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AU2001286225A1 - Liquid epoxy resin composition for encapsulating material - Google Patents

Liquid epoxy resin composition for encapsulating material

Info

Publication number
AU2001286225A1
AU2001286225A1 AU2001286225A AU8622501A AU2001286225A1 AU 2001286225 A1 AU2001286225 A1 AU 2001286225A1 AU 2001286225 A AU2001286225 A AU 2001286225A AU 8622501 A AU8622501 A AU 8622501A AU 2001286225 A1 AU2001286225 A1 AU 2001286225A1
Authority
AU
Australia
Prior art keywords
resin composition
epoxy resin
encapsulating material
liquid epoxy
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286225A
Inventor
Hideyuki Goto
Daisuke Itoh
Nobuto Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Chemicals Inc
Original Assignee
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001072262A external-priority patent/JP2001329048A/en
Application filed by Harima Chemicals Inc filed Critical Harima Chemicals Inc
Publication of AU2001286225A1 publication Critical patent/AU2001286225A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W74/012—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • H10W72/30—
    • H10W74/15—
    • H10W74/47—
    • H10W72/856—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2001286225A 2000-11-28 2001-09-13 Liquid epoxy resin composition for encapsulating material Abandoned AU2001286225A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2000-361145 2000-11-28
JP2000361145 2000-11-28
JP2001064984 2001-03-08
JP2001-64984 2001-03-08
JP2001-72262 2001-03-14
JP2001072262A JP2001329048A (en) 2000-03-15 2001-03-14 Liquid epoxy resin composition for sealing filler
JP2001-162805 2001-05-30
JP2001162805 2001-05-30
PCT/JP2001/007950 WO2002044241A1 (en) 2000-11-28 2001-09-13 Liquid epoxy resin composition for encapsulating material

Publications (1)

Publication Number Publication Date
AU2001286225A1 true AU2001286225A1 (en) 2002-06-11

Family

ID=27481822

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286225A Abandoned AU2001286225A1 (en) 2000-11-28 2001-09-13 Liquid epoxy resin composition for encapsulating material

Country Status (3)

Country Link
JP (1) JPWO2002044241A1 (en)
AU (1) AU2001286225A1 (en)
WO (1) WO2002044241A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
JP2005011838A (en) 2003-06-16 2005-01-13 Toshiba Corp Semiconductor device and its assembling method
JP2007180361A (en) * 2005-12-28 2007-07-12 Toyota Motor Corp Semiconductor device inspection method and semiconductor device
JP5144489B2 (en) * 2008-12-22 2013-02-13 パナソニック株式会社 Thermosetting resin composition
US20120326301A1 (en) * 2010-01-21 2012-12-27 Sekisui Chemical Co., Ltd. Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device
JP2013253135A (en) * 2012-06-05 2013-12-19 Sumitomo Bakelite Co Ltd Resin composition, semiconductor device, multilayer circuit board, and electronic component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0660232B2 (en) * 1989-09-29 1994-08-10 信越化学工業株式会社 Liquid epoxy resin composition
JPH11354555A (en) * 1998-06-11 1999-12-24 Fujikura Ltd How to fill the underfill
JP2000297202A (en) * 1999-02-12 2000-10-24 Shin Etsu Chem Co Ltd Sealing material for flip-chip type semiconductor devices
EP1153980B1 (en) * 1999-02-18 2003-11-05 Three Bond Co., Ltd. Epoxy resin composition

Also Published As

Publication number Publication date
JPWO2002044241A1 (en) 2004-04-02
WO2002044241A1 (en) 2002-06-06

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