AU2001290294A1 - Semiconductor mounting board, its manufacturing method, semiconductor package comprising this board, and its manufacturing method - Google Patents
Semiconductor mounting board, its manufacturing method, semiconductor package comprising this board, and its manufacturing methodInfo
- Publication number
- AU2001290294A1 AU2001290294A1 AU2001290294A AU9029401A AU2001290294A1 AU 2001290294 A1 AU2001290294 A1 AU 2001290294A1 AU 2001290294 A AU2001290294 A AU 2001290294A AU 9029401 A AU9029401 A AU 9029401A AU 2001290294 A1 AU2001290294 A1 AU 2001290294A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacturing
- board
- semiconductor
- semiconductor package
- mounting board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10W74/114—
-
- H10W70/688—
-
- H10W70/656—
-
- H10W72/073—
-
- H10W72/075—
-
- H10W72/522—
-
- H10W72/524—
-
- H10W72/5363—
-
- H10W72/5522—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/734—
-
- H10W90/754—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000294347 | 2000-09-27 | ||
| JP2000-294347 | 2000-09-27 | ||
| PCT/JP2001/008461 WO2002027787A1 (en) | 2000-09-27 | 2001-09-27 | Semiconductor mounting board, its manufacturing method, semiconductor package comprising this board, and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001290294A1 true AU2001290294A1 (en) | 2002-04-08 |
Family
ID=18776971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001290294A Abandoned AU2001290294A1 (en) | 2000-09-27 | 2001-09-27 | Semiconductor mounting board, its manufacturing method, semiconductor package comprising this board, and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3852405B2 (en) |
| AU (1) | AU2001290294A1 (en) |
| WO (1) | WO2002027787A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4819471B2 (en) * | 2005-10-12 | 2011-11-24 | 日本電気株式会社 | Wiring substrate, semiconductor device using the wiring substrate, and manufacturing method thereof |
| JP5456440B2 (en) | 2009-01-30 | 2014-03-26 | 日東電工株式会社 | Dicing tape integrated wafer back surface protection film |
| JP5640051B2 (en) * | 2009-01-30 | 2014-12-10 | 日東電工株式会社 | Manufacturing method of semiconductor device |
| JP5640050B2 (en) * | 2009-01-30 | 2014-12-10 | 日東電工株式会社 | Manufacturing method of semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3143081B2 (en) * | 1996-07-31 | 2001-03-07 | シャープ株式会社 | Chip support substrate for semiconductor package, semiconductor device, and method of manufacturing semiconductor device |
| JP2000106372A (en) * | 1998-09-29 | 2000-04-11 | Hitachi Chem Co Ltd | Double-sided adhesive film, organic substrate for semiconductor mounting and semiconductor device |
-
2001
- 2001-09-27 JP JP2002531483A patent/JP3852405B2/en not_active Expired - Lifetime
- 2001-09-27 WO PCT/JP2001/008461 patent/WO2002027787A1/en not_active Ceased
- 2001-09-27 AU AU2001290294A patent/AU2001290294A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002027787A1 (en) | 2002-04-04 |
| JP3852405B2 (en) | 2006-11-29 |
| JPWO2002027787A1 (en) | 2004-02-05 |
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