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AU2001279163A1 - Method of controlling stress in gallium nitride films deposited on substrates - Google Patents

Method of controlling stress in gallium nitride films deposited on substrates

Info

Publication number
AU2001279163A1
AU2001279163A1 AU2001279163A AU7916301A AU2001279163A1 AU 2001279163 A1 AU2001279163 A1 AU 2001279163A1 AU 2001279163 A AU2001279163 A AU 2001279163A AU 7916301 A AU7916301 A AU 7916301A AU 2001279163 A1 AU2001279163 A1 AU 2001279163A1
Authority
AU
Australia
Prior art keywords
substrates
gallium nitride
nitride films
films deposited
controlling stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279163A
Inventor
Hugues Marchand
Brendan J. Moran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California San Diego UCSD
Original Assignee
University of California
University of California Berkeley
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California, University of California Berkeley filed Critical University of California
Publication of AU2001279163A1 publication Critical patent/AU2001279163A1/en
Abandoned legal-status Critical Current

Links

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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • H10W42/121
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82Heterojunctions
    • H10D62/824Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/815Bodies having stress relaxation structures, e.g. buffer layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H10P14/24
    • H10P14/2904
    • H10P14/2905
    • H10P14/3216
    • H10P14/3254
    • H10P14/3416

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Vapour Deposition (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Recrystallisation Techniques (AREA)
AU2001279163A 2000-08-04 2001-08-03 Method of controlling stress in gallium nitride films deposited on substrates Abandoned AU2001279163A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22283700P 2000-08-04 2000-08-04
US60222837 2000-08-04
PCT/US2001/024347 WO2002013245A1 (en) 2000-08-04 2001-08-03 Method of controlling stress in gallium nitride films deposited on substrates

Publications (1)

Publication Number Publication Date
AU2001279163A1 true AU2001279163A1 (en) 2002-02-18

Family

ID=22833905

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279163A Abandoned AU2001279163A1 (en) 2000-08-04 2001-08-03 Method of controlling stress in gallium nitride films deposited on substrates

Country Status (5)

Country Link
US (6) US7687888B2 (en)
EP (2) EP1307903A1 (en)
JP (3) JP5095064B2 (en)
AU (1) AU2001279163A1 (en)
WO (1) WO2002013245A1 (en)

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335737B2 (en) 1998-10-28 2008-02-26 Baylor College Of Medicine Ovary-specific genes and proteins
JP5095064B2 (en) * 2000-08-04 2012-12-12 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Semiconductor film having nitride layer deposited on silicon substrate and method for manufacturing the same
US6649287B2 (en) 2000-12-14 2003-11-18 Nitronex Corporation Gallium nitride materials and methods
JP2002185077A (en) * 2000-12-14 2002-06-28 Mitsubishi Electric Corp Semiconductor laser device and method of manufacturing the same
US6956250B2 (en) 2001-02-23 2005-10-18 Nitronex Corporation Gallium nitride materials including thermally conductive regions
JP2002284600A (en) * 2001-03-26 2002-10-03 Hitachi Cable Ltd Gallium nitride crystal substrate manufacturing method and gallium nitride crystal substrate
US7030428B2 (en) 2001-12-03 2006-04-18 Cree, Inc. Strain balanced nitride heterojunction transistors
EP2154270A3 (en) * 2002-04-15 2013-07-24 The Regents of the University of California Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
US8809867B2 (en) * 2002-04-15 2014-08-19 The Regents Of The University Of California Dislocation reduction in non-polar III-nitride thin films
US6841001B2 (en) 2002-07-19 2005-01-11 Cree, Inc. Strain compensated semiconductor structures and methods of fabricating strain compensated semiconductor structures
JP4823466B2 (en) * 2002-12-18 2011-11-24 日本碍子株式会社 Epitaxial growth substrate and semiconductor device
US6818061B2 (en) * 2003-04-10 2004-11-16 Honeywell International, Inc. Method for growing single crystal GaN on silicon
WO2005060007A1 (en) * 2003-08-05 2005-06-30 Nitronex Corporation Gallium nitride material transistors and methods associated with the same
US7071498B2 (en) * 2003-12-17 2006-07-04 Nitronex Corporation Gallium nitride material devices including an electrode-defining layer and methods of forming the same
US20050145851A1 (en) * 2003-12-17 2005-07-07 Nitronex Corporation Gallium nitride material structures including isolation regions and methods
JP2005229055A (en) * 2004-02-16 2005-08-25 Seiko Epson Corp Compound semiconductor crystal growth method and compound semiconductor device manufacturing method
US7956360B2 (en) * 2004-06-03 2011-06-07 The Regents Of The University Of California Growth of planar reduced dislocation density M-plane gallium nitride by hydride vapor phase epitaxy
US7339205B2 (en) * 2004-06-28 2008-03-04 Nitronex Corporation Gallium nitride materials and methods associated with the same
US7361946B2 (en) * 2004-06-28 2008-04-22 Nitronex Corporation Semiconductor device-based sensors
US7687827B2 (en) * 2004-07-07 2010-03-30 Nitronex Corporation III-nitride materials including low dislocation densities and methods associated with the same
US20060214289A1 (en) * 2004-10-28 2006-09-28 Nitronex Corporation Gallium nitride material-based monolithic microwave integrated circuits
US7247889B2 (en) 2004-12-03 2007-07-24 Nitronex Corporation III-nitride material structures including silicon substrates
US7910937B2 (en) * 2005-02-02 2011-03-22 Agency For Science, Technology And Research Method and structure for fabricating III-V nitride layers on silicon substrates
EP2204477A1 (en) 2005-04-04 2010-07-07 Tohoku Techno Arch Co., Ltd. Method For Growth Of GaN Single Crystal, Method For Preparation Of GaN Substrate, Process For producing GaN-Based Element, and GaN-Based Element
US7365374B2 (en) 2005-05-03 2008-04-29 Nitronex Corporation Gallium nitride material structures including substrates and methods associated with the same
US20060270201A1 (en) * 2005-05-13 2006-11-30 Chua Soo J Nano-air-bridged lateral overgrowth of GaN semiconductor layer
US7226850B2 (en) 2005-05-19 2007-06-05 Raytheon Company Gallium nitride high electron mobility transistor structure
KR20080072833A (en) * 2005-10-04 2008-08-07 니트로넥스 코오포레이션 Gallium Nitride Material Transistors and Methods for Broadband Applications
US7566913B2 (en) 2005-12-02 2009-07-28 Nitronex Corporation Gallium nitride material devices including conductive regions and methods associated with the same
WO2007064689A1 (en) * 2005-12-02 2007-06-07 Nitronex Corporation Gallium nitride material devices and associated methods
US9406505B2 (en) 2006-02-23 2016-08-02 Allos Semiconductors Gmbh Nitride semiconductor component and process for its production
KR101038069B1 (en) 2006-04-25 2011-06-01 내셔널 유니버시티 오브 싱가포르 Method of zinc oxide film grown on epitaxial lateral overgrowth gallium nitride template
US20100269819A1 (en) * 2006-08-14 2010-10-28 Sievers Robert E Human Powered Dry Powder Inhaler and Dry Powder Inhaler Compositions
CA2669228C (en) * 2006-11-15 2014-12-16 The Regents Of The University Of California Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
CN102683376A (en) 2007-01-22 2012-09-19 科锐公司 High-pressure light emitter, light emitter and illumination device
US7745848B1 (en) 2007-08-15 2010-06-29 Nitronex Corporation Gallium nitride material devices and thermal designs thereof
JP5431667B2 (en) * 2007-10-01 2014-03-05 富士電機株式会社 Gallium nitride semiconductor device
US9634191B2 (en) 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US8026581B2 (en) * 2008-02-05 2011-09-27 International Rectifier Corporation Gallium nitride material devices including diamond regions and methods associated with the same
US8343824B2 (en) * 2008-04-29 2013-01-01 International Rectifier Corporation Gallium nitride material processing and related device structures
US8568529B2 (en) * 2009-04-10 2013-10-29 Applied Materials, Inc. HVPE chamber hardware
WO2010151856A2 (en) * 2009-06-26 2010-12-29 Cornell University Chemical vapor deposition process for aluminum silicon nitride
US8465587B2 (en) * 2009-12-30 2013-06-18 Cbl Technologies, Inc. Modern hydride vapor-phase epitaxy system and methods
WO2011135963A1 (en) * 2010-04-28 2011-11-03 日本碍子株式会社 Epitaxial substrate and process for producing epitaxial substrate
KR20120032329A (en) 2010-09-28 2012-04-05 삼성전자주식회사 Semiconductor device
EP2695186A1 (en) * 2011-04-06 2014-02-12 Isis Innovation Limited Heterogeneous integration of group iii-v or ii-vi materials with silicon or germanium
US8835287B2 (en) 2011-05-13 2014-09-16 Varian Semiconductor Equipment Associates, Inc. Method of implanting a workpiece to improve growth of a compound semiconductor
US9023722B2 (en) * 2011-05-13 2015-05-05 Varian Semiconductor Equipment Associates, Inc. Compound semiconductor growth using ion implantation
US11792898B2 (en) 2012-07-01 2023-10-17 Ideal Industries Lighting Llc Enhanced fixtures for area lighting
US11160148B2 (en) 2017-06-13 2021-10-26 Ideal Industries Lighting Llc Adaptive area lamp
CN104412396B (en) * 2012-07-05 2021-11-09 亮锐控股有限公司 Light-emitting diode with a nitrogen-and phosphorus-containing light-emitting layer
CN103578926B (en) 2012-08-09 2018-01-02 三星电子株式会社 Semiconductor buffer structure, semiconductor devices and the method for manufacturing semiconductor devices
US8946773B2 (en) 2012-08-09 2015-02-03 Samsung Electronics Co., Ltd. Multi-layer semiconductor buffer structure, semiconductor device and method of manufacturing the semiconductor device using the multi-layer semiconductor buffer structure
KR102002898B1 (en) 2012-09-04 2019-07-23 삼성전자 주식회사 The semiconductor buffer structure and semiconductor device having the same
CN104641453B (en) * 2012-10-12 2018-03-30 住友电气工业株式会社 III-nitride compound substrate, manufacturing method thereof, and method for manufacturing III-nitride semiconductor device
JP6322890B2 (en) 2013-02-18 2018-05-16 住友電気工業株式会社 Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device
US10023974B2 (en) 2012-12-18 2018-07-17 Rfhic Corporation Substrates for semiconductor devices
CN104995713A (en) 2013-02-18 2015-10-21 住友电气工业株式会社 Group iii-nitride composite substrate and method of producing same, layered group iii-nitride composite substrate, as well as group iii-nitride semiconductor device and method of producing same
GB2519338A (en) 2013-10-17 2015-04-22 Nanogan Ltd Crack-free gallium nitride materials
KR102098250B1 (en) 2013-10-21 2020-04-08 삼성전자 주식회사 Semiconductor buffer structure, semiconductor device employing the same and method of manufacturing semiconductor device using the semiconductor buffer structure
CN105745366B (en) * 2013-11-07 2018-12-11 日本碍子株式会社 GaN template substrate and device substrate
TWI570911B (en) * 2014-05-19 2017-02-11 新世紀光電股份有限公司 Semiconductor structure
EP2983195A1 (en) 2014-08-04 2016-02-10 EpiGan NV Semiconductor structure comprising an active semiconductor layer of the iii-v type on a buffer layer stack and method for producing semiconductor structure
CN105206714A (en) * 2015-09-01 2015-12-30 映瑞光电科技(上海)有限公司 GaN-based LED epitaxy structure and preparation method thereof
US9799520B2 (en) 2015-09-08 2017-10-24 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation via back side implantation
US9627473B2 (en) 2015-09-08 2017-04-18 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation in III-nitride material semiconductor structures
US9673281B2 (en) 2015-09-08 2017-06-06 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation using rare-earth oxide and/or rare-earth nitride diffusion barrier regions
US9704705B2 (en) 2015-09-08 2017-07-11 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation via reaction with active species
US9773898B2 (en) 2015-09-08 2017-09-26 Macom Technology Solutions Holdings, Inc. III-nitride semiconductor structures comprising spatially patterned implanted species
US10211294B2 (en) 2015-09-08 2019-02-19 Macom Technology Solutions Holdings, Inc. III-nitride semiconductor structures comprising low atomic mass species
US9806182B2 (en) 2015-09-08 2017-10-31 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation using elemental diboride diffusion barrier regions
US20170069721A1 (en) 2015-09-08 2017-03-09 M/A-Com Technology Solutions Holdings, Inc. Parasitic channel mitigation using silicon carbide diffusion barrier regions
US11581866B2 (en) 2016-03-11 2023-02-14 Akoustis, Inc. RF acoustic wave resonators integrated with high electron mobility transistors including a shared piezoelectric/buffer layer and methods of forming the same
US10529696B2 (en) 2016-04-12 2020-01-07 Cree, Inc. High density pixelated LED and devices and methods thereof
US9960127B2 (en) 2016-05-18 2018-05-01 Macom Technology Solutions Holdings, Inc. High-power amplifier package
US10134658B2 (en) 2016-08-10 2018-11-20 Macom Technology Solutions Holdings, Inc. High power transistors
US9917156B1 (en) 2016-09-02 2018-03-13 IQE, plc Nucleation layer for growth of III-nitride structures
US10381473B2 (en) 2016-12-02 2019-08-13 Vishay-Siliconix High-electron-mobility transistor with buried interconnect
US10224426B2 (en) 2016-12-02 2019-03-05 Vishay-Siliconix High-electron-mobility transistor devices
US10141435B2 (en) * 2016-12-23 2018-11-27 Sixpoint Materials, Inc. Electronic device using group III nitride semiconductor and its fabrication method
JP7290001B2 (en) 2017-08-03 2023-06-13 クリーエルイーディー・インコーポレーテッド High-density pixelated LED chips, chip array devices, and methods of making same
US10734363B2 (en) 2017-08-03 2020-08-04 Cree, Inc. High density pixelated-LED chips and chip array devices
US10529773B2 (en) 2018-02-14 2020-01-07 Cree, Inc. Solid state lighting devices with opposing emission directions
US10693288B2 (en) 2018-06-26 2020-06-23 Vishay SIliconix, LLC Protection circuits with negative gate swing capability
US11038023B2 (en) 2018-07-19 2021-06-15 Macom Technology Solutions Holdings, Inc. III-nitride material semiconductor structures on conductive silicon substrates
US10833063B2 (en) 2018-07-25 2020-11-10 Vishay SIliconix, LLC High electron mobility transistor ESD protection structures
US10903265B2 (en) 2018-12-21 2021-01-26 Cree, Inc. Pixelated-LED chips and chip array devices, and fabrication methods
EP4052296A1 (en) 2019-10-29 2022-09-07 Creeled, Inc. Texturing for high density pixelated-led chips
CN115280525A (en) * 2020-01-21 2022-11-01 阿库斯蒂斯有限公司 RF acoustic wave resonator integrated with high electron mobility transistor including shared piezoelectric/buffer layer and method of forming the same
US12102010B2 (en) 2020-03-05 2024-09-24 Akoustis, Inc. Methods of forming films including scandium at low temperatures using chemical vapor deposition to provide piezoelectric resonator devices and/or high electron mobility transistor devices
US11437548B2 (en) 2020-10-23 2022-09-06 Creeled, Inc. Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods
CN113345798B (en) * 2021-06-01 2022-07-12 中科汇通(内蒙古)投资控股有限公司 Method for preparing GaN by SiC substrate epitaxy
EP4656021A2 (en) * 2023-01-24 2025-12-03 The Regents Of The University Of Michigan Ferroelectric iii-nitride layer thickness scaling
CN119698087B (en) * 2025-02-21 2025-05-27 清华大学 A gallium nitride alpha particle detector and a method for preparing the same

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834798A (en) * 1971-09-06 1973-05-22
US4452646A (en) * 1981-09-28 1984-06-05 Mcdonnell Douglas Corporation Method of making planar III-V compound device by ion implantation
JPH01140850A (en) * 1987-11-27 1989-06-02 Nec Corp Line terminal equipment
US5276698A (en) * 1990-09-20 1994-01-04 Sumitomo Electric Ind., Ltd. Semiconductor laser having an optical waveguide layer including an AlGaInP active layer
US5290393A (en) 1991-01-31 1994-03-01 Nichia Kagaku Kogyo K.K. Crystal growth method for gallium nitride-based compound semiconductor
US5633192A (en) 1991-03-18 1997-05-27 Boston University Method for epitaxially growing gallium nitride layers
US5442205A (en) 1991-04-24 1995-08-15 At&T Corp. Semiconductor heterostructure devices with strained semiconductor layers
US5221413A (en) 1991-04-24 1993-06-22 At&T Bell Laboratories Method for making low defect density semiconductor heterostructure and devices made thereby
US5192987A (en) 1991-05-17 1993-03-09 Apa Optics, Inc. High electron mobility transistor with GaN/Alx Ga1-x N heterojunctions
JP3352712B2 (en) 1991-12-18 2002-12-03 浩 天野 Gallium nitride based semiconductor device and method of manufacturing the same
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US6440823B1 (en) 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
JPH07326576A (en) * 1994-05-30 1995-12-12 Nec Corp Thin film formation of iii-v compound semiconductor
US5838029A (en) 1994-08-22 1998-11-17 Rohm Co., Ltd. GaN-type light emitting device formed on a silicon substrate
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US5592501A (en) 1994-09-20 1997-01-07 Cree Research, Inc. Low-strain laser structures with group III nitride active layers
US5821555A (en) 1995-03-27 1998-10-13 Kabushiki Kaisha Toshiba Semicoductor device having a hetero interface with a lowered barrier
US5679965A (en) 1995-03-29 1997-10-21 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same
US5670798A (en) * 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
US5739554A (en) * 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
WO1996041906A1 (en) 1995-06-13 1996-12-27 Advanced Technology Materials, Inc. Bulk single crystal gallium nitride and method of making same
JP2795226B2 (en) 1995-07-27 1998-09-10 日本電気株式会社 Semiconductor light emitting device and method of manufacturing the same
JP3604205B2 (en) * 1995-09-18 2004-12-22 日亜化学工業株式会社 Method for growing nitride semiconductor
AU6946196A (en) 1995-09-18 1997-04-09 Hitachi Limited Semiconductor material, method of producing the semiconductor material, and semiconductor device
JP3235440B2 (en) * 1995-11-24 2001-12-04 日亜化学工業株式会社 Nitride semiconductor laser device and method of manufacturing the same
JP3396356B2 (en) 1995-12-11 2003-04-14 三菱電機株式会社 Semiconductor device and method of manufacturing the same
JP3409958B2 (en) 1995-12-15 2003-05-26 株式会社東芝 Semiconductor light emitting device
US5874747A (en) * 1996-02-05 1999-02-23 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
US5923950A (en) * 1996-06-14 1999-07-13 Matsushita Electric Industrial Co., Inc. Method of manufacturing a semiconductor light-emitting device
US6039803A (en) 1996-06-28 2000-03-21 Massachusetts Institute Of Technology Utilization of miscut substrates to improve relaxed graded silicon-germanium and germanium layers on silicon
JP3179346B2 (en) 1996-08-27 2001-06-25 松下電子工業株式会社 Method for producing gallium nitride crystal
US5955772A (en) 1996-12-17 1999-09-21 The Regents Of The University Of California Heterostructure thermionic coolers
US5741724A (en) 1996-12-27 1998-04-21 Motorola Method of growing gallium nitride on a spinel substrate
US5866925A (en) * 1997-01-09 1999-02-02 Sandia Corporation Gallium nitride junction field-effect transistor
US5880491A (en) 1997-01-31 1999-03-09 The United States Of America As Represented By The Secretary Of The Air Force SiC/111-V-nitride heterostructures on SiC/SiO2 /Si for optoelectronic devices
US6377597B1 (en) * 1997-03-07 2002-04-23 Sharp Kabushiki Kaisha Gallium nitride semiconductor light emitting element with active layer having multiplex quantum well structure and semiconductor laser light source device
KR19980079320A (en) 1997-03-24 1998-11-25 기다오까다까시 Selective growth method of high quality muene layer, semiconductor device made on high quality muene layer growth substrate and high quality muene layer growth substrate
JP3491492B2 (en) 1997-04-09 2004-01-26 松下電器産業株式会社 Method for producing gallium nitride crystal
ATE550461T1 (en) 1997-04-11 2012-04-15 Nichia Corp GROWTH METHOD FOR A NITRIDE SEMICONDUCTOR
US6069021A (en) 1997-05-14 2000-05-30 Showa Denko K.K. Method of growing group III nitride semiconductor crystal layer and semiconductor device incorporating group III nitride semiconductor crystal layer
JP3642157B2 (en) * 1997-05-26 2005-04-27 ソニー株式会社 P-type group III nitride compound semiconductor, light-emitting diode, and semiconductor laser
US6261931B1 (en) 1997-06-20 2001-07-17 The Regents Of The University Of California High quality, semi-insulating gallium nitride and method and system for forming same
JP2002511831A (en) * 1997-07-03 2002-04-16 シービーエル テクノロジーズ Compensation for thermal mismatch forming free-standing substrates by epitaxial deposition
JP3813740B2 (en) 1997-07-11 2006-08-23 Tdk株式会社 Substrates for electronic devices
JP3505357B2 (en) 1997-07-16 2004-03-08 株式会社東芝 Gallium nitride based semiconductor device and method of manufacturing the same
JP3606015B2 (en) * 1997-07-23 2005-01-05 豊田合成株式会社 Method for manufacturing group 3 nitride semiconductor device
JP3420028B2 (en) * 1997-07-29 2003-06-23 株式会社東芝 Manufacturing method of GaN-based compound semiconductor device
JPH11340580A (en) * 1997-07-30 1999-12-10 Fujitsu Ltd Semiconductor laser, semiconductor light emitting device, and method of manufacturing the same
US6201262B1 (en) 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
JP3517867B2 (en) 1997-10-10 2004-04-12 豊田合成株式会社 GaN-based semiconductor devices
JP3500281B2 (en) 1997-11-05 2004-02-23 株式会社東芝 Gallium nitride based semiconductor device and method of manufacturing the same
JP3036495B2 (en) 1997-11-07 2000-04-24 豊田合成株式会社 Method for manufacturing gallium nitride-based compound semiconductor
GB2332563A (en) * 1997-12-18 1999-06-23 Sharp Kk Growth of group III nitride or group III-V nitride layers
US6051849A (en) 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
US6500257B1 (en) 1998-04-17 2002-12-31 Agilent Technologies, Inc. Epitaxial material grown laterally within a trench and method for producing same
TW413972B (en) * 1998-04-22 2000-12-01 Matsushita Electric Industrial Co Ltd Semiconductor laser device
US6180270B1 (en) 1998-04-24 2001-01-30 The United States Of America As Represented By The Secretary Of The Army Low defect density gallium nitride epilayer and method of preparing the same
US6064078A (en) 1998-05-22 2000-05-16 Xerox Corporation Formation of group III-V nitride films on sapphire substrates with reduced dislocation densities
US6218207B1 (en) 1998-05-29 2001-04-17 Mitsushita Electronics Corporation Method for growing nitride semiconductor crystals, nitride semiconductor device, and method for fabricating the same
US6265289B1 (en) 1998-06-10 2001-07-24 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
JP2000106348A (en) * 1998-07-28 2000-04-11 Matsushita Electronics Industry Corp Substrate containing compound semiconductor layer, its manufacture, and semiconductor device using the same
JP4238385B2 (en) * 1998-08-06 2009-03-18 昭和電工株式会社 Compound semiconductor device and manufacturing method thereof
SG94712A1 (en) 1998-09-15 2003-03-18 Univ Singapore Method of fabricating group-iii nitride-based semiconductor device
US6177688B1 (en) 1998-11-24 2001-01-23 North Carolina State University Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates
US6255198B1 (en) 1998-11-24 2001-07-03 North Carolina State University Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
US6329063B2 (en) 1998-12-11 2001-12-11 Nova Crystals, Inc. Method for producing high quality heteroepitaxial growth using stress engineering and innovative substrates
US6328796B1 (en) 1999-02-01 2001-12-11 The United States Of America As Represented By The Secretary Of The Navy Single-crystal material on non-single-crystalline substrate
JP3770014B2 (en) * 1999-02-09 2006-04-26 日亜化学工業株式会社 Nitride semiconductor device
US20010042503A1 (en) * 1999-02-10 2001-11-22 Lo Yu-Hwa Method for design of epitaxial layer and substrate structures for high-quality epitaxial growth on lattice-mismatched substrates
JP3432444B2 (en) * 1999-02-25 2003-08-04 シャープ株式会社 Semiconductor light emitting device
TW449937B (en) 1999-02-26 2001-08-11 Matsushita Electronics Corp Semiconductor device and the manufacturing method thereof
US6525932B1 (en) * 1999-08-18 2003-02-25 Fujitsu Limited Expansion unit and electronic apparatus
EP1222685B1 (en) 1999-10-14 2010-02-17 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of group iii-nitride layers
US6521514B1 (en) 1999-11-17 2003-02-18 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
US20020069816A1 (en) 1999-12-13 2002-06-13 Thomas Gehrke Methods of fabricating gallium nitride layers on textured silicon substrates, and gallium nitride semiconductor structures fabricated thereby
US6291319B1 (en) 1999-12-17 2001-09-18 Motorola, Inc. Method for fabricating a semiconductor structure having a stable crystalline interface with silicon
US6380108B1 (en) 1999-12-21 2002-04-30 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby
US6403451B1 (en) 2000-02-09 2002-06-11 Noerh Carolina State University Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts
WO2001059819A1 (en) 2000-02-09 2001-08-16 North Carolina State University Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts, and gallium nitride semiconductor structures fabricated thereby
JP2001230447A (en) 2000-02-16 2001-08-24 Toyoda Gosei Co Ltd Manufacture method for iii nitride-based compound semiconductor element
US6261929B1 (en) 2000-02-24 2001-07-17 North Carolina State University Methods of forming a plurality of semiconductor layers using spaced trench arrays
US6741724B1 (en) * 2000-03-24 2004-05-25 Siemens Dematic Postal Automation, L.P. Method and system for form processing
JP3626423B2 (en) * 2000-05-22 2005-03-09 日本碍子株式会社 Photonic device manufacturing method
FR2810159B1 (en) * 2000-06-09 2005-04-08 Centre Nat Rech Scient THICK LAYER OF GALLIUM NITRIDE OR MIXED NITRIDE OF GALLIUM AND ANOTHER METAL, PROCESS FOR PREPARING THE SAME, AND ELECTRONIC OR OPTOELECTRONIC DEVICE COMPRISING SUCH A LAYER
US6707074B2 (en) 2000-07-04 2004-03-16 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and apparatus for driving the same
US6610144B2 (en) 2000-07-21 2003-08-26 The Regents Of The University Of California Method to reduce the dislocation density in group III-nitride films
JP5095064B2 (en) 2000-08-04 2012-12-12 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Semiconductor film having nitride layer deposited on silicon substrate and method for manufacturing the same
US6391748B1 (en) 2000-10-03 2002-05-21 Texas Tech University Method of epitaxial growth of high quality nitride layers on silicon substrates
US6548333B2 (en) 2000-12-01 2003-04-15 Cree, Inc. Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
US6649287B2 (en) 2000-12-14 2003-11-18 Nitronex Corporation Gallium nitride materials and methods
US6956250B2 (en) 2001-02-23 2005-10-18 Nitronex Corporation Gallium nitride materials including thermally conductive regions
US6611002B2 (en) 2001-02-23 2003-08-26 Nitronex Corporation Gallium nitride material devices and methods including backside vias

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