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AU2001276968A1 - Semiconductor structure for use with high-frequency signals - Google Patents

Semiconductor structure for use with high-frequency signals

Info

Publication number
AU2001276968A1
AU2001276968A1 AU2001276968A AU7696801A AU2001276968A1 AU 2001276968 A1 AU2001276968 A1 AU 2001276968A1 AU 2001276968 A AU2001276968 A AU 2001276968A AU 7696801 A AU7696801 A AU 7696801A AU 2001276968 A1 AU2001276968 A1 AU 2001276968A1
Authority
AU
Australia
Prior art keywords
semiconductor structure
frequency signals
signals
frequency
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001276968A
Inventor
Ravindranath Droopad
Kurt Eisenbeiser
Nada El-Zein
Jamal Ramdani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2001276968A1 publication Critical patent/AU2001276968A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • H10P14/2905
    • H10P14/3202
    • H10P14/3238
    • H10P14/3251
    • H10P14/3402
    • H10P14/6544
    • H10P14/69215
    • H10P14/6939
    • H10P14/69398
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/90Bulk effect device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/933Germanium or silicon or Ge-Si on III-V

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Recrystallisation Techniques (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Memories (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
AU2001276968A 2000-07-24 2001-07-18 Semiconductor structure for use with high-frequency signals Abandoned AU2001276968A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/624,296 2000-07-24
US09/624,296 US6590236B1 (en) 2000-07-24 2000-07-24 Semiconductor structure for use with high-frequency signals
PCT/US2001/022573 WO2002009150A2 (en) 2000-07-24 2001-07-18 Semiconductor structure for use with high-frequency signals

Publications (1)

Publication Number Publication Date
AU2001276968A1 true AU2001276968A1 (en) 2002-02-05

Family

ID=24501428

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001276968A Abandoned AU2001276968A1 (en) 2000-07-24 2001-07-18 Semiconductor structure for use with high-frequency signals

Country Status (4)

Country Link
US (1) US6590236B1 (en)
AU (1) AU2001276968A1 (en)
TW (1) TW523790B (en)
WO (1) WO2002009150A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392257B1 (en) 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
JP2004503920A (en) 2000-05-31 2004-02-05 モトローラ・インコーポレイテッド Semiconductor device and method of manufacturing the semiconductor device
AU2001277001A1 (en) 2000-07-24 2002-02-05 Motorola, Inc. Heterojunction tunneling diodes and process for fabricating same
US20020096683A1 (en) 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
JP3754897B2 (en) * 2001-02-09 2006-03-15 キヤノン株式会社 Semiconductor device substrate and method for manufacturing SOI substrate
WO2002082551A1 (en) 2001-04-02 2002-10-17 Motorola, Inc. A semiconductor structure exhibiting reduced leakage current
US6992321B2 (en) 2001-07-13 2006-01-31 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials
US7019332B2 (en) 2001-07-20 2006-03-28 Freescale Semiconductor, Inc. Fabrication of a wavelength locker within a semiconductor structure
US6855992B2 (en) 2001-07-24 2005-02-15 Motorola Inc. Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
US20030034491A1 (en) 2001-08-14 2003-02-20 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices for detecting an object
US20030071327A1 (en) 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
US6872252B2 (en) * 2002-03-06 2005-03-29 Agilent Technologies, Inc. Lead-based perovskite buffer for forming indium phosphide on silicon
US6916717B2 (en) * 2002-05-03 2005-07-12 Motorola, Inc. Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate
US6878610B1 (en) * 2002-08-27 2005-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Relaxed silicon germanium substrate with low defect density
US7169619B2 (en) 2002-11-19 2007-01-30 Freescale Semiconductor, Inc. Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
US6885065B2 (en) 2002-11-20 2005-04-26 Freescale Semiconductor, Inc. Ferromagnetic semiconductor structure and method for forming the same
US7020374B2 (en) 2003-02-03 2006-03-28 Freescale Semiconductor, Inc. Optical waveguide structure and method for fabricating the same
US6965128B2 (en) 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
US20060214289A1 (en) * 2004-10-28 2006-09-28 Nitronex Corporation Gallium nitride material-based monolithic microwave integrated circuits
US7884740B2 (en) * 2008-03-28 2011-02-08 National Chiao Tung University Multi-lane vehicle detection apparatus
GB2517697A (en) 2013-08-27 2015-03-04 Ibm Compound semiconductor structure
JP6743816B2 (en) 2015-07-02 2020-08-19 ソニー株式会社 Vehicle control device, vehicle control method, and program
US11271566B2 (en) * 2018-12-14 2022-03-08 Integrated Device Technology, Inc. Digital logic compatible inputs in compound semiconductor circuits
TWI834365B (en) * 2022-10-28 2024-03-01 世界先進積體電路股份有限公司 Semiconductor device
WO2025168930A2 (en) * 2024-02-05 2025-08-14 Pilkington Group Limited Compound

Family Cites Families (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3670213A (en) 1969-05-24 1972-06-13 Tokyo Shibaura Electric Co Semiconductor photosensitive device with a rare earth oxide compound forming a rectifying junction
US4242595A (en) 1978-07-27 1980-12-30 University Of Southern California Tunnel diode load for ultra-fast low power switching circuits
US4424589A (en) 1980-04-11 1984-01-03 Coulter Systems Corporation Flat bed scanner system and method
US4289920A (en) 1980-06-23 1981-09-15 International Business Machines Corporation Multiple bandgap solar cell on transparent substrate
DE3168688D1 (en) 1980-11-06 1985-03-14 Toshiba Kk Method for manufacturing a semiconductor device
US4442590A (en) 1980-11-17 1984-04-17 Ball Corporation Monolithic microwave integrated circuit with integral array antenna
JPS57177583A (en) 1981-04-14 1982-11-01 Int Standard Electric Corp Holl effect device
GB2115996B (en) 1981-11-02 1985-03-20 Kramer Kane N Portable data processing and storage system
US4439014A (en) 1981-11-13 1984-03-27 Mcdonnell Douglas Corporation Low voltage electro-optic modulator
US4482422A (en) 1982-02-26 1984-11-13 Rca Corporation Method for growing a low defect monocrystalline layer on a mask
US4756007A (en) 1984-03-08 1988-07-05 Codex Corporation Adaptive communication rate modem
JPS60212018A (en) 1984-04-04 1985-10-24 Nec Corp Surface acoustic wave substrate and its manufacture
US4773063A (en) 1984-11-13 1988-09-20 University Of Delaware Optical wavelength division multiplexing/demultiplexing system
US4748485A (en) 1985-03-21 1988-05-31 Hughes Aircraft Company Opposed dual-gate hybrid structure for three-dimensional integrated circuits
JPS6263828A (en) 1985-09-06 1987-03-20 Yokogawa Electric Corp Vibration type transducer and its manufacture
US4901133A (en) 1986-04-02 1990-02-13 Texas Instruments Incorporated Multilayer semi-insulating film for hermetic wafer passivation and method for making same
US4891091A (en) 1986-07-14 1990-01-02 Gte Laboratories Incorporated Method of epitaxially growing compound semiconductor materials
US4888202A (en) 1986-07-31 1989-12-19 Nippon Telegraph And Telephone Corporation Method of manufacturing thin compound oxide film and apparatus for manufacturing thin oxide film
US4772929A (en) 1987-01-09 1988-09-20 Sprague Electric Company Hall sensor with integrated pole pieces
JPS63198365A (en) 1987-02-13 1988-08-17 Sharp Corp semiconductor equipment
US5511238A (en) 1987-06-26 1996-04-23 Texas Instruments Incorporated Monolithic microwave transmitter/receiver
JPS6414949A (en) * 1987-07-08 1989-01-19 Nec Corp Semiconductor device and manufacture of the same
DE3851668T3 (en) 1987-07-24 1999-03-04 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Compound superconducting layer.
JPH0766922B2 (en) 1987-07-29 1995-07-19 株式会社村田製作所 Method for manufacturing semiconductor device
JPH0695554B2 (en) 1987-10-12 1994-11-24 工業技術院長 Method for forming single crystal magnesia spinel film
US4885376A (en) 1987-10-13 1989-12-05 Iowa State University Research Foundation, Inc. New types of organometallic reagents and catalysts for asymmetric synthesis
US5073981A (en) 1988-01-22 1991-12-17 At&T Bell Laboratories Optical communication by injection-locking to a signal which modulates an optical carrier
US4889402A (en) 1988-08-31 1989-12-26 American Telephone And Telegraph Company, At&T Bell Laboratories Electro-optic polarization modulation in multi-electrode waveguides
US4965649A (en) 1988-12-23 1990-10-23 Ford Aerospace Corporation Manufacture of monolithic infrared focal plane arrays
US5227196A (en) 1989-02-16 1993-07-13 Semiconductor Energy Laboratory Co., Ltd. Method of forming a carbon film on a substrate made of an oxide material
US4999842A (en) 1989-03-01 1991-03-12 At&T Bell Laboratories Quantum well vertical cavity laser
US4990974A (en) 1989-03-02 1991-02-05 Thunderbird Technologies, Inc. Fermi threshold field effect transistor
US5143854A (en) 1989-06-07 1992-09-01 Affymax Technologies N.V. Large scale photolithographic solid phase synthesis of polypeptides and receptor binding screening thereof
US5504035A (en) 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
US5055445A (en) 1989-09-25 1991-10-08 Litton Systems, Inc. Method of forming oxidic high Tc superconducting materials on substantially lattice matched monocrystalline substrates utilizing liquid phase epitaxy
JPH03150218A (en) 1989-11-07 1991-06-26 Sumitomo Electric Ind Ltd Production of superconductive thin film
US5051790A (en) 1989-12-22 1991-09-24 David Sarnoff Research Center, Inc. Optoelectronic interconnections for integrated circuits
JPH088214B2 (en) 1990-01-19 1996-01-29 三菱電機株式会社 Semiconductor device
US5310707A (en) 1990-03-28 1994-05-10 Superconductivity Research Laboratory International Substrate material for the preparation of oxide superconductors
US5132648A (en) 1990-06-08 1992-07-21 Rockwell International Corporation Large array MMIC feedthrough
US5158907A (en) * 1990-08-02 1992-10-27 At&T Bell Laboratories Method for making semiconductor devices with low dislocation defects
US5281834A (en) 1990-08-31 1994-01-25 Motorola, Inc. Non-silicon and silicon bonded structure and method of manufacture
US5880452A (en) 1990-11-15 1999-03-09 Geo Labs, Inc. Laser based PCMCIA data collection system with automatic triggering for portable applications and method of use
US5273911A (en) 1991-03-07 1993-12-28 Mitsubishi Denki Kabushiki Kaisha Method of producing a thin-film solar cell
SE468267B (en) 1991-04-10 1992-11-30 Ericsson Telefon Ab L M TERMINAL FOR A FREQUENCY PART, OPTICAL COMMUNICATION SYSTEM
US5185589A (en) 1991-05-17 1993-02-09 Westinghouse Electric Corp. Microwave film bulk acoustic resonator and manifolded filter bank
US5194397A (en) 1991-06-05 1993-03-16 International Business Machines Corporation Method for controlling interfacial oxide at a polycrystalline/monocrystalline silicon interface
US5140651A (en) 1991-06-27 1992-08-18 The United States Of America As Represented By The Secretary Of The Air Force Semiconductive guided-wave programmable optical delay lines using electrooptic fabry-perot elements
DE69232236T2 (en) 1991-07-16 2002-08-08 Asahi Kasei Kogyo K.K., Osaka SEMICONDUCTOR SENSOR AND ITS MANUFACTURING METHOD
US5306649A (en) 1991-07-26 1994-04-26 Avantek, Inc. Method for producing a fully walled emitter-base structure in a bipolar transistor
EP0530972B1 (en) 1991-08-02 1997-11-05 Canon Kabushiki Kaisha Liquid crystal image display unit
DE69233314T2 (en) 1991-10-11 2005-03-24 Canon K.K. Process for the production of semiconductor products
US5208182A (en) 1991-11-12 1993-05-04 Kopin Corporation Dislocation density reduction in gallium arsenide on silicon heterostructures
US5216729A (en) 1991-11-18 1993-06-01 Harmonic Lightwaves, Inc. Active alignment system for laser to fiber coupling
DE59108800D1 (en) 1991-12-21 1997-08-28 Itt Ind Gmbh Deutsche Offset compensated Hall sensor
JP3416163B2 (en) 1992-01-31 2003-06-16 キヤノン株式会社 Semiconductor substrate and manufacturing method thereof
JP3250673B2 (en) 1992-01-31 2002-01-28 キヤノン株式会社 Semiconductor element substrate and method of manufacturing the same
US5155658A (en) 1992-03-05 1992-10-13 Bell Communications Research, Inc. Crystallographically aligned ferroelectric films usable in memories and method of crystallographically aligning perovskite films
US5270298A (en) 1992-03-05 1993-12-14 Bell Communications Research, Inc. Cubic metal oxide thin film epitaxially grown on silicon
US5326721A (en) 1992-05-01 1994-07-05 Texas Instruments Incorporated Method of fabricating high-dielectric constant oxides on semiconductors using a GE buffer layer
DE69325614T2 (en) 1992-05-01 2000-01-13 Texas Instruments Inc Oxides of high dielectric constant containing Pb / Bi using perovskites as a buffer layer which do not contain Pb / Bi
US5442561A (en) 1992-05-12 1995-08-15 Nippon Telegraph And Telephone Corporation Production management system and its application method
US5572052A (en) 1992-07-24 1996-11-05 Mitsubishi Denki Kabushiki Kaisha Electronic device using zirconate titanate and barium titanate ferroelectrics in insulating layer
US5296721A (en) 1992-07-31 1994-03-22 Hughes Aircraft Company Strained interband resonant tunneling negative resistance diode
US5602418A (en) 1992-08-07 1997-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Nitride based semiconductor device and manufacture thereof
US5314547A (en) 1992-09-28 1994-05-24 General Motors Corporation Rare earth slab doping of group III-V compounds
US5356509A (en) * 1992-10-16 1994-10-18 Astropower, Inc. Hetero-epitaxial growth of non-lattice matched semiconductors
JPH06151872A (en) 1992-11-09 1994-05-31 Mitsubishi Kasei Corp Fet device
EP0600303B1 (en) 1992-12-01 2002-02-06 Matsushita Electric Industrial Co., Ltd. Method for fabrication of dielectric thin film
US5248564A (en) 1992-12-09 1993-09-28 Bell Communications Research, Inc. C-axis perovskite thin films grown on silicon dioxide
JPH06196648A (en) 1992-12-25 1994-07-15 Fuji Xerox Co Ltd Oriented ferroelectric thin film device
JPH06303137A (en) 1992-12-29 1994-10-28 Hitachi Ltd D / A converter, offset adjusting circuit, and mobile communication terminal device using the same
US5352926A (en) 1993-01-04 1994-10-04 Motorola, Inc. Flip chip package and method of making
JP3047656B2 (en) 1993-01-12 2000-05-29 株式会社村田製作所 Method for producing InSb thin film
US5371734A (en) 1993-01-29 1994-12-06 Digital Ocean, Inc. Medium access control protocol for wireless network
JPH06338630A (en) 1993-05-28 1994-12-06 Omron Corp Semiconductor light-emitting element, and optical detector, optical information processor, optical coupler and light-emitting device using the light-emitting element
US5572040A (en) 1993-07-12 1996-11-05 Peregrine Semiconductor Corporation High-frequency wireless communication system on a single ultrathin silicon on sapphire chip
US5394489A (en) 1993-07-27 1995-02-28 At&T Corp. Wavelength division multiplexed optical communication transmitters
JP3333325B2 (en) 1993-08-26 2002-10-15 株式会社東芝 Semiconductor device, semiconductor device simulation method, and semiconductor device simulator
US5792679A (en) 1993-08-30 1998-08-11 Sharp Microelectronics Technology, Inc. Method for forming silicon-germanium/Si/silicon dioxide heterostructure using germanium implant
US5650362A (en) 1993-11-04 1997-07-22 Fuji Xerox Co. Oriented conductive film and process for preparing the same
US5549977A (en) * 1993-11-18 1996-08-27 Lucent Technologies Inc. Article comprising magnetoresistive material
JP3015656B2 (en) 1994-03-23 2000-03-06 株式会社東芝 Method and apparatus for producing semi-insulating GaAs single crystal
JP3330218B2 (en) 1994-03-25 2002-09-30 三菱電機株式会社 Semiconductor device manufacturing method and semiconductor device
US5883564A (en) 1994-04-18 1999-03-16 General Motors Corporation Magnetic field sensor having high mobility thin indium antimonide active layer on thin aluminum indium antimonide buffer layer
US5491461A (en) 1994-05-09 1996-02-13 General Motors Corporation Magnetic field sensor on elemental semiconductor substrate with electric field reduction means
US5479033A (en) 1994-05-27 1995-12-26 Sandia Corporation Complementary junction heterostructure field-effect transistor
US5589284A (en) 1994-08-01 1996-12-31 Texas Instruments Incorporated Electrodes comprising conductive perovskite-seed layers for perovskite dielectrics
US5828080A (en) * 1994-08-17 1998-10-27 Tdk Corporation Oxide thin film, electronic device substrate and electronic device
US5504183A (en) 1994-09-12 1996-04-02 Motorola Organometallic fluorescent complex polymers for light emitting applications
US5635741A (en) 1994-09-30 1997-06-03 Texas Instruments Incorporated Barium strontium titanate (BST) thin films by erbium donor doping
US5473047A (en) 1994-10-11 1995-12-05 Motorola, Inc. Soluble precursor to poly (cyanoterephthalydene) and method of preparation
US5486406A (en) 1994-11-07 1996-01-23 Motorola Green-emitting organometallic complexes for use in light emitting devices
US5519235A (en) 1994-11-18 1996-05-21 Bell Communications Research, Inc. Polycrystalline ferroelectric capacitor heterostructure employing hybrid electrodes
JPH08148968A (en) 1994-11-24 1996-06-07 Mitsubishi Electric Corp Thin film piezoelectric element
KR0148596B1 (en) 1994-11-28 1998-10-15 양승택 Superconducting field effect element with grain boundary channel and its manufacturing method
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
US5937274A (en) 1995-01-31 1999-08-10 Hitachi, Ltd. Fabrication method for AlGaIn NPAsSb based devices
US5552547A (en) 1995-02-13 1996-09-03 Shi; Song Q. Organometallic complexes with built-in fluorescent dyes for use in light emitting devices
US5610744A (en) 1995-02-16 1997-03-11 Board Of Trustees Of The University Of Illinois Optical communications and interconnection networks having opto-electronic switches and direct optical routers
US5679965A (en) 1995-03-29 1997-10-21 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same
US6088216A (en) 1995-04-28 2000-07-11 International Business Machines Corporation Lead silicate based capacitor structures
US5528067A (en) 1995-05-08 1996-06-18 Hughes Aircraft Company Magnetic field detection
WO1997001854A1 (en) 1995-06-28 1997-01-16 Bell Communication Research, Inc. Barrier layer for ferroelectric capacitor integrated on silicon
KR100193219B1 (en) 1995-07-06 1999-06-15 박원훈 Passive polarizer
US5753934A (en) * 1995-08-04 1998-05-19 Tok Corporation Multilayer thin film, substrate for electronic device, electronic device, and preparation of multilayer oxide thin film
US5551238A (en) 1995-08-23 1996-09-03 Prueitt; Melvin L. Hydro-air renewable power system
US5633724A (en) 1995-08-29 1997-05-27 Hewlett-Packard Company Evanescent scanning of biochemical array
DE69524751T2 (en) 1995-09-21 2002-08-22 Alcatel, Paris Optical gain combining arrangement and method for uplink transmission using such an arrangement
JP3523724B2 (en) 1995-09-29 2004-04-26 東芝テック株式会社 Thermal transfer color printer
US5659180A (en) 1995-11-13 1997-08-19 Motorola Heterojunction interband tunnel diodes with improved P/V current ratios
JP3645338B2 (en) 1995-12-11 2005-05-11 株式会社東芝 Nonvolatile semiconductor memory device
JP3036424B2 (en) 1996-01-12 2000-04-24 日本電気株式会社 Optical repeater with signal regeneration function
US5745631A (en) 1996-01-26 1998-04-28 Irvine Sensors Corporation Self-aligning optical beam system
FR2744578B1 (en) 1996-02-06 1998-04-30 Motorola Semiconducteurs HIGH FREQUENCY AMPLIFIER
US5833603A (en) 1996-03-13 1998-11-10 Lipomatrix, Inc. Implantable biosensing transponder
US5801072A (en) 1996-03-14 1998-09-01 Lsi Logic Corporation Method of packaging integrated circuits
US5792569A (en) 1996-03-19 1998-08-11 International Business Machines Corporation Magnetic devices and sensors based on perovskite manganese oxide materials
DE19712496A1 (en) 1996-03-26 1997-10-30 Mitsubishi Materials Corp Piezoelectric thin-film component
TW410272B (en) 1996-05-07 2000-11-01 Thermoscan Lnc Enhanced protective lens cover
EP0810666B1 (en) 1996-05-30 2004-08-25 Oki Electric Industry Co., Ltd. Non-volatile semiconductor memory cell and method for production thereof
SE518132C2 (en) 1996-06-07 2002-08-27 Ericsson Telefon Ab L M Method and apparatus for synchronizing combined receivers and transmitters in a cellular system
US5863326A (en) 1996-07-03 1999-01-26 Cermet, Inc. Pressurized skull crucible for crystal growth using the Czochralski technique
US6023082A (en) 1996-08-05 2000-02-08 Lockheed Martin Energy Research Corporation Strain-based control of crystal anisotropy for perovskite oxides on semiconductor-based material
US5746543A (en) 1996-08-20 1998-05-05 Leonard; Kenneth J. Volume control module for use in diving
US5987011A (en) 1996-08-30 1999-11-16 Chai-Keong Toh Routing method for Ad-Hoc mobile networks
US5912068A (en) 1996-12-05 1999-06-15 The Regents Of The University Of California Epitaxial oxides on amorphous SiO2 on single crystal silicon
US5864543A (en) 1997-02-24 1999-01-26 At&T Wireless Services, Inc. Transmit/receive compensation in a time division duplex system
US5872493A (en) 1997-03-13 1999-02-16 Nokia Mobile Phones, Ltd. Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror
US6211096B1 (en) 1997-03-21 2001-04-03 Lsi Logic Corporation Tunable dielectric constant oxide and method of manufacture
FR2761811B1 (en) 1997-04-03 1999-07-16 France Telecom ENGRAVING-FREE TECHNOLOGY FOR INTEGRATING COMPONENTS
ATE550461T1 (en) 1997-04-11 2012-04-15 Nichia Corp GROWTH METHOD FOR A NITRIDE SEMICONDUCTOR
US6150239A (en) 1997-05-31 2000-11-21 Max Planck Society Method for the transfer of thin layers monocrystalline material onto a desirable substrate
KR100243294B1 (en) 1997-06-09 2000-02-01 윤종용 Ferroelectric memory cell &array in semiconductor device
US5963291A (en) 1997-07-21 1999-10-05 Chorum Technologies Inc. Optical attenuator using polarization modulation and a feedback controller
US6078717A (en) 1997-07-22 2000-06-20 Fuji Xerox Co., Ltd. Opical waveguide device
US5962069A (en) 1997-07-25 1999-10-05 Symetrix Corporation Process for fabricating layered superlattice materials and AB03 type metal oxides without exposure to oxygen at high temperatures
US5907792A (en) 1997-08-25 1999-05-25 Motorola,Inc. Method of forming a silicon nitride layer
JP4221765B2 (en) 1997-08-29 2009-02-12 ソニー株式会社 Optical integrated oxide device and method for manufacturing optical integrated oxide device
US6002375A (en) 1997-09-02 1999-12-14 Motorola, Inc. Multi-substrate radio-frequency circuit
US6265749B1 (en) 1997-10-14 2001-07-24 Advanced Micro Devices, Inc. Metal silicide transistor gate spaced from a semiconductor substrate by a ceramic gate dielectric having a high dielectric constant
US6197503B1 (en) 1997-11-26 2001-03-06 Ut-Battelle, Llc Integrated circuit biochip microsystem containing lens
US6049702A (en) * 1997-12-04 2000-04-11 Rockwell Science Center, Llc Integrated passive transceiver section
JP3092659B2 (en) 1997-12-10 2000-09-25 日本電気株式会社 Thin film capacitor and method of manufacturing the same
EP0926739A1 (en) 1997-12-24 1999-06-30 Texas Instruments Incorporated A structure of and method for forming a mis field effect transistor
US6011646A (en) 1998-02-20 2000-01-04 The Regents Of The Unviersity Of California Method to adjust multilayer film stress induced deformation of optics
CA2268997C (en) 1998-05-05 2005-03-22 National Research Council Of Canada Quantum dot infrared photodetectors (qdip) and methods of making the same
JPH11330411A (en) 1998-05-13 1999-11-30 Matsushita Electric Ind Co Ltd Semiconductor memory device and method of manufacturing the same
US6055179A (en) 1998-05-19 2000-04-25 Canon Kk Memory device utilizing giant magnetoresistance effect
FI108583B (en) 1998-06-02 2002-02-15 Nokia Corp resonator structures
JPH11354820A (en) 1998-06-12 1999-12-24 Sharp Corp Photoelectric conversion element and method for manufacturing the same
US6191011B1 (en) 1998-09-28 2001-02-20 Ag Associates (Israel) Ltd. Selective hemispherical grain silicon deposition
US6252261B1 (en) 1998-09-30 2001-06-26 Nec Corporation GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor
TW399309B (en) 1998-09-30 2000-07-21 World Wiser Electronics Inc Cavity-down package structure with thermal via
US6343171B1 (en) 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
JP3592553B2 (en) 1998-10-15 2004-11-24 株式会社東芝 Gallium nitride based semiconductor device
US6255198B1 (en) 1998-11-24 2001-07-03 North Carolina State University Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
US6241821B1 (en) 1999-03-22 2001-06-05 Motorola, Inc. Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
US6248459B1 (en) 1999-03-22 2001-06-19 Motorola, Inc. Semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
US6107721A (en) 1999-07-27 2000-08-22 Tfr Technologies, Inc. Piezoelectric resonators on a differentially offset reflector
US6291319B1 (en) 1999-12-17 2001-09-18 Motorola, Inc. Method for fabricating a semiconductor structure having a stable crystalline interface with silicon
US6479173B1 (en) 1999-12-17 2002-11-12 Motorola, Inc. Semiconductor structure having a crystalline alkaline earth metal silicon nitride/oxide interface with silicon
US6268269B1 (en) 1999-12-30 2001-07-31 United Microelectronics Corp. Method for fabricating an oxide layer on silicon with carbon ions introduced at the silicon/oxide interface in order to reduce hot carrier effects
US6392257B1 (en) * 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
US20010013313A1 (en) 2000-02-10 2001-08-16 Motorola, Inc. Apparatus for fabricating semiconductor structures and method of forming the structures
US6313486B1 (en) 2000-06-15 2001-11-06 Board Of Regents, The University Of Texas System Floating gate transistor having buried strained silicon germanium channel layer
US20020008234A1 (en) 2000-06-28 2002-01-24 Motorola, Inc. Mixed-signal semiconductor structure, device including the structure, and methods of forming the device and the structure
US6224669B1 (en) 2000-09-14 2001-05-01 Motorola, Inc. Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon

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