AU2001288119A1 - Epoxy resin molding material for sealing - Google Patents

Epoxy resin molding material for sealing

Info

Publication number: AU2001288119A1
Authority: AU; Australia
Prior art keywords: sealing; epoxy resin; molding material; resin molding; epoxy
Prior art date: 2000-09-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2001288119A

Inventor

Masanobu Fujii

Shinsuke Hagiwara

Ryoichi Ikezawa

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-09-25

Filing date

2001-09-25

Publication date

2002-04-02

2001-09-25 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

2002-04-02 Publication of AU2001288119A1 publication Critical patent/AU2001288119A1/en

Status Abandoned legal-status Critical Current

Classifications

- H10W74/47—
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
- H10W72/0198—
- H10W72/5445—
- H10W72/5522—
- H10W72/884—
- H10W72/932—
- H10W74/00—
- H10W90/734—
- H10W90/736—
- H10W90/754—
- H10W90/756—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Epoxy Resins (AREA)
Compositions Of Macromolecular Compounds (AREA)

AU2001288119A 2000-09-25 2001-09-25 Epoxy resin molding material for sealing Abandoned AU2001288119A1 (en)

Applications Claiming Priority (17)

Application Number	Priority Date	Filing Date	Title
JP2000291067		2000-09-25
JP2000-291067		2000-09-25
JP2000-402361		2000-12-28
JP2000402362		2000-12-28
JP2000402358		2000-12-28
JP2000-402363		2000-12-28
JP2000-402362		2000-12-28
JP2000402363		2000-12-28
JP2000-402359		2000-12-28
JP2000402361		2000-12-28
JP2000-402360		2000-12-28
JP2000402360		2000-12-28
JP2000-402358		2000-12-28
JP2000402359		2000-12-28
JP2001-82741		2001-03-22
JP2001082741		2001-03-22
PCT/JP2001/008303 WO2002024808A1 (en)	2000-09-25	2001-09-25	Epoxy resin molding material for sealing

Publications (1)

Publication Number	Publication Date
AU2001288119A1 true AU2001288119A1 (en)	2002-04-02

Family

ID=27573722

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2001288119A Abandoned AU2001288119A1 (en)	2000-09-25	2001-09-25	Epoxy resin molding material for sealing

Country Status (6)

Country	Link
US (2)	US20030201548A1 (en)
JP (1)	JP3511136B2 (en)
KR (1)	KR100524032B1 (en)
CN (1)	CN100462401C (en)
AU (1)	AU2001288119A1 (en)
WO (1)	WO2002024808A1 (en)

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AU2001292966B2 (en) *	2000-10-04	2007-06-28	James Hardie Technology Limited	Fiber cement composite materials using sized cellulose fibers
JP4568985B2 (en) *	2000-10-31	2010-10-27	住友ベークライト株式会社	Epoxy resin composition and semiconductor device
TW503496B (en)	2001-12-31	2002-09-21	Megic Corp	Chip packaging structure and manufacturing process of the same
TW584950B (en)	2001-12-31	2004-04-21	Megic Corp	Chip packaging structure and process thereof
US6673698B1 (en)	2002-01-19	2004-01-06	Megic Corporation	Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
TW544882B (en)	2001-12-31	2003-08-01	Megic Corp	Chip package structure and process thereof
KR100709660B1 (en) *	2002-02-27	2007-04-24	히다치 가세고교 가부시끼가이샤	Encapsulating Epoxy Resin Composition, and Electronic Parts Device Using the Same
WO2003072655A1 (en) *	2002-02-27	2003-09-04	Hitachi Chemical Co., Ltd.	Encapsulating epoxy resin composition, and electronic parts device using the same
US7157313B2 (en) *	2003-01-17	2007-01-02	Sumitomo Bakelite Co., Ltd.	Epoxy resin composition and semiconductor device using thereof
US6856009B2 (en)	2003-03-11	2005-02-15	Micron Technology, Inc.	Techniques for packaging multiple device components
TWI281924B (en) *	2003-04-07	2007-06-01	Hitachi Chemical Co Ltd	Epoxy resin molding material for sealing use and semiconductor device
US6936646B2 (en) *	2003-04-30	2005-08-30	Henkel Corporation	Flame-retardant molding compositions
US7456235B2 (en) *	2003-04-30	2008-11-25	Henkel Corporation	Flame-retardant composition for coating powders
US20050165202A1 (en) *	2003-10-20	2005-07-28	Shinya Nakamura	Curing accelerator for curing resin, curing resin composition and electronic component device
JP4525141B2 (en) *	2003-10-21	2010-08-18	住友ベークライト株式会社	Method for producing epoxy resin composition for semiconductor encapsulation and method for producing epoxy resin composition for area mounting type semiconductor encapsulation
CN100523046C (en) *	2004-03-03	2009-08-05	日立化成工业株式会社	Epoxy resin molding material for sealing and electronic device
TW200602427A (en) *	2004-03-30	2006-01-16	Taiyo Ink Mfg Co Ltd	Thermosetting resin composition and multilayered printed wiring board comprising the same
KR100599865B1 (en) *	2004-05-04	2006-07-13	제일모직주식회사	Epoxy Resin Compositions for Semiconductor Device Sealing
WO2006006593A1 (en) *	2004-07-13	2006-01-19	Hitachi Chemical Co., Ltd.	Epoxy resin molding material for sealing and electronic component device
WO2006006592A1 (en) *	2004-07-13	2006-01-19	Hitachi Chemical Co., Ltd.	Epoxy resin molding material for sealing and electronic component device
WO2007007843A1 (en) *	2005-07-13	2007-01-18	Hitachi Chemical Co., Ltd.	Epoxy resin composition for encapsulation and electronic part device
KR100696878B1 (en) *	2005-12-30	2007-03-20	제일모직주식회사	Epoxy Resin Compositions for Semiconductor Device Sealing
JP4484831B2 (en) *	2006-03-02	2010-06-16	パナソニック株式会社	Electronic component built-in module and method of manufacturing electronic component built-in module
DE102006022748B4 (en) *	2006-05-12	2019-01-17	Infineon Technologies Ag	Semiconductor device with surface mount devices and method of making the same
JP5045985B2 (en) *	2006-09-27	2012-10-10	日立化成工業株式会社	Epoxy resin composition and electronic component device
EP1911579A1 (en) *	2006-10-04	2008-04-16	Shin-Etsu Chemical Co., Ltd.	Epoxy resin composition for encapsulating semiconductor device and thin semicondutor device
JP2007169655A (en) *	2007-01-22	2007-07-05	Nitto Denko Corp	Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP5177763B2 (en) *	2009-06-04	2013-04-10	日東電工株式会社	Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP5752784B2 (en)	2010-04-16	2015-07-22	ヴァルスパー・ソーシング・インコーポレーテッド	COATING COMPOSITION FOR PACKAGE ARTICLE AND COATING METHOD
CN102339818B (en) *	2010-07-15	2014-04-30	台达电子工业股份有限公司	Power module and manufacturing method thereof
JP5272199B2 (en) *	2010-11-10	2013-08-28	日立化成株式会社	Manufacturing method of semiconductor devices
CN102558769B (en) *	2010-12-31	2015-11-25	第一毛织株式会社	For the composition epoxy resin of encapsulated semiconductor device and the semiconducter device that encapsulated by this composition epoxy resin
CN103347967B (en)	2011-02-07	2016-10-19	威士伯采购公司	Coating composition and coating method for containers and other articles
US8941962B2 (en) *	2011-09-13	2015-01-27	Fsp Technology Inc.	Snubber circuit and method of using bipolar junction transistor in snubber circuit
JP5769674B2 (en) *	2012-08-08	2015-08-26	日東電工株式会社	Resin sheet for encapsulating electronic components, resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device
RU2618704C2 (en)	2012-08-09	2017-05-11	Вэлспар Сорсинг, Инк.	Compositions for containers and other products and their application methods
MX380974B (en)	2012-08-09	2025-03-12	Swimc Llc	CONTAINER COATING SYSTEM.
KR102429146B1 (en)	2014-04-14	2022-08-04	에스더블유아이엠씨 엘엘씨	Methods of preparing compositions for containers and other articles and methods of using same
US20160093851A1 (en) *	2014-09-30	2016-03-31	Johnson Controls Technology Company	Battery module with individually restrained battery cells
TWI614275B (en)	2015-11-03	2018-02-11	Valspar Sourcing Inc	Liquid epoxy resin composition for preparing a polymer
CN112533995B (en) *	2018-08-06	2022-07-08	大八化学工业株式会社	Flame retardant for thermosetting resin containing aromatic phosphate, thermosetting resin composition containing same, cured product thereof, and use thereof
WO2021048977A1 (en) *	2019-09-12	2021-03-18	昭和電工マテリアルズ株式会社	Sealing material for compression molding and electronic component device
US20240047438A1 (en) *	2020-12-18	2024-02-08	Rohm Co., Ltd.	Semiconductor equipment

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2606714B2 (en) *	1988-01-25	1997-05-07	ファナック株式会社	Numerical control unit
JPH0714744B2 (en) *	1988-12-15	1995-02-22	旭有機材工業株式会社	Tray for integrated circuits
KR960012452B1 (en) *	1989-02-20	1996-09-20	토레이 가부시키가이샤	Semiconductor device-encapsulating epoxy resin composition
EP0812883A4 (en) *	1995-12-28	2001-05-16	Toray Industries	EPOXY RESIN COMPOSITION
JP3267144B2 (en)	1996-03-22	2002-03-18	松下電工株式会社	Epoxy resin composition for sealing material and semiconductor device using the same
JP3257426B2 (en) *	1996-12-27	2002-02-18	日立化成工業株式会社	Epoxy resin molding material for sealing electronic parts and electronic parts
JPH10195179A (en)	1997-01-08	1998-07-28	Shin Etsu Chem Co Ltd	Epoxy resin composition for semiconductor encapsulation and semiconductor device
JPH10237161A (en)	1997-02-24	1998-09-08	Toray Ind Inc	Epoxy resin composition
JPH10237160A (en)	1997-02-24	1998-09-08	Toray Ind Inc	Epoxy resin composition, and semiconductor device
JPH10279665A (en) *	1997-04-01	1998-10-20	Toray Ind Inc	Epoxy resin composition for semiconductor encapsulation
JP3890681B2 (en) *	1997-06-30	2007-03-07	日立化成工業株式会社	Epoxy resin molding material for electronic component sealing and electronic component
JP3295629B2 (en) *	1997-10-24	2002-06-24	日立化成工業株式会社	Epoxy resin molding material for sealing electronic parts and electronic parts
JP3295630B2 (en) *	1997-10-24	2002-06-24	日立化成工業株式会社	Epoxy resin molding material for sealing electronic parts and electronic parts
US6139978A (en) *	1998-01-12	2000-10-31	Shin-Etsu Chemical Co., Ltd.	Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
JP3295643B2 (en) *	1998-03-19	2002-06-24	日立化成工業株式会社	Epoxy resin molding compound for sealing and electronic component device
KR100562454B1 (en) *	1998-07-21	2006-03-21	신에쓰 가가꾸 고교 가부시끼가이샤	Epoxy Resin Compositions for Sealing Semiconductor and Semiconductor Devices
JP2000129093A (en)	1998-10-26	2000-05-09	Hitachi Chem Co Ltd	Epoxy resin molding material for sealing and electronic component device

2001
- 2001-09-25 AU AU2001288119A patent/AU2001288119A1/en not_active Abandoned
- 2001-09-25 CN CNB018161766A patent/CN100462401C/en not_active Expired - Lifetime
- 2001-09-25 KR KR10-2003-7004296A patent/KR100524032B1/en not_active Expired - Lifetime
- 2001-09-25 US US10/381,052 patent/US20030201548A1/en not_active Abandoned
- 2001-09-25 JP JP2002529210A patent/JP3511136B2/en not_active Expired - Fee Related
- 2001-09-25 WO PCT/JP2001/008303 patent/WO2002024808A1/en not_active Ceased
2005
- 2005-10-28 US US11/260,463 patent/US7544727B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
WO2002024808A1 (en)	2002-03-28
US20030201548A1 (en)	2003-10-30
KR100524032B1 (en)	2005-10-26
US7544727B2 (en)	2009-06-09
US20060074150A1 (en)	2006-04-06
JPWO2002024808A1 (en)	2004-01-29
JP3511136B2 (en)	2004-03-29
KR20030040492A (en)	2003-05-22
CN100462401C (en)	2009-02-18
CN1466610A (en)	2004-01-07

Publication	Publication Date	Title
AU2001288119A1 (en)	2002-04-02	Epoxy resin molding material for sealing
AU3191899A (en)	1999-11-23	Epoxy/thermoplastic photocurable adhesive composition
AU2001240264A1 (en)	2001-11-01	Resin composition, molding material, and molded object
AU4558300A (en)	2000-11-17	Thermoplastic moulding materials
AU2003271156A1 (en)	2004-05-04	Thermoplastic resin composition and molding thereof
AU2001262679A1 (en)	2001-12-11	Synthetic resin pallet
AU2001294186A1 (en)	2002-04-29	Apatite-reinforced resin composition
AU2002358184A1 (en)	2003-07-15	Self-lubricating plastics material for sealing elements
AU5676900A (en)	2001-01-02	Thermoplastic molding compounds
AU2001272499A1 (en)	2002-01-02	Plastic material pallet
SG101993A1 (en)	2004-02-27	Thermoplastic resin composition
AU2002349637A1 (en)	2003-06-10	Synthetic resin container
GB2369123B (en)	2002-11-27	Resin composition for coating material
GB2346107B (en)	2003-07-30	Resin mold
AU2001233775A1 (en)	2001-08-27	Thermosetting resin composition
GB0121471D0 (en)	2001-10-24	Resin composition for soft relining material
AU2003252508A1 (en)	2004-02-09	Resin molding machine
AU2001286225A1 (en)	2002-06-11	Liquid epoxy resin composition for encapsulating material
AU2003241990A1 (en)	2003-12-19	Thermoplastic resin composition
SG106607A1 (en)	2004-10-29	Method for injection-molding of resin.
AU3333499A (en)	1999-11-08	Thermoplastic moulding materials
AU2002233195A1 (en)	2002-06-18	Thermoplastic moulding materials
GB2361006B (en)	2003-12-03	Resin composition for injection molding
AU2001287110A1 (en)	2002-03-26	A process for making a thermoplastic molding composition
SG77687A1 (en)	2001-01-16	Plastic molding unsealing apparatus