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AU2001278794A1 - Electroless displacement gold plating solution and additive for preparing said plating solution - Google Patents

Electroless displacement gold plating solution and additive for preparing said plating solution

Info

Publication number
AU2001278794A1
AU2001278794A1 AU2001278794A AU7879401A AU2001278794A1 AU 2001278794 A1 AU2001278794 A1 AU 2001278794A1 AU 2001278794 A AU2001278794 A AU 2001278794A AU 7879401 A AU7879401 A AU 7879401A AU 2001278794 A1 AU2001278794 A1 AU 2001278794A1
Authority
AU
Australia
Prior art keywords
plating solution
additive
preparing
displacement gold
electroless displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001278794A
Other languages
English (en)
Inventor
Kazunori Hibi
Kazuyuki Suda
Yasushi Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LeaRonal Japan Inc
Original Assignee
LeaRonal Japan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Japan Inc filed Critical LeaRonal Japan Inc
Publication of AU2001278794A1 publication Critical patent/AU2001278794A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU2001278794A 2000-08-21 2001-08-21 Electroless displacement gold plating solution and additive for preparing said plating solution Abandoned AU2001278794A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-249318 2000-08-21
JP2000249318 2000-08-21
PCT/JP2001/007157 WO2002016668A1 (fr) 2000-08-21 2001-08-21 Solution de depot d'or par deplacement chimique et additif destine a la preparation d'une telle solution

Publications (1)

Publication Number Publication Date
AU2001278794A1 true AU2001278794A1 (en) 2002-03-04

Family

ID=18739075

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001278794A Abandoned AU2001278794A1 (en) 2000-08-21 2001-08-21 Electroless displacement gold plating solution and additive for preparing said plating solution

Country Status (6)

Country Link
US (1) US6991675B2 (fr)
EP (1) EP1327700A1 (fr)
KR (1) KR20030033034A (fr)
CN (1) CN1447866A (fr)
AU (1) AU2001278794A1 (fr)
WO (1) WO2002016668A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100495184B1 (ko) 2002-12-02 2005-06-14 엘지마이크론 주식회사 테이프기판 및 그의 주석도금방법
JP4603320B2 (ja) * 2003-10-22 2010-12-22 関東化学株式会社 無電解金めっき液
EP1768132A1 (fr) * 2004-07-15 2007-03-28 Sekisui Chemical Co., Ltd. Microparticule conductrice, procede de production de la microparticule, et materiau conducteur anisotrope
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
US20100291312A1 (en) * 2007-10-22 2010-11-18 National Institute For Materials Science Electroless plating method for alloy coating film and plating liquid
US7534289B1 (en) * 2008-07-02 2009-05-19 Rohm And Haas Electronic Materials Llc Electroless gold plating solution
JP2010040897A (ja) * 2008-08-07 2010-02-18 Sony Corp 有機薄膜トランジスタ、有機薄膜トランジスタの製造方法、および電子機器
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
US8323744B2 (en) * 2009-01-09 2012-12-04 The Board Of Trustees Of The Leland Stanford Junior University Systems, methods, devices and arrangements for nanowire meshes
KR20110061099A (ko) * 2009-12-01 2011-06-09 삼성전기주식회사 치환형 무전해 금 도금액 및 이를 이용한 금 도금층의 형성방법
JP5466600B2 (ja) * 2010-08-27 2014-04-09 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金めっき液及び接合部の形成方法
JP6017726B2 (ja) * 2014-08-25 2016-11-02 小島化学薬品株式会社 還元型無電解金めっき液及び当該めっき液を用いた無電解金めっき方法
US10508348B2 (en) * 2017-06-15 2019-12-17 Rohm And Haas Electronic Materials Llc Environmentally friendly nickel electroplating compositions and methods
EP3517651B1 (fr) * 2018-01-26 2020-09-02 ATOTECH Deutschland GmbH Bain de placage d'or anélectrolytique
KR101857596B1 (ko) * 2018-01-31 2018-05-14 (주)엠케이켐앤텍 질소-함유 헤테로아릴카복실산을 함유하는 치환형 무전해 금 도금액 및 이를 사용한 치환형 무전해 금 도금 방법
JP6521553B1 (ja) * 2018-12-26 2019-05-29 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金めっき液および置換金めっき方法
CN109457239B (zh) * 2018-12-27 2021-08-17 吉安宏达秋科技有限公司 还原型非氰镀金液、镀金方法以及镀金产品
JP7316250B2 (ja) * 2020-05-01 2023-07-27 Ｅｅｊａ株式会社 無電解金めっき浴および無電解金めっき方法
JP6945050B1 (ja) * 2020-12-01 2021-10-06 日本エレクトロプレイテイング・エンジニヤース株式会社 非シアン系の置換金めっき液及び置換金めっき方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures
US4091128A (en) * 1976-10-08 1978-05-23 Ppg Industries, Inc. Electroless gold plating bath
US4091172A (en) * 1976-12-14 1978-05-23 Ppg Industries, Inc. Uniform gold films
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
GB9425030D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
JP4116718B2 (ja) * 1998-11-05 2008-07-09 日本リーロナール有限会社 無電解金めっき方法及びそれに使用する無電解金めっき液
JP2000212763A (ja) * 1999-01-19 2000-08-02 Shipley Far East Ltd 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法
US6383269B1 (en) * 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
JP4932094B2 (ja) * 2001-07-02 2012-05-16 日本リーロナール有限会社 無電解金めっき液および無電解金めっき方法
JP4375702B2 (ja) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． めっき組成物
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
KR100442519B1 (ko) * 2002-04-09 2004-07-30 삼성전기주식회사 모듈화 인쇄회로기판의 표면처리용 합금 도금액

Also Published As

Publication number Publication date
CN1447866A (zh) 2003-10-08
US20050031895A1 (en) 2005-02-10
US6991675B2 (en) 2006-01-31
WO2002016668A1 (fr) 2002-02-28
KR20030033034A (ko) 2003-04-26
EP1327700A1 (fr) 2003-07-16

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