * 2006-09-29 2012-10-31 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer rough polishing method and semiconductor wafer polishing apparatus
US9343330B2 (en) * 2006-12-06 2016-05-17 Cabot Microelectronics Corporation Compositions for polishing aluminum/copper and titanium in damascene structures
US8448880B2 (en) 2007-09-18 2013-05-28 Flow International Corporation Apparatus and process for formation of laterally directed fluid jets
US7981221B2 (en) * 2008-02-21 2011-07-19 Micron Technology, Inc. Rheological fluids for particle removal
WO2010062818A2 (en) * 2008-11-26 2010-06-03 Applied Materials, Inc. Two-line mixing of chemical and abrasive particles with endpoint control for chemical mechanical polishing
TWI467645B (en) * 2010-08-25 2015-01-01 Macronix Int Co Ltd Chemical mechanical polishing method and system
KR102022139B1 (en) * 2012-03-16 2019-09-17 가부시키가이샤 후지미인코퍼레이티드 Polishing composition
CA2783349A1 (en) * 2012-07-18 2014-01-18 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Environment Decontamination of radionuclides on construction materials
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
RU2545295C1 (en) * 2014-02-03 2015-03-27 Открытое акционерное общество "НПО "Орион" Method for chemical-mechanical polishing of gallium arsenide plates
KR101693473B1 (en) * 2014-10-07 2017-01-10 한국생산기술연구원 Alumina composition for jet scrubbing process
US11117239B2 (en) * 2017-09-29 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing composition and method
CN109943235B (en) * 2017-12-20 2021-03-23 蓝思科技（长沙）有限公司 Water-based composite polishing solution for ceramic polishing and preparation method thereof
JP7339824B2 (en) * 2019-09-17 2023-09-06 株式会社ディスコ Flow rate adjustment method and pressure adjustment method
CN112225470A (en) * 2020-07-30 2021-01-15 河南镀邦光电股份有限公司 Cover plate glass cleaning solvent proportioning process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059929A (en) * 1976-05-10 1977-11-29 Chemical-Ways Corporation Precision metering system for the delivery of abrasive lapping and polishing slurries
KR100377304B1 (en) * 1994-07-19 2003-06-09 어플라이드 케미컬 솔루션즈, 인크. Apparatus and methods used in chemical-mechanical polishing processes
WO1999034956A1 (en) * 1998-01-12 1999-07-15 Conexant Systems, Inc. Economic supply and mixing method for multiple component cmp slurries

Also Published As

Publication number Publication date
IL151862A0 (en) 2003-04-10
TW555615B (en) 2003-10-01
CN1422200A (en) 2003-06-04
US20010037821A1 (en) 2001-11-08
WO2001076819A1 (en) 2001-10-18
KR20020088428A (en) 2002-11-27
JP2003530227A (en) 2003-10-14
EP1272311A1 (en) 2003-01-08

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