AU2001286266A1 - Electroless gold plating solution and method for electroless gold plating - Google Patents

Electroless gold plating solution and method for electroless gold plating

Info

Publication number: AU2001286266A1
Authority: AU; Australia
Prior art keywords: gold plating; electroless gold; plating solution; solution; electroless
Prior art date: 2000-09-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2001286266A

Inventor

Kiyoshi Hasegawa

Kanji Murakami

Sumiko Nakajima

Akio Takahashi

Hiroshi Yamamoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-09-18

Filing date

2001-09-18

Publication date

2002-03-26

2001-09-18 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

2002-03-26 Publication of AU2001286266A1 publication Critical patent/AU2001286266A1/en

Status Abandoned legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)

AU2001286266A 2000-09-18 2001-09-18 Electroless gold plating solution and method for electroless gold plating Abandoned AU2001286266A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2000-282108		2000-09-18
JP2000282108		2000-09-18
PCT/JP2001/008086 WO2002022909A1 (en)	2000-09-18	2001-09-18	Electroless gold plating solution and method for electroless gold plating

Publications (1)

Publication Number	Publication Date
AU2001286266A1 true AU2001286266A1 (en)	2002-03-26

Family

ID=18766670

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2001286266A Abandoned AU2001286266A1 (en)	2000-09-18	2001-09-18	Electroless gold plating solution and method for electroless gold plating

Country Status (8)

Country	Link
US (1)	US6811828B2 (en)
EP (1)	EP1338675B1 (en)
JP (2)	JP4356319B2 (en)
KR (1)	KR100529984B1 (en)
CN (1)	CN1195891C (en)
AU (1)	AU2001286266A1 (en)
TW (1)	TW539766B (en)
WO (1)	WO2002022909A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3892730B2 (en) *	2002-01-30	2007-03-14	関東化学株式会社	Electroless gold plating solution
JP2005256140A (en) *	2004-03-15	2005-09-22	C Uyemura & Co Ltd	Gold plating bath
EP1768132A1 (en) *	2004-07-15	2007-03-28	Sekisui Chemical Co., Ltd.	Conductive microparticle, process for producing the same and anisotropic conductive material
JP4797368B2 (en) *	2004-11-30	2011-10-19	株式会社デンソー	Manufacturing method of semiconductor device
KR100766715B1 (en) *	2006-06-12	2007-10-12	재단법인서울대학교산학협력재단	Electroless Silver Plating Method Using Amine
JP4941650B2 (en) *	2007-01-11	2012-05-30	上村工業株式会社	Plating ability maintenance management method of electroless gold plating bath
JP5526463B2 (en) *	2007-04-19	2014-06-18	日立化成株式会社	Electroless gold plating method for electronic parts and electronic parts
KR100892301B1 (en) *	2007-04-23	2009-04-08	한화석유화학 주식회사	Manufacture of conductive balls using reduction and substitution gold plating method
JP5371465B2 (en) *	2009-02-09	2013-12-18	メタローテクノロジーズジャパン株式会社	Non-cyan electroless gold plating solution and conductor pattern plating method
JP5428667B2 (en) *	2009-09-07	2014-02-26	日立化成株式会社	Manufacturing method of semiconductor chip mounting substrate
CN103556134B (en) *	2013-11-13	2015-11-25	湖南省化讯应用材料有限公司	The pretreatment process of process for electroless nickel plating
KR101444687B1 (en) *	2014-08-06	2014-09-26	(주)엠케이켐앤텍	Electroless gold plating liquid
JP6017726B2 (en) *	2014-08-25	2016-11-02	小島化学薬品株式会社	Reduced electroless gold plating solution and electroless gold plating method using the plating solution
CN107002242B (en) *	2014-12-17	2020-02-11	埃托特克德国有限公司	Plating bath composition and method for electroless palladium plating
KR101678013B1 (en) *	2016-02-15	2016-11-21	주식회사 베프스	A plating solution with concentration-detecting indicators for determing supplement time of metal component and plating method of therewith
KR101661629B1 (en) *	2016-03-11	2016-09-30	주식회사 베프스	Plationg solution of Amorphous PZT and plating method of the same
US20210371998A1 (en) *	2020-05-27	2021-12-02	Macdermid Enthone Inc.	Gold Plating Bath and Gold Plated Final Finish

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5116664A (en) *	1988-02-09	1992-05-26	Shiseido Company Ltd.	Titanium-mica composite material
US4919720A (en) *	1988-06-30	1990-04-24	Learonal, Inc.	Electroless gold plating solutions
JP2866676B2 (en) *	1989-09-18	1999-03-08	株式会社日立製作所	Electroless gold plating solution and gold plating method using the same
DE69406701T2 (en) *	1993-03-26	1998-04-02	Uyemura & Co C	Chemical gilding bath
JP3152008B2 (en) *	1993-04-23	2001-04-03	日立化成工業株式会社	Electroless gold plating solution
JPH0971871A (en) *	1995-09-06	1997-03-18	Merutetsukusu Kk	Electroless gold plating liquid
JPH1112753A (en) *	1997-06-20	1999-01-19	Hitachi Chem Co Ltd	Electroless gold plating method
US5935306A (en) *	1998-02-10	1999-08-10	Technic Inc.	Electroless gold plating bath

2001
- 2001-09-18 AU AU2001286266A patent/AU2001286266A1/en not_active Abandoned
- 2001-09-18 EP EP01965688.3A patent/EP1338675B1/en not_active Expired - Lifetime
- 2001-09-18 CN CNB018158935A patent/CN1195891C/en not_active Expired - Fee Related
- 2001-09-18 JP JP2002527344A patent/JP4356319B2/en not_active Expired - Lifetime
- 2001-09-18 KR KR10-2003-7003849A patent/KR100529984B1/en not_active Expired - Fee Related
- 2001-09-18 WO PCT/JP2001/008086 patent/WO2002022909A1/en not_active Ceased
- 2001-09-19 TW TW090122959A patent/TW539766B/en not_active IP Right Cessation
2003
- 2003-09-18 US US10/380,548 patent/US6811828B2/en not_active Expired - Lifetime
2009
- 2009-06-12 JP JP2009141098A patent/JP2009235577A/en active Pending

Also Published As

Publication number	Publication date
US6811828B2 (en)	2004-11-02
JPWO2002022909A1 (en)	2004-02-26
CN1195891C (en)	2005-04-06
US20040028833A1 (en)	2004-02-12
WO2002022909A1 (en)	2002-03-21
EP1338675A1 (en)	2003-08-27
EP1338675A4 (en)	2009-04-01
JP2009235577A (en)	2009-10-15
TW539766B (en)	2003-07-01
JP4356319B2 (en)	2009-11-04
EP1338675B1 (en)	2016-11-09
KR20030045071A (en)	2003-06-09
CN1460131A (en)	2003-12-03
KR100529984B1 (en)	2005-11-22

Publication	Publication Date	Title
EP1335038A4 (en)	2008-05-14	Device and method for electroless plating
AU2001276851A1 (en)	2002-01-21	Electroless silver plating
AU2003272455A1 (en)	2004-08-23	Electroless plating solution and process
AU2001286266A1 (en)	2002-03-26	Electroless gold plating solution and method for electroless gold plating
AU2233399A (en)	1999-08-30	Plating apparatus and method
AU2001216582A1 (en)	2001-08-20	Modified plating solution for plating and planarization and process utilizing same
AU6478201A (en)	2001-12-03	Mobile plating system and method
AU2003241758A1 (en)	2004-04-08	Electroless plating apparatus and electroless plating method
NL1015624A1 (en)	2001-01-09	Electroless plating method and electroless plating solution.
AU2001278794A1 (en)	2002-03-04	Electroless displacement gold plating solution and additive for preparing said plating solution
EP1113094A3 (en)	2004-04-28	Plating analysis method
GB2382353B (en)	2004-10-27	Palladium Plating Solution
AP2000001966A0 (en)	2000-12-31	Method for reduction of nickel
AU2002218776A1 (en)	2002-01-21	Electroless autocatalytic platinum plating
EP1420891A4 (en)	2007-06-27	Electroless nickel plating solution and process for its use
AU2003211563A1 (en)	2003-09-22	Gold plating solution and method for gold plating
SG83221A1 (en)	2001-09-18	Alloy composition and plating method
AU7319900A (en)	2001-04-30	Electroless plating method
AU2003241759A1 (en)	2004-04-23	Method of electroless plating
AU2003241757A1 (en)	2004-04-19	Method of electroless plating
EP1146147A4 (en)	2006-08-16	Gold plating liquid and method of plating using the gold plating liquid
AU1418901A (en)	2001-06-04	Accelerator solution for direct plating and method for direct plating
AU2001277856A1 (en)	2002-01-21	Electroless rhodium plating
AU2003219869A1 (en)	2003-09-22	Methods and apparatuses for analyzing solder plating solutions
AU2003296142A1 (en)	2004-07-29	Method for electroless plating