|
JP3535527B2
(en)
*
|
1997-06-24 |
2004-06-07 |
マサチューセッツ インスティテュート オブ テクノロジー |
Controlling threading dislocations in germanium-on-silicon using graded GeSi layer and planarization
|
|
US7227176B2
(en)
|
1998-04-10 |
2007-06-05 |
Massachusetts Institute Of Technology |
Etch stop layer system
|
|
US6750130B1
(en)
|
2000-01-20 |
2004-06-15 |
Amberwave Systems Corporation |
Heterointegration of materials using deposition and bonding
|
|
US6602613B1
(en)
|
2000-01-20 |
2003-08-05 |
Amberwave Systems Corporation |
Heterointegration of materials using deposition and bonding
|
|
US6518644B2
(en)
|
2000-01-20 |
2003-02-11 |
Amberwave Systems Corporation |
Low threading dislocation density relaxed mismatched epilayers without high temperature growth
|
|
JP2003158075A
(en)
*
|
2001-08-23 |
2003-05-30 |
Sumitomo Mitsubishi Silicon Corp |
Method for manufacturing semiconductor substrate, method for manufacturing field-effect transistor, semiconductor substrate and field-effect transistor
|
|
JP2004507084A
(en)
|
2000-08-16 |
2004-03-04 |
マサチューセッツ インスティテュート オブ テクノロジー |
Manufacturing process of semiconductor products using graded epitaxial growth
|
|
US6890835B1
(en)
*
|
2000-10-19 |
2005-05-10 |
International Business Machines Corporation |
Layer transfer of low defect SiGe using an etch-back process
|
|
US20020100942A1
(en)
*
|
2000-12-04 |
2002-08-01 |
Fitzgerald Eugene A. |
CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
|
|
US6649480B2
(en)
*
|
2000-12-04 |
2003-11-18 |
Amberwave Systems Corporation |
Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
|
|
US6724008B2
(en)
|
2001-03-02 |
2004-04-20 |
Amberwave Systems Corporation |
Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
|
|
US6703688B1
(en)
*
|
2001-03-02 |
2004-03-09 |
Amberwave Systems Corporation |
Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
|
|
US6900103B2
(en)
|
2001-03-02 |
2005-05-31 |
Amberwave Systems Corporation |
Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
|
|
US6593641B1
(en)
|
2001-03-02 |
2003-07-15 |
Amberwave Systems Corporation |
Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
|
|
US6830976B2
(en)
*
|
2001-03-02 |
2004-12-14 |
Amberwave Systems Corproation |
Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
|
|
US6940089B2
(en)
*
|
2001-04-04 |
2005-09-06 |
Massachusetts Institute Of Technology |
Semiconductor device structure
|
|
JP2002305293A
(en)
*
|
2001-04-06 |
2002-10-18 |
Canon Inc |
Semiconductor member manufacturing method and semiconductor device manufacturing method
|
|
US6717213B2
(en)
*
|
2001-06-29 |
2004-04-06 |
Intel Corporation |
Creation of high mobility channels in thin-body SOI devices
|
|
WO2003028106A2
(en)
|
2001-09-24 |
2003-04-03 |
Amberwave Systems Corporation |
Rf circuits including transistors having strained material layers
|
|
JP2003205336A
(en)
*
|
2002-01-08 |
2003-07-22 |
Tori Techno:Kk |
High strength stainless steel bolt and manufacturing method therefor
|
|
US6649492B2
(en)
|
2002-02-11 |
2003-11-18 |
International Business Machines Corporation |
Strained Si based layer made by UHV-CVD, and devices therein
|
|
FR2836159B1
(en)
*
|
2002-02-15 |
2004-05-07 |
Centre Nat Rech Scient |
METHOD FOR FORMING A LAYER OF SILICON CARBIDE OR ELEMENT III NITRIDE ON A SUITABLE SUBSTRATE
|
|
AU2003222003A1
(en)
|
2002-03-14 |
2003-09-29 |
Amberwave Systems Corporation |
Methods for fabricating strained layers on semiconductor substrates
|
|
US7307273B2
(en)
*
|
2002-06-07 |
2007-12-11 |
Amberwave Systems Corporation |
Control of strain in device layers by selective relaxation
|
|
US7335545B2
(en)
*
|
2002-06-07 |
2008-02-26 |
Amberwave Systems Corporation |
Control of strain in device layers by prevention of relaxation
|
|
US6995430B2
(en)
*
|
2002-06-07 |
2006-02-07 |
Amberwave Systems Corporation |
Strained-semiconductor-on-insulator device structures
|
|
US20030227057A1
(en)
*
|
2002-06-07 |
2003-12-11 |
Lochtefeld Anthony J. |
Strained-semiconductor-on-insulator device structures
|
|
US7615829B2
(en)
*
|
2002-06-07 |
2009-11-10 |
Amberwave Systems Corporation |
Elevated source and drain elements for strained-channel heterojuntion field-effect transistors
|
|
US7074623B2
(en)
*
|
2002-06-07 |
2006-07-11 |
Amberwave Systems Corporation |
Methods of forming strained-semiconductor-on-insulator finFET device structures
|
|
WO2003105206A1
(en)
*
|
2002-06-10 |
2003-12-18 |
Amberwave Systems Corporation |
Growing source and drain elements by selecive epitaxy
|
|
US6982474B2
(en)
*
|
2002-06-25 |
2006-01-03 |
Amberwave Systems Corporation |
Reacted conductive gate electrodes
|
|
US6936869B2
(en)
*
|
2002-07-09 |
2005-08-30 |
International Rectifier Corporation |
Heterojunction field effect transistors using silicon-germanium and silicon-carbon alloys
|
|
FR2842350B1
(en)
*
|
2002-07-09 |
2005-05-13 |
|
METHOD FOR TRANSFERRING A LAYER OF CONCEALED SEMICONDUCTOR MATERIAL
|
|
US7018910B2
(en)
|
2002-07-09 |
2006-03-28 |
S.O.I.Tec Silicon On Insulator Technologies S.A. |
Transfer of a thin layer from a wafer comprising a buffer layer
|
|
US6953736B2
(en)
*
|
2002-07-09 |
2005-10-11 |
S.O.I.Tec Silicon On Insulator Technologies S.A. |
Process for transferring a layer of strained semiconductor material
|
|
US6841457B2
(en)
*
|
2002-07-16 |
2005-01-11 |
International Business Machines Corporation |
Use of hydrogen implantation to improve material properties of silicon-germanium-on-insulator material made by thermal diffusion
|
|
KR100511656B1
(en)
*
|
2002-08-10 |
2005-09-07 |
주식회사 실트론 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same
|
|
US7375385B2
(en)
|
2002-08-23 |
2008-05-20 |
Amberwave Systems Corporation |
Semiconductor heterostructures having reduced dislocation pile-ups
|
|
US7594967B2
(en)
|
2002-08-30 |
2009-09-29 |
Amberwave Systems Corporation |
Reduction of dislocation pile-up formation during relaxed lattice-mismatched epitaxy
|
|
FR2892228B1
(en)
*
|
2005-10-18 |
2008-01-25 |
Soitec Silicon On Insulator |
METHOD FOR RECYCLING AN EPITAXY DONOR PLATE
|
|
EP1588415B1
(en)
*
|
2003-01-07 |
2012-11-28 |
Soitec |
Recycling by mechanical means of a wafer comprising a taking-off structure after taking-off a thin layer thereof
|
|
US20090325362A1
(en)
*
|
2003-01-07 |
2009-12-31 |
Nabil Chhaimi |
Method of recycling an epitaxied donor wafer
|
|
EP1588406B1
(en)
*
|
2003-01-27 |
2019-07-10 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor structures with structural homogeneity
|
|
US6995427B2
(en)
|
2003-01-29 |
2006-02-07 |
S.O.I.Tec Silicon On Insulator Technologies S.A. |
Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
|
|
JP3878997B2
(en)
*
|
2003-02-20 |
2007-02-07 |
国立大学法人名古屋大学 |
Thin wire structure manufacturing method, multilayer film structure, and multilayer film intermediate structure
|
|
US7348260B2
(en)
*
|
2003-02-28 |
2008-03-25 |
S.O.I.Tec Silicon On Insulator Technologies |
Method for forming a relaxed or pseudo-relaxed useful layer on a substrate
|
|
US20040192067A1
(en)
*
|
2003-02-28 |
2004-09-30 |
Bruno Ghyselen |
Method for forming a relaxed or pseudo-relaxed useful layer on a substrate
|
|
US7018909B2
(en)
|
2003-02-28 |
2006-03-28 |
S.O.I.Tec Silicon On Insulator Technologies S.A. |
Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
|
|
FR2851848B1
(en)
*
|
2003-02-28 |
2005-07-08 |
Soitec Silicon On Insulator |
RELAXATION AT HIGH TEMPERATURE OF A THIN LAYER AFTER TRANSFER
|
|
JP4585510B2
(en)
*
|
2003-03-07 |
2010-11-24 |
台湾積體電路製造股▲ふん▼有限公司 |
Shallow trench isolation process
|
|
US6909186B2
(en)
*
|
2003-05-01 |
2005-06-21 |
International Business Machines Corporation |
High performance FET devices and methods therefor
|
|
US7026249B2
(en)
*
|
2003-05-30 |
2006-04-11 |
International Business Machines Corporation |
SiGe lattice engineering using a combination of oxidation, thinning and epitaxial regrowth
|
|
US6943407B2
(en)
*
|
2003-06-17 |
2005-09-13 |
International Business Machines Corporation |
Low leakage heterojunction vertical transistors and high performance devices thereof
|
|
US6927414B2
(en)
*
|
2003-06-17 |
2005-08-09 |
International Business Machines Corporation |
High speed lateral heterojunction MISFETs realized by 2-dimensional bandgap engineering and methods thereof
|
|
TWI294670B
(en)
|
2003-06-17 |
2008-03-11 |
Ibm |
Ultra scalable high speed heterojunction vertical n-channel misfets and methods thereof
|
|
FR2858460B1
(en)
*
|
2003-07-30 |
2005-10-14 |
Soitec Silicon On Insulator |
STRENGTH SEMICONDUCTOR-OVER-INSULATING STRUCTURE HAVING STRESS RESISTANCE AT HIGH TEMPERATURES
|
|
US7170126B2
(en)
*
|
2003-09-16 |
2007-01-30 |
International Business Machines Corporation |
Structure of vertical strained silicon devices
|
|
US6767802B1
(en)
*
|
2003-09-19 |
2004-07-27 |
Sharp Laboratories Of America, Inc. |
Methods of making relaxed silicon-germanium on insulator via layer transfer
|
|
US7029980B2
(en)
*
|
2003-09-25 |
2006-04-18 |
Freescale Semiconductor Inc. |
Method of manufacturing SOI template layer
|
|
EP1519409B1
(en)
*
|
2003-09-26 |
2008-08-20 |
S.O.I. Tec Silicon on Insulator Technologies S.A. |
A method of fabrication of a substrate for an epitaxial growth
|
|
US6852652B1
(en)
*
|
2003-09-29 |
2005-02-08 |
Sharp Laboratories Of America, Inc. |
Method of making relaxed silicon-germanium on glass via layer transfer
|
|
US7084460B2
(en)
*
|
2003-11-03 |
2006-08-01 |
International Business Machines Corporation |
Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates
|
|
US20050116360A1
(en)
*
|
2003-12-01 |
2005-06-02 |
Chien-Chao Huang |
Complementary field-effect transistors and methods of manufacture
|
|
FR2863771B1
(en)
*
|
2003-12-10 |
2007-03-02 |
Soitec Silicon On Insulator |
PROCESS FOR PROCESSING A MULTILAYER WAFER HAVING A DIFFERENTIAL OF THERMAL CHARACTERISTICS
|
|
JP4700324B2
(en)
*
|
2003-12-25 |
2011-06-15 |
シルトロニック・ジャパン株式会社 |
Manufacturing method of semiconductor substrate
|
|
JP2005210062A
(en)
*
|
2003-12-26 |
2005-08-04 |
Canon Inc |
Semiconductor member, manufacturing method thereof, and semiconductor device
|
|
US20060124961A1
(en)
*
|
2003-12-26 |
2006-06-15 |
Canon Kabushiki Kaisha |
Semiconductor substrate, manufacturing method thereof, and semiconductor device
|
|
US7064037B2
(en)
*
|
2004-01-12 |
2006-06-20 |
Chartered Semiconductor Manufacturing Ltd. |
Silicon-germanium virtual substrate and method of fabricating the same
|
|
US6992025B2
(en)
*
|
2004-01-12 |
2006-01-31 |
Sharp Laboratories Of America, Inc. |
Strained silicon on insulator from film transfer and relaxation by hydrogen implantation
|
|
US7550370B2
(en)
*
|
2004-01-16 |
2009-06-23 |
International Business Machines Corporation |
Method of forming thin SGOI wafers with high relaxation and low stacking fault defect density
|
|
US7064396B2
(en)
*
|
2004-03-01 |
2006-06-20 |
Freescale Semiconductor, Inc. |
Integrated circuit with multiple spacer insulating region widths
|
|
JP3884439B2
(en)
*
|
2004-03-02 |
2007-02-21 |
株式会社東芝 |
Semiconductor device
|
|
FR2870043B1
(en)
*
|
2004-05-07 |
2006-11-24 |
Commissariat Energie Atomique |
MANUFACTURING OF ACTIVE ZONES OF DIFFERENT NATURE DIRECTLY ON INSULATION AND APPLICATION TO MOS TRANSISTOR WITH SINGLE OR DOUBLE GRID
|
|
WO2005120775A1
(en)
*
|
2004-06-08 |
2005-12-22 |
S.O.I. Tec Silicon On Insulator Technologies |
Planarization of a heteroepitaxial layer
|
|
US6893936B1
(en)
*
|
2004-06-29 |
2005-05-17 |
International Business Machines Corporation |
Method of Forming strained SI/SIGE on insulator with silicon germanium buffer
|
|
US7279400B2
(en)
*
|
2004-08-05 |
2007-10-09 |
Sharp Laboratories Of America, Inc. |
Method of fabricating single-layer and multi-layer single crystalline silicon and silicon devices on plastic using sacrificial glass
|
|
US7560361B2
(en)
*
|
2004-08-12 |
2009-07-14 |
International Business Machines Corporation |
Method of forming gate stack for semiconductor electronic device
|
|
US7241647B2
(en)
*
|
2004-08-17 |
2007-07-10 |
Freescale Semiconductor, Inc. |
Graded semiconductor layer
|
|
US7235812B2
(en)
*
|
2004-09-13 |
2007-06-26 |
International Business Machines Corporation |
Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques
|
|
DE102004053307B4
(en)
*
|
2004-11-04 |
2010-01-07 |
Siltronic Ag |
A multilayer structure comprising a substrate and a heteroepitaxially deposited layer of silicon and germanium thereon, and a method of making the same
|
|
DE102004054564B4
(en)
*
|
2004-11-11 |
2008-11-27 |
Siltronic Ag |
Semiconductor substrate and method for its production
|
|
US20060113603A1
(en)
*
|
2004-12-01 |
2006-06-01 |
Amberwave Systems Corporation |
Hybrid semiconductor-on-insulator structures and related methods
|
|
US7393733B2
(en)
*
|
2004-12-01 |
2008-07-01 |
Amberwave Systems Corporation |
Methods of forming hybrid fin field-effect transistor structures
|
|
FR2880988B1
(en)
*
|
2005-01-19 |
2007-03-30 |
Soitec Silicon On Insulator |
TREATMENT OF A LAYER IN SI1-yGEy TAKEN
|
|
US7470573B2
(en)
*
|
2005-02-18 |
2008-12-30 |
Sharp Laboratories Of America, Inc. |
Method of making CMOS devices on strained silicon on glass
|
|
EP1851789B1
(en)
*
|
2005-02-24 |
2013-05-01 |
Soitec |
Thermal oxidation of a sige layer and applications thereof
|
|
US7282402B2
(en)
*
|
2005-03-30 |
2007-10-16 |
Freescale Semiconductor, Inc. |
Method of making a dual strained channel semiconductor device
|
|
KR101045573B1
(en)
*
|
2005-07-06 |
2011-07-01 |
인터내쇼널 렉티파이어 코포레이션 |
III-nitride enhancement mode element
|
|
US8007675B1
(en)
*
|
2005-07-11 |
2011-08-30 |
National Semiconductor Corporation |
System and method for controlling an etch process for a single crystal having a buried layer
|
|
WO2007025062A2
(en)
*
|
2005-08-25 |
2007-03-01 |
Wakonda Technologies, Inc. |
Photovoltaic template
|
|
TW200733244A
(en)
*
|
2005-10-06 |
2007-09-01 |
Nxp Bv |
Semiconductor device
|
|
KR100741923B1
(en)
*
|
2005-10-12 |
2007-07-23 |
동부일렉트로닉스 주식회사 |
Semiconductor device and manufacturing method
|
|
EP1777735A3
(en)
*
|
2005-10-18 |
2009-08-19 |
S.O.I.Tec Silicon on Insulator Technologies |
Recycling process of an epitaxial donor wafer
|
|
FR2892733B1
(en)
*
|
2005-10-28 |
2008-02-01 |
Soitec Silicon On Insulator |
RELAXATION OF LAYERS
|
|
US7790565B2
(en)
*
|
2006-04-21 |
2010-09-07 |
Corning Incorporated |
Semiconductor on glass insulator made using improved thinning process
|
|
US20070277874A1
(en)
*
|
2006-05-31 |
2007-12-06 |
David Francis Dawson-Elli |
Thin film photovoltaic structure
|
|
KR100765024B1
(en)
*
|
2006-06-21 |
2007-10-09 |
닛산 지도우샤 가부시키가이샤 |
Manufacturing Method of Semiconductor Device
|
|
US20080070340A1
(en)
*
|
2006-09-14 |
2008-03-20 |
Nicholas Francis Borrelli |
Image sensor using thin-film SOI
|
|
US7442599B2
(en)
*
|
2006-09-15 |
2008-10-28 |
Sharp Laboratories Of America, Inc. |
Silicon/germanium superlattice thermal sensor
|
|
KR100880106B1
(en)
*
|
2006-12-29 |
2009-01-21 |
주식회사 실트론 |
Method for manufacturing SOI wafer which improves surface roughness by using SiSi sacrificial layer
|
|
FR2912549B1
(en)
*
|
2007-02-08 |
2009-06-05 |
Commissariat Energie Atomique |
PROCESS FOR PREPARING A GERMANIUM LAYER FROM A SILICON-GERMANIUM-INSULATING SUBSTRATE
|
|
US7897480B2
(en)
*
|
2007-04-23 |
2011-03-01 |
International Business Machines Corporation |
Preparation of high quality strained-semiconductor directly-on-insulator substrates
|
|
US8044294B2
(en)
*
|
2007-10-18 |
2011-10-25 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Thermoelectric materials and devices
|
|
FR2928775B1
(en)
*
|
2008-03-11 |
2011-12-09 |
Soitec Silicon On Insulator |
PROCESS FOR PRODUCING A SEMICONDUCTOR-TYPE SUBSTRATE ON INSULATION
|
|
FR2929758B1
(en)
*
|
2008-04-07 |
2011-02-11 |
Commissariat Energie Atomique |
TRANSFER METHOD USING A FERROELECTRIC SUBSTRATE
|
|
US7524740B1
(en)
|
2008-04-24 |
2009-04-28 |
International Business Machines Corporation |
Localized strain relaxation for strained Si directly on insulator
|
|
EP2151852B1
(en)
*
|
2008-08-06 |
2020-01-15 |
Soitec |
Relaxation and transfer of strained layers
|
|
DE102008059044B4
(en)
*
|
2008-11-26 |
2013-08-22 |
Siltronic Ag |
A method of polishing a semiconductor wafer with a strained-relaxed Si1-xGex layer
|
|
US8187901B2
(en)
|
2009-12-07 |
2012-05-29 |
Micron Technology, Inc. |
Epitaxial formation support structures and associated methods
|
|
US9245942B2
(en)
|
2011-02-25 |
2016-01-26 |
Kyocera Corporation |
Composite substrate, electronic component, and method of manufacturing composite substrate and electronic component
|
|
JP5830255B2
(en)
*
|
2011-03-03 |
2015-12-09 |
信越化学工業株式会社 |
Manufacturing method of semiconductor substrate
|
|
CN103165512A
(en)
*
|
2011-12-14 |
2013-06-19 |
中国科学院上海微系统与信息技术研究所 |
Extremely thin semiconductor-on-insulator material and preparation method thereof
|
|
US9614026B2
(en)
|
2013-03-13 |
2017-04-04 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
High mobility transport layer structures for rhombohedral Si/Ge/SiGe devices
|
|
US11721547B2
(en)
*
|
2013-03-14 |
2023-08-08 |
Infineon Technologies Ag |
Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device
|
|
FR3051595B1
(en)
*
|
2016-05-17 |
2022-11-18 |
Soitec Silicon On Insulator |
METHOD FOR MANUFACTURING A STRESSED-ON-INSULATOR SEMICONDUCTOR-TYPE SUBSTRATE
|
|
US9922941B1
(en)
|
2016-09-21 |
2018-03-20 |
International Business Machines Corporation |
Thin low defect relaxed silicon germanium layers on bulk silicon substrates
|
|
FR3061803B1
(en)
*
|
2017-01-11 |
2019-08-16 |
Soitec |
FRONT-SIDE TYPE IMAGE SENSOR SUBSTRATE AND METHOD OF MANUFACTURING SUCH A SUBSTRATE
|
|
FR3061802B1
(en)
|
2017-01-11 |
2019-08-16 |
Soitec |
FRONT-SIDE TYPE IMAGE SENSOR SUBSTRATE AND METHOD OF MANUFACTURING SUCH A SUBSTRATE
|
|
WO2023028766A1
(en)
|
2021-08-30 |
2023-03-09 |
长江存储科技有限责任公司 |
Three-dimensional memory and manufacturing method therefor
|
|
CN115527922A
(en)
*
|
2022-09-27 |
2022-12-27 |
广东省大湾区集成电路与系统应用研究院 |
Manufacturing method of semiconductor structure and semiconductor structure
|